Die Bonding
US$250,000.00-450,000.00 / Piece
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What is China Die Attach Machine for Chip Packaging

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$250,000.00-450,000.00 / Piece

Sepcifications

  • After-sales Service 7*24 Hour After-Sales Service
  • Condition New
  • Speed Medium Speed
  • Precision High Precision
  • Warranty 12 Months
  • Automatic Grade Automatic
  • Type High-speed Chip Mounter
  • Transport Package Wooden Crates and Vacuum Wooden Crates
  • Specification 1900mm*1100mm*1800mm
  • Trademark Suzhou Bozhon Semiconductor Co
  • Origin China
  • Placement Process Eutectic, Underfill
  • Equipment Application Coc,COB,Gold Box,Cow,Cos
  • Nozzle 12 Nozzles Per Single Head, Dynamictool Chan
  • Workbench 2
  • Wafer 6 Inch, Supports up to 4 Piece
  • Waffle Pack Gel-Pak 2 Inch, Supports up to 2 Pieces

Product Description

Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields ...

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Die Bonding Comparison
Transaction Info
Price US $ 250,000.00-450,000.00/ Piece US $ 14999/ Set US $ 7499/ Set US $ 14999/ Set US $ 7,499.00-9,997.00/ Set
Min Order 1 Pieces 1 Sets 1 Sets 1 Sets 1 Sets
Trade Terms - - - - -
Payment Terms T/T T/T, Western Union, Paypal T/T, Paypal T/T, Western Union, Paypal T/T, Paypal
Quality Control
Product Certification - CE ISO, CE CE ISO, CE
Management System Certification ISO 9001 ISO 9001, ISO 9000, ISO 20000, ISO 14064, QC 080000 ISO 9001, ISO 9000, ISO 20000, ISO 14064, QC 080000 ISO 9001, ISO 9000, ISO 20000, ISO 14064, QC 080000 ISO 9001, ISO 9000, ISO 20000, ISO 14064, QC 080000
Trade Capacity
Export Markets Domestic North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model Own Brand ODM, Own Brand ODM, Own Brand ODM, Own Brand ODM, Own Brand
Average Lead Time - Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
After-sales Service: 7*24 Hour After-Sales Service;
Condition: New;
Speed: Medium Speed;
Precision: High Precision;
Warranty: 12 Months;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Placement Process: Eutectic, Underfill;
Equipment Application: Coc,COB,Gold Box,Cow,Cos;
Nozzle: 12 Nozzles Per Single Head, Dynamictool Chan;
Workbench: 2;
Wafer: 6 Inch, Supports up to 4 Piece;
Waffle Pack Gel-Pak: 2 Inch, Supports up to 2 Pieces;
Condition: New;
Speed: High Speed;
Precision: High Precision;
Warranty: 24 Months;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Head Qty: 8;
Feeder Qty: 65;
Component Range: 0201, 0402, BGA, Qfn, Tqfp;
Max. PCB Size: 540*300mm (Under Single Phase);
Accuracy: 0.01mm;
Power: 500W;
Air Supply: >0.6MPa;
After-sales Service: 2 Years Warranty;
Condition: New;
Speed: High Speed;
Precision: Precision;
Warranty: 24 Months;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Components Supply Configuration: Tape Reel, Bulk Package (IC);
Tape Width: 8mm, 12mm, 16mm,24mm;
Feeders Qty: 48;
Placement Head Qty: 4;
Positioning Accuracy: +/-0.02mm;
X/Y Repeatability: +/-0.02;
Applicable PCB Area: 270*1500mm;
Resolution X/Y Axis: 0.01mm;
Component Height: 5mm;
Main Control: Gui;
After-sales Service: 2 Years Warranty;
Condition: New;
Speed: High Speed;
Precision: High Precision;
Warranty: 24 Months;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Head Qty: 8;
Feeder Qty: 65;
Component Range: 0201, 0402, BGA, Qfn, Tqfp;
Max. PCB Size: 540*300mm (Under Single Phase);
Accuracy: 0.01mm;
Power: 500W;
Air Supply: >0.6MPa;
After-sales Service: 2 Years Warranty;
Condition: New;
Speed: High Speed;
Precision: Precision;
Warranty: 24 Months;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Components Supply Configuration: Tape Reel, Bulk Package (IC);
Tape Width: 8mm, 12mm, 16mm,24mm;
Feeders Qty: 48;
Placement Head Qty: 4;
Positioning Accuracy: +/-0.02mm;
X/Y Repeatability: +/-0.02;
Applicable PCB Area: 270*1500mm;
Resolution X/Y Axis: 0.01mm;
Component Height: 5mm;
Main Control: Gui;
Supplier Name

Suzhou Bozhon Semiconductor Co., Ltd

China Supplier - Gold Member Audited Supplier

Zhejiang NeoDen Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Zhejiang NeoDen Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Zhejiang NeoDen Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Zhejiang NeoDen Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier