High Precision
US$100,000.00-200,000.00 / Piece
View
  • Recommend for you
  • What is Submicron Placement Accuracy Attach Equipment
  • What is Fully Automatic Submicron Level Eutectic Laser Heating Can Adapt to Small Devices
  • What is Domestic Bozhong Semiconductor Fully Automatic, High-Precision, and Multifunctional Eutectic Machine Equipment

What is Used High Quality Speedline Micron Level Epoxy Die Bonding /Attach Machine

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$100,000.00-200,000.00 / Piece

Sepcifications

  • After-sales Service 7*24 Hour After-Sales Service
  • Condition New
  • Speed High Speed
  • Precision High Precision
  • Warranty 12 Months
  • Automatic Grade Automatic
  • Type High-speed Chip Mounter
  • Transport Package Wooden Crates and Vacuum Wooden Crates
  • Specification 1160mm*1225mm*1800mm
  • Trademark Suzhou Bozhon Semiconductor Co
  • Origin Drug Solution
  • Binding Force 500 N (Max)
  • Wafer Size Wafer Size: 8" - 12" (4", 6" Customizable)
  • Substrate Type Fr4, Ceramic, Flex, Boat, 8"/12" Wafers, Othe
  • Uph up to 10,000 Pieces Per Hour (Max)

Product Description

Product Description The DW9621 Series of die bonders is a high-speed machine designed for high-bonding force applications. With a self-developed force control system, it achieves high-precision die bonding with an accuracy of ±10 microns and an ultimate bonding force of up to 500N and an ...

Learn More

High Precision Comparison
Transaction Info
Price US $ 100,000.00-200,000.00/ Piece US $ 15000/ Piece US $ 26000/ Piece US $ 80,000.00-100,000.00/ Set US $ 80,000.00-84,000.00/ Set
Min Order 1 Pieces 1 Pieces 1 Pieces 1 Set 1 Set
Trade Terms - FOB, CFR, CIF, EXW FOB FOB FOB
Payment Terms T/T T/T L/C, T/T, Western Union, Money Gram L/C, T/T, D/P, Western Union, Paypal L/C, T/T, Western Union, Paypal, Money Gram
Quality Control
Product Certification - CCC, ISO, CE CE ISO, CE CCC, FDA, ISO, CE, FCC, VDE, CCS, Lr
Management System Certification ISO 9001 ISO 9001 ISO 9001, ISO 14000, LEED, ISO 17025 ISO 9001, ISO 14000, LEED, ISO 17025 ISO 9001, ISO 14000, LEED, ISO 17025
Trade Capacity
Export Markets Domestic North America, South America, Europe, Southeast Asia/ Mideast North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model Own Brand OEM Own Brand Own Brand Own Brand
Average Lead Time - Off-season: within 15 Day(s)
Peak-season: 1 Month(s)
Off-season: within 15 Day(s)
Peak-season: 1 Month(s)
Off-season: within 15 Day(s)
Peak-season: 1 Month(s)
Off-season: within 15 Day(s)
Peak-season: 1 Month(s)
Product Attributes
Specification
After-sales Service: 7*24 Hour After-Sales Service;
Condition: New;
Speed: High Speed;
Precision: High Precision;
Warranty: 12 Months;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Binding Force: 500 N (Max);
Wafer Size: Wafer Size: 8" - 12" (4", 6" Customizable);
Substrate Type: Fr4, Ceramic, Flex, Boat, 8"/12" Wafers, Othe;
Uph: up to 10,000 Pieces Per Hour (Max);
After-sales Service: Online Service;
Condition: New;
Speed: High Speed;
Precision: Normal Precision;
Warranty: 12 Months;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Placement Speed: 35000cph;
Place Accuracy: ±0.05mm;
Dimension of PCB: 60X60-1200X350mm;
The Thickness of PCB: 1-4mm;
Condition: New;
Speed: High Speed;
Precision: High Precision;
Warranty: 12 Months;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Product Name: LED Pick and Place Machine;
Placement Speed: 46000cph;
Usage: SMT, SMD, LED, PCB, PCBA;
Head Number: 1;
Nozzle Number: 8;
Placement Accuracy: +/-50 μm;
Component Range: 0603~8520 Chip, LED Chip;
Feeder Inputs: 20PCS;
Dimension (L*W*H: 2050*1200*1400;
Weight: Approx.950kg;
Condition: New;
Speed: High Speed;
Precision: High Precision;
Warranty: 12 Months;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Product Name: SMT Pick and Place Machine;
Dimension(L*D*H): 1650*1680*1530mm;
Placement Speed: 40000cph;
Applicable Parts: 0402 ~ 55mm(H 15mm);
Applicable PCB: Max. 460(L) X400(W)(Standard);
Waaranty: 1 Year;
Brand: Samsung;
Numbers of Spindles: 6 Spindles × 1 Gantry;
Usage: SMT Production Line;
Packing: Wooden Case;
Condition: New;
Speed: Super High Speed;
Precision: High Precision;
Warranty: 18 Months;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Product Name: Samsung Pick and Place Machine 482 Plus;
Placement Speed: 40000cph;
Usage: SMT, SMD, LED, PCB, PCBA;
Power Supply: AC220V 50Hz / AC110V 60Hz;
Air Consumption: 0.5 ~ 0.7MPa(5 ~ 7kgf/Cm2);
Dimension: 1650(L)*1680(D)*1530(H);
Weight: 1600kg;
Feeder: 120 Pieces;
PCB Thickness: 0.38-4.2mm;
Max. Component Height: 10mm(Option 15mm);
Supplier Name

Suzhou Bozhon Semiconductor Co., Ltd

China Supplier - Gold Member Audited Supplier

Shenzhen Jaguar Automation Equipment Co., Ltd.

China Supplier - Gold Member Audited Supplier

Dongguan ICT Technology Co.,Ltd.

China Supplier - Diamond Member Audited Supplier

Dongguan ICT Technology Co.,Ltd.

China Supplier - Diamond Member Audited Supplier

Dongguan ICT Technology Co.,Ltd.

China Supplier - Diamond Member Audited Supplier