Die Bonding

US$250,000.00-450,000.00 / Piece

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What is High Precision Eutectic Bonding Machine

Name: High Precision Eutectic Bonding Machine
Uploaded: 2023-11-06T16:56:10+08:00
Description: Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Det

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Price

Min. Order Reference FOB Price

1 Piece US$250,000.00-450,000.00 / Piece

Sepcifications

After-sales Service 7*24 Hour After-Sales Service
Condition New
Speed Medium Speed
Precision High Precision
Certification ISO, CE
Warranty 12 Months
Automatic Grade Automatic
Type High-speed Chip Mounter
Transport Package Wooden Crates and Vacuum Wooden Crates
Specification 1900mm*1100mm*1800mm
Trademark Suzhou Bozhon Semiconductor Co
Origin China
Placement Process Eutectic, Underfill
Equipment Application Coc,COB,Gold Box,Cow,Cos
Nozzle 12 Nozzles Per Single Head, Dynamictool Chan
Workbench 2
Wafer 6 Inch, Supports up to 4 Piece
Waffle Pack Gel-Pak 2 Inch, Supports up to 2 Pieces

Product Description

Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields ...

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Suzhou Bozhon Semiconductor Co., Ltd

Gold Member Since 2023

Audited Supplier

Business Type Manufacturer/Factory & Trading Company
Main Products Fully Automatic High Precision Die, AOI Inspection Machine, High-speed High-precision Die Bonder, Wafer Cleaning System
Number of Employees 80
Year of Establishment 2022-01-21
Management System Certification ISO 9001
Average Lead Time Peak Season Lead Time: 1-3 months
Off Season Lead Time: 1-3 months

Die Bonding Comparison

	Quick View High Precision Eutectic Bonding Machine Contact Now	Quick View Neoden Yy1 Desktop PCB Machine Chip Mounter PCB Making Equipment Contact Now	Quick View Neoden Small Desktop PCB Prototyping SMD Pick and Place Machine Contact Now	Quick View MD-Jc360 MD-Jc380 Automatic Die Bonder Die Attach Manual Upload and Down Load for IC Package Line Contact Now	Quick View Neoden Desktop Automatic PCB LED Strip LED Bulb Making Machine Contact Now

Transaction Info
	Quick View High Precision Eutectic Bonding Machine Contact Now	Quick View Neoden Yy1 Desktop PCB Machine Chip Mounter PCB Making Equipment Contact Now	Quick View Neoden Small Desktop PCB Prototyping SMD Pick and Place Machine Contact Now	Quick View MD-Jc360 MD-Jc380 Automatic Die Bonder Die Attach Manual Upload and Down Load for IC Package Line Contact Now	Quick View Neoden Desktop Automatic PCB LED Strip LED Bulb Making Machine Contact Now
Price	US $ 250,000.00-450,000.00/ Piece	US $ 2899/ Piece	US $ 2899/ Piece	US $ 25,000.00-50,000.00/ Piece	US $ 2899/ Piece
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	T/T	T/T, Western Union, Paypal	T/T, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal, Money Gram	T/T, Western Union, Paypal
Quality Control
Product Certification	ISO, CE	CE	CE	CE	CE
Management System Certification	ISO 9001	ISO 9001, ISO 9000, ISO 20000, ISO 14064, QC 080000	ISO 9001, ISO 9000, ISO 20000, ISO 14064, QC 080000	-	ISO 9001, ISO 9000, ISO 20000, ISO 14064, QC 080000
Trade Capacity
Export Markets	Domestic	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	Own Brand	ODM, Own Brand	ODM, Own Brand	Own Brand	ODM, Own Brand
Average Lead Time	-	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	After-sales Service: 724 Hour After-Sales Service;* Condition: New; Speed: Medium Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Placement Process: Eutectic, Underfill; Equipment Application: Coc,COB,Gold Box,Cow,Cos; Nozzle: 12 Nozzles Per Single Head, Dynamictool Chan; Workbench: 2; Wafer: 6 Inch, Supports up to 4 Piece; Waffle Pack Gel-Pak: 2 Inch, Supports up to 2 Pieces;	After-sales Service: Spares, Warranty and Life-Long Customers Service; Condition: New; Speed: Medium Speed; Precision: High Precision; Warranty: 24 Months; Automatic Grade: Automatic; Type: Medium-speed Chip Mounter; Application: SMT Assembly; Nozzle-Head Qty: 2; Nozzle Changer: Yes; Vibration Feeder: Yes; Support: Reel Tape, Bulk Components, IC, LED, 0201; Displace: 3; Smallest Size: 0201; Largest Size: 18X 18mm; Max Height: 12mm, Support Big Cap; PCB Size Max.: (249-315)Mmx 350mm; Power: 50W; N.W.: 35.5kgs;	After-sales Service: Spares, Warranty and Life-Long Customers Service; Condition: New; Speed: Medium Speed; Precision: High Precision; Warranty: 24 Months; Automatic Grade: Automatic; Type: Medium-speed Chip Mounter; Application: SMT Assembly; Nozzle-Head Qty: 2; Nozzle Changer: Yes; Vibration Feeder: Yes; Support: Reel Tape, Bulk Components, IC, LED, 0201; Displace: 3; Smallest Size: 0201; Largest Size: 18X 18mm; Max Height: 12mm, Support Big Cap; PCB Size Max.: (249-315)Mmx 350mm; Power: 50W; N.W.: 35.5kgs;	After-sales Service: 1 Year; Condition: New; Speed: High Speed; Precision: Precision; Warranty: 12 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter;	After-sales Service: Spares, Warranty and Life-Long Customers Service; Condition: New; Speed: Medium Speed; Precision: High Precision; Warranty: 24 Months; Automatic Grade: Automatic; Type: Medium-speed Chip Mounter; Application: SMT Assembly; Nozzle-Head Qty: 2; Nozzle Changer: Yes; Vibration Feeder: Yes; Support: Reel Tape, Bulk Components, IC, LED, 0201; Displace: 3; Smallest Size: 0201; Largest Size: 18X 18mm; Max Height: 12mm, Support Big Cap; PCB Size Max.: (249-315)Mmx 350mm; Power: 50W; N.W.: 35.5kgs;
Supplier Name	Suzhou Bozhon Semiconductor Co., Ltd	Zhejiang NeoDen Technology Co., Ltd.	Zhejiang NeoDen Technology Co., Ltd.	Guangzhou Minder-Hightech co.,Ltd	Zhejiang NeoDen Technology Co., Ltd.
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