Die Bonder

US$100,000.00-300,000.00 / Set

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High Precision Eutectic Machine for Semiconductor Chips pictures & photos

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What is High Precision Eutectic Machine for Semiconductor Chips

Name: High Precision Eutectic Machine for Semiconductor Chips
Uploaded: 2023-12-05T09:02:17+08:00
Description: Product Description The DU9721 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding

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About this Item

Price

Min. Order Reference FOB Price

1 Set US$100,000.00-300,000.00 / Set

Sepcifications

Condition New
Speed High Speed
Precision High Precision
Certification ISO, CE
Warranty 12 Months
Automatic Grade Automatic
Type High-speed Chip Mounter
Transport Package Wooden Crates and Vacuum Wooden Crates
Specification 1160mm*1225mm*1800mm
Trademark Suzhou Bozhon Semiconductor Co
Origin China
Binding Force 10~7,500 G (Programmable)
Uph 7000(Max)
X/Y Placement Accuracy ± 7µm @ 3σ
Theta Placement Accuracy ±0.15°@ 3σ
Bonding Head Heatingtemperatur up to 350 °c (Optional)

Product Description

Product Description The DU9721 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy of ±7@3σ microns and can achieve an ultimate bonding efficiency of up ...

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Suzhou Bozhon Semiconductor Co., Ltd

Gold Member Since 2023

Audited Supplier

Business Type Manufacturer/Factory & Trading Company
Main Products Fully Automatic High Precision Die, AOI Inspection Machine, High-speed High-precision Die Bonder, Wafer Cleaning System
Number of Employees 80
Year of Establishment 2022-01-21
Management System Certification ISO 9001
Average Lead Time Peak Season Lead Time: 1-3 months
Off Season Lead Time: 1-3 months

Die Bonder Comparison

	Quick View High Precision Eutectic Machine for Semiconductor Chips Contact Now	Quick View LED Pick and Place Machine M6 for LED Light Tube Contact Now	Quick View LED Pick and Place Machine 6 Heads High Speed Chip Mounter Contact Now	Quick View LED SMD Pick and Place Machine Neoden4 for Overlong 1.2m LED PCBA Contact Now	Quick View SMT PCB Assembly Pick and Place Machine with Automatic Placement Robot Contact Now

Transaction Info
	Quick View High Precision Eutectic Machine for Semiconductor Chips Contact Now	Quick View LED Pick and Place Machine M6 for LED Light Tube Contact Now	Quick View LED Pick and Place Machine 6 Heads High Speed Chip Mounter Contact Now	Quick View LED SMD Pick and Place Machine Neoden4 for Overlong 1.2m LED PCBA Contact Now	Quick View SMT PCB Assembly Pick and Place Machine with Automatic Placement Robot Contact Now
Price	US $ 100,000.00-300,000.00/ Set	US $ 26000/ set	US $ 69,000.00-88,000.00/ Set	US $ 7,499.00-9,697.00/ Set	US $ 7,499.00-9,697.00/ Set
Min Order	1 Sets	1 set	1 Set	1 Sets	1 Sets
Trade Terms	-	FOB, CFR, CIF, CIP, CPT, FCA	FOB, CFR, CIF, CIP, CPT, FCA	FOB, CFR, CIF, FCA, EXW	FOB, CFR, CIF, FCA, EXW
Payment Terms	T/T	L/C, T/T, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, Money Gram	T/T, Paypal	T/T, Paypal
Quality Control
Product Certification	ISO, CE	CCC, FDA, ISO, CE, FCC, VDE, CCS, Lr	CCC, FDA, ISO, CE, FCC, VDE, CCS, Lr	CE	CE
Management System Certification	ISO 9001	ISO 9001, ISO 14000, LEED, ISO 17025	ISO 9001, ISO 14000, LEED, ISO 17025	ISO 9001, ISO 9000, ISO 20000, ISO 14064, QC 080000	ISO 9001, ISO 9000, ISO 20000, ISO 14064, QC 080000
Trade Capacity
Export Markets	Domestic	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	Own Brand	Own Brand	Own Brand	ODM, Own Brand	ODM, Own Brand
Average Lead Time	-	Off-season: within 15 Day(s) Peak-season: 1 Month(s)	Off-season: within 15 Day(s) Peak-season: 1 Month(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Binding Force: 10~7,500 G (Programmable); Uph: 7000(Max); X/Y Placement Accuracy: ± 7µm @ 3σ; Theta Placement Accuracy: ±0.15°@ 3σ; Bonding Head Heatingtemperatur: up to 350 °c (Optional);	Condition: New; Speed: Super High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Product Name: LED Pick and Place Machine; Placement Speed: 38000cph; Usage: SMT, SMD, LED, PCB, PCBA; Power Supply: 2phase,AC200 ~ 415 V 50/60Hz; Air Consumption: 0.5 ~ 0.7MPa(5 ~ 7kgf/Cm2); Dimension(LWH): 2000X1100X1500mm; Weight: 1000kg; Feeder: 20PCS; Max.PCB Size: 1200X360mm(1200X460 Option); Head Number: 1;	Condition: New; Speed: Super High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Product Name: Samsung Pick and Place Machine 482 Plus; Placement Speed: 30000cph; Usage: SMT, SMD, LED, PCB, PCBA; Power Supply: AC220V 50Hz / AC110V 60Hz; Air Consumption: 0.5 ~ 0.7MPa(5 ~ 7kgf/Cm2); Dimension: 1650(L)1680(D)1530(H); Weight: 1600kg; Feeder: 120 Pieces; PCB Thickness: 0.38-4.2mm; Max. Component Height: 15mm;	Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 24 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Pick Nozzle Qty: 4; Tape Reel Feeder Qty: 48; Vibrating Feeder Qty: 5; Component Size with Vision: 0201~Tqfp 240; Placement Speed: 5000cph/H with Vision; Components' Height: 5mm; Positioning Accuracy: +/-0.02mm; PCB Area: 310X1500mm with Internal Rails; Placement Area: 140X1500mm with 1 Waffle Tray; Function: Vision System, High Precision;	Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 24 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Pick Nozzle Qty: 4; Tape Reel Feeder Qty: 48, If All Feeders Are 8mm; Vibrating Feeder Qty: 5; Tray IC Capacity: 5; Component Size with Vision: 0201~Tqfp 240; Placement Speed: 5000cph/H with Vision; Components' Height: 5mm; Positioning Accuracy: +/-0.02mm; PCB Area: 310X1500mm with Internal Rails; Placement Area: 140X1500mm with 1 Waffle Tray;
Supplier Name	Suzhou Bozhon Semiconductor Co., Ltd	Dongguan ICT Technology Co.,Ltd.	Dongguan ICT Technology Co.,Ltd.	Zhejiang NeoDen Technology Co., Ltd.	Zhejiang NeoDen Technology Co., Ltd.
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