Die Bonding

US$250,000.00-450,000.00 / Piece

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High End Die Bonder Equipment to Assist in Semiconductor Packaging pictures & photos

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What is High End Die Bonder Equipment to Assist in Semiconductor Packaging

Name: High End Die Bonder Equipment to Assist in Semiconductor Packaging
Uploaded: 2023-12-11T08:58:40+08:00
Description: Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Det

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Price

Min. Order Reference FOB Price

1 Piece US$250,000.00-450,000.00 / Piece

Sepcifications

After-sales Service 7*24 Hour After-Sales Service
Condition New
Speed Medium Speed
Precision High Precision
Certification ISO, CE
Warranty 12 Months
Automatic Grade Automatic
Type High-speed Chip Mounter
Transport Package Wooden Crates and Vacuum Wooden Crates
Specification 1900mm*1100mm*1800mm
Trademark Suzhou Bozhon Semiconductor Co
Origin China
Placement Process Eutectic, Underfill
Equipment Application Coc,COB,Gold Box,Cow,Cos
Nozzle 12 Nozzles Per Single Head, Dynamictool Chan
Workbench 2
Wafer 6 Inch, Supports up to 4 Piece
Waffle Pack Gel-Pak 2 Inch, Supports up to 2 Pieces

Product Description

Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields ...

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Suzhou Bozhon Semiconductor Co., Ltd

Gold Member Since 2023

Audited Supplier

Business Type Manufacturer/Factory & Trading Company
Main Products Fully Automatic High Precision Die, AOI Inspection Machine, High-speed High-precision Die Bonder, Wafer Cleaning System
Number of Employees 80
Year of Establishment 2022-01-21
Management System Certification ISO 9001
Average Lead Time Peak Season Lead Time: 1-3 months
Off Season Lead Time: 1-3 months

Die Bonding Comparison

	Quick View High End Die Bonder Equipment to Assist in Semiconductor Packaging Contact Now	Quick View Automatic Pick+ Place Equipment Contact Now	Top Speed Pick and Place Machine for 1200mm LED Lamp Contact Now	Quick View Desktop Pick and Place Machine for 0402 SMD-3000cph Contact Now	2023 China Best-Selling Pick and Place Machine LED Bulb Assemble Line Contact Now

Transaction Info
	Quick View High End Die Bonder Equipment to Assist in Semiconductor Packaging Contact Now	Quick View Automatic Pick+ Place Equipment Contact Now	Top Speed Pick and Place Machine for 1200mm LED Lamp Contact Now	Quick View Desktop Pick and Place Machine for 0402 SMD-3000cph Contact Now	2023 China Best-Selling Pick and Place Machine LED Bulb Assemble Line Contact Now
Price	US $ 250,000.00-450,000.00/ Piece	US $ 15,999.00-18,999.00/ Piece	US $ 35,999.00-39,999.00/ Piece	US $ 15,699.00-19,999.00/ Piece	US $ 19,714.00-22,571.00/ Piece
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Trade Terms	-	FOB, CIF, CPT, FCA, EXW	FOB, CFR, CIF	FOB, CFR, CIF	FOB, CFR, CIF
Payment Terms	T/T	T/T	L/C, T/T	T/T	L/C, T/T
Quality Control
Product Certification	ISO, CE	ISO, CE	ISO, CE	CCC, ISO, CE, ISO9001	CCC, ISO, CE, ISO9001
Management System Certification	ISO 9001	ISO 9001, ISO 14001	ISO 9001, ISO 14001	ISO 9001, ISO 14001	ISO 9001, ISO 14001
Trade Capacity
Export Markets	Domestic	North America, Europe, East Asia(Japan/ South Korea)	North America, Europe, East Asia(Japan/ South Korea)	North America, Europe, East Asia(Japan/ South Korea)	North America, Europe, East Asia(Japan/ South Korea)
Annual Export Revenue	-	-	-	-	-
Business Model	Own Brand	Own Brand	Own Brand	Own Brand	Own Brand
Average Lead Time	-	-	-	-	-
Product Attributes
Specification	After-sales Service: 724 Hour After-Sales Service;* Condition: New; Speed: Medium Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Placement Process: Eutectic, Underfill; Equipment Application: Coc,COB,Gold Box,Cow,Cos; Nozzle: 12 Nozzles Per Single Head, Dynamictool Chan; Workbench: 2; Wafer: 6 Inch, Supports up to 4 Piece; Waffle Pack Gel-Pak: 2 Inch, Supports up to 2 Pieces;	Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 24 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Component Available: SMD Capacitor and Resistor 0402 and IC (Below 20mm; Repeating Accuracy: 0.06mm; Typical Mounting Speed: 2500-3000cph; Placing Speed: 2000-2800cph;	Condition: New; Speed: Super High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Dimension: 2600×760×1500mm; Weight: 760kg; Power Supply: 220V, 50Hz, 4.5kw;	Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 18 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Max PCB Size: 300X200mm; Mounting Speed: 2600-3000cph; Repeat Accuracy: ±0.05mm; Positioning Way: Visional Position+ Machinery Position; Component Available: 0603, 0805,1206 etc and Sop, Soic (Size Under 151;* Program Way: Software Program Input; Driving Mode: Use Industrial Synchronous Belt to Drive; Automatic Feeder: 8mm,12mm,16mm,24mm Feeder Can Choose; Feeder Num: Can Set 50 PCS of 8mm Feeder; IC Plate Num: More Than 1;	After-sales Service: 1 Year; Condition: New; Speed: Medium Speed; Precision: High Precision; Warranty: 24 Months; Automatic Grade: Automatic; Type: Medium-speed Chip Mounter; Mounting Head: 8 Head; Max PCB Size: 1200350 Mm;* Mounting Speed: 14000-18000cph; Positioning Way: Visual Camera Position; Component Available: Above 0603, Sop,Sot, LED Chip; Repeat Accuracy: ±0.05 Mm; Automatic Feeder: 8mm,12mm,16mm,24mm Feeder; Feeder Num: 8 PCS of Gf Series Feeder Can Be Set; Dismension: 2600×760×1500mm; Weight: 700kg;
Supplier Name	Suzhou Bozhon Semiconductor Co., Ltd	Termway (Beijing) Precision Technology Co., Ltd.	Termway (Beijing) Precision Technology Co., Ltd.	Termway (Beijing) Precision Technology Co., Ltd.	Termway (Beijing) Precision Technology Co., Ltd.
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