Die Bonder

US$100,000.00-300,000.00 / Piece

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High Precision Solid Crystal Mounting Machine for Multi Chip Packaging pictures & photos

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What is High Precision Solid Crystal Mounting Machine for Multi Chip Packaging

Name: High Precision Solid Crystal Mounting Machine for Multi Chip Packaging
Uploaded: 2023-11-27T08:48:54+08:00
Description: Product Description The DU9721 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding

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About this Item

Price

Min. Order Reference FOB Price

1 Piece US$100,000.00-300,000.00 / Piece

Sepcifications

After-sales Service 7*24 Hour After-Sales Service
Condition New
Speed High Speed
Precision High Precision
Certification ISO, CE
Warranty 12 Months
Automatic Grade Automatic
Type High-speed Chip Mounter
Transport Package Wooden Crates and Vacuum Wooden Crates
Specification 1160mm*1225mm*1800mm
Trademark Suzhou Bozhon Semiconductor Co
Origin China
Binding Force 10~7,500 G (Programmable)
Uph 7000(Max)
X/Y Placement Accuracy ± 7µm @ 3σ
Theta Placement Accuracy ±0.15°@ 3σ
Bonding Head Heatingtemperatur up to 350 °c (Optional)

Product Description

Product Description The DU9721 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy of ±7@3σ microns and can achieve an ultimate bonding efficiency of up ...

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Suzhou Bozhon Semiconductor Co., Ltd

Gold Member Since 2023

Audited Supplier

Business Type Manufacturer/Factory & Trading Company
Main Products Fully Automatic High Precision Die, AOI Inspection Machine, High-speed High-precision Die Bonder, Wafer Cleaning System
Number of Employees 80
Year of Establishment 2022-01-21
Management System Certification ISO 9001
Average Lead Time Peak Season Lead Time: 1-3 months
Off Season Lead Time: 1-3 months

Die Bonder Comparison

	Quick View High Precision Solid Crystal Mounting Machine for Multi Chip Packaging Contact Now	Quick View Automatic SMD Assembly Production Line with Pick Place Machine, Stencil Printer and Reflow Oven Contact Now	Quick View Low Cost High Precision Pick and Place Machine Neoden4+ Reflow Oven T5 Contact Now	Quick View SMT Pick and Place Machine with 2 Heads Neoden3V for Start-up Company PCB Assembly Contact Now	Quick View Chip Mounter Neoden3V with 2 SMT Nozzle Placement Head for PCB Assembly Line Contact Now

Transaction Info
	Quick View High Precision Solid Crystal Mounting Machine for Multi Chip Packaging Contact Now	Quick View Automatic SMD Assembly Production Line with Pick Place Machine, Stencil Printer and Reflow Oven Contact Now	Quick View Low Cost High Precision Pick and Place Machine Neoden4+ Reflow Oven T5 Contact Now	Quick View SMT Pick and Place Machine with 2 Heads Neoden3V for Start-up Company PCB Assembly Contact Now	Quick View Chip Mounter Neoden3V with 2 SMT Nozzle Placement Head for PCB Assembly Line Contact Now
Price	US $ 100,000.00-300,000.00/ Piece	US $ 4,999.00-6,148.00/ Piece	US $ 9,198.00-11,198.00/ Set	US $ 4,499.00-4,999.00/ Set	US $ 4,499.00-4,999.00/ Set
Min Order	1 Pieces	1 Pieces	1 Sets	1 Sets	1 Sets
Trade Terms	-	FOB, CFR, CIF, EXW	FOB, CFR, CIF, EXW	FOB, CFR, CIF, EXW	FOB, CFR, CIF, EXW
Payment Terms	T/T	T/T, Paypal	T/T, D/P, Western Union, Paypal, Money Gram	T/T, Paypal	T/T, Paypal
Quality Control
Product Certification	ISO, CE	ISO, CE	ISO, CE	ISO, CE	ISO, CE
Management System Certification	ISO 9001	ISO 9001, ISO 9000, ISO 20000, ISO 14064, QC 080000	ISO 9001, ISO 9000, ISO 20000, ISO 14064, QC 080000	ISO 9001, ISO 9000, ISO 20000, ISO 14064, QC 080000	ISO 9001, ISO 9000, ISO 20000, ISO 14064, QC 080000
Trade Capacity
Export Markets	Domestic	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	Own Brand	ODM, Own Brand	ODM, Own Brand	ODM, Own Brand	ODM, Own Brand
Average Lead Time	-	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	After-sales Service: 724 Hour After-Sales Service;* Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Binding Force: 10~7,500 G (Programmable); Uph: 7000(Max); X/Y Placement Accuracy: ± 7µm @ 3σ; Theta Placement Accuracy: ±0.15°@ 3σ; Bonding Head Heatingtemperatur: up to 350 °c (Optional);	Condition: New; Speed: Medium Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Components Supply Configuration: Tape Reel, Bulk Package (IC); Tape Width: 8mm, 12mm, 16mm; Feeders: 8mm=18PCS, 12mm=4PCS, 16mm=1PCS, Bulk IC=10PC); Vacuum Pump Qty: 3(Built-in); Applicable Components: 0402-5050, Sop, IC; Max Mounting Size: 320X360mm, 320X410mm; Max Mounting Capability: 5000cph; Max Applicable Height: 5mm;	Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 24 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Components Supply Configuration: Tape Reel, Bulk Package (IC); Tape Width: 8mm, 12mm, 16mm,24mm; Placement Head Qty: 4PCS; Power Supply: 220V, Convertible to 110V; Positioning Accuracy: +/-0.02mm; Component Height Maximum: 5mm; X-Y Repeatability: +/-0.02mm; Applicable PCB Area: 350mm400mm;* Main Control: Gui; Power: 180W;	Condition: New; Speed: Medium Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Type: Medium-speed Chip Mounter; Components Supply Configuration: Tape Reel, Bulk Package (IC); Tape Width: 8mm, 12mm, 16mm; Feeder Qty: 23PCS or 42PCS; Applicable Components: 0402-5050, Lead Pitch IC; Max Mounting Size: 320X360mm--320X410mm; Max Mounting Capability: 5000cph; Placement Head Qty: 2PCS; Power Supply: 220V, Convertible to 110V; Max Mounting Height: 5mm;	Condition: New; Speed: Medium Speed; Warranty: 12 Months; Automatic Grade: Automatic; Type: Medium-speed Chip Mounter; Components Supply Configuration: Tape Reel, Bulk Package (IC); Tape Width: 8mm, 12mm, 16mm; Feeders: 8mm=18PCS, 12mm=4PCS, 16mm=1PCS, Bulk IC=10; Vacuum Pump Qty: 2(Built-in); Applicable Components: 0402-5050, Sop, IC; Max Mounting Size: 320360mm, 320410mm; Max Mounting Capability: 5000cph; Placement Head Qty: 2PCS; Power Supply: 220V, Convertible to 110V; Max Mounting Height: 5mm;
Supplier Name	Suzhou Bozhon Semiconductor Co., Ltd	Zhejiang NeoDen Technology Co., Ltd.	Zhejiang NeoDen Technology Co., Ltd.	Zhejiang NeoDen Technology Co., Ltd.	Zhejiang NeoDen Technology Co., Ltd.
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