Die Bonder

US$100,000.00-300,000.00 / Piece

View

Submikron Semiconductor Die Bonding & Die Solder Machines pictures & photos

Recommend for you
What is High Precision Submicron Placement Accuracy Eutectic Die Attach Machine with Multiple Intermediate Stations
What is High Precision R&D Using Small Die Bonder Can Reach Die Bonder
What is High Precision Die Bonding with Eutectic and Epoxy Machine China

What is Submikron Semiconductor Die Bonding & Die Solder Machines

Name: Submikron Semiconductor Die Bonding & Die Solder Machines
Uploaded: 2023-10-09T10:39:13+08:00
Description: Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading produ

Contact Now

Get Latest Price

About this Item

Price

Min. Order Reference FOB Price

1 Piece US$100,000.00-300,000.00 / Piece

Sepcifications

After-sales Service 7*24 Hour After-Sales Service
Condition New
Speed High Speed
Precision High Precision
Certification ISO, CE
Warranty 24 Months
Type High-speed Chip Mounter
Transport Package Wooden Crates and Vacuum Wooden
Specification 1900mm*1100mm*1800mm
Trademark Suzhou Bozhon Semiconductor Co
Origin China
Equipment Applications Coc, COB, Gold Box, Cow, Cos
Weights 2200kg
Nozzle 12 Nozzles Per Head, with Dynamic Tool Change
Working Table 2
Transfer Table up to 8 Working Tables (Per Machine)
Temperature Range up to 500°c (Maximum)
Temperature Rising Rate 50°c/S (Maximum)
Product Model Ef8621
Nitrogen 0.4~0.7MPa

Product Description

Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High Efficiency: Dynamic tool changing, dual intermediate shaft, high-efficiency ...

Learn More

Suzhou Bozhon Semiconductor Co., Ltd

Gold Member Since 2023

Audited Supplier

Business Type Manufacturer/Factory & Trading Company
Main Products Fully Automatic High Precision Die, AOI Inspection Machine, High-speed High-precision Die Bonder, Wafer Cleaning System
Number of Employees 80
Year of Establishment 2022-01-21
Management System Certification ISO 9001
Average Lead Time Peak Season Lead Time: 1-3 months
Off Season Lead Time: 1-3 months

Die Bonder Comparison

	Quick View Submikron Semiconductor Die Bonding & Die Solder Machines Contact Now	Quick View High Accuracy SMT PCB Assembly Pick and Place Machine for IC Qfn 0201 Placement Production Line with 6 Heads 53 Feeders Contact Now	Quick View Solder Paste SMT High Quality PCB Assembly Contact Now	Quick View High Speed LED SMD Pick and Place Assembly Machine PCB Production Line with 8 Heads 66 Feeders for BGA Qfn Placement Contact Now	Quick View SMT Production Line Desktop Pick and Place Machine Contact Now

Transaction Info
	Quick View Submikron Semiconductor Die Bonding & Die Solder Machines Contact Now	Quick View High Accuracy SMT PCB Assembly Pick and Place Machine for IC Qfn 0201 Placement Production Line with 6 Heads 53 Feeders Contact Now	Quick View Solder Paste SMT High Quality PCB Assembly Contact Now	Quick View High Speed LED SMD Pick and Place Assembly Machine PCB Production Line with 8 Heads 66 Feeders for BGA Qfn Placement Contact Now	Quick View SMT Production Line Desktop Pick and Place Machine Contact Now
Price	US $ 100,000.00-300,000.00/ Piece	US $ 13999/ Set	US $ 19,999.00-21,999.00/ Set	US $ 14999/ Set	US $ 19,999.00-21,999.00/ Set
Min Order	1 Pieces	1 Sets	1 Sets	1 Sets	1 Sets
Trade Terms	-	-	-	-	-
Payment Terms	T/T	T/T, Western Union, Paypal	L/C, T/T	T/T, Western Union, Paypal	L/C, T/T
Quality Control
Product Certification	ISO, CE	CE	ISO, CE	CE	ISO, CE
Management System Certification	ISO 9001	ISO 9001, ISO 9000, ISO 20000, ISO 14064, QC 080000	ISO 9001, ISO 14001	ISO 9001, ISO 9000, ISO 20000, ISO 14064, QC 080000	ISO 9001, ISO 14001
Trade Capacity
Export Markets	Domestic	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, Europe, East Asia(Japan/ South Korea)	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, Europe, East Asia(Japan/ South Korea)
Annual Export Revenue	-	-	-	-	-
Business Model	Own Brand	ODM, Own Brand	Own Brand	ODM, Own Brand	Own Brand
Average Lead Time	-	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	-	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	-
Product Attributes
Specification	After-sales Service: 724 Hour After-Sales Service;* Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 24 Months; Type: High-speed Chip Mounter; Equipment Applications: Coc, COB, Gold Box, Cow, Cos; Weights: 2200kg; Nozzle: 12 Nozzles Per Head, with Dynamic Tool Change; Working Table: 2; Transfer Table: up to 8 Working Tables (Per Machine); Temperature Range: up to 500°c (Maximum); Temperature Rising Rate: 50°c/S (Maximum); Product Model: Ef8621; Nitrogen: 0.4~0.7MPa;	After-sales Service: 2 Years Warranty; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 24 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Head Qty: 6; Feeder Qty: 53; Component Range: 0201, 0402, BGA, Qfn, Tqfp; Max PCB Size: 300mm800mm;* Accuracy: 0.01mm; Power: 500W; Air Supply: >0.6MPa;	After-sales Service: All Life; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Accuracy: 0.05mm; Max PCB Size: 400350mm;* Placing Speed: 3500cph; Max Printing Size: 400350mm;* Max Moving Range: 400630mm;* Z Axis Max Moving Range: 70mm; Typical Mounting Speed: 2000-2800cph; Power Supply: 220V, 50Hz, 3kw; Mounting Accuracy: +/-0.05mm; Weight: 310kg;	After-sales Service: 2 Years Warranty; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 24 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Head Qty: 8; Feeder Qty: 65; Component Range: 0201, 0402, BGA, Qfn, Tqfp; Max. PCB Size: 540300mm (Under Single Phase);* Accuracy: 0.01mm; Power: 500W; Air Supply: >0.6MPa;	After-sales Service: All Life; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Accuracy: 0.05mm; Max PCB Size: 400350mm;* Placing Speed: 3500cph; Max Printing Size: 400350mm;* Max Moving Range: 400630mm;* Z Axis Max Moving Range: 70mm; Typical Mounting Speed: 2000-2800cph; Power Supply: 220V, 50Hz, 3kw; Mounting Accuracy: +/-0.05mm; Weight: 310kg;
Supplier Name	Suzhou Bozhon Semiconductor Co., Ltd	Zhejiang NeoDen Technology Co., Ltd.	Termway (Beijing) Precision Technology Co., Ltd.	Zhejiang NeoDen Technology Co., Ltd.	Termway (Beijing) Precision Technology Co., Ltd.
Select All

Contact Now

Hot Search