Die Bonding

US$250,000.00-450,000.00 / Piece

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Die Bonding Machine, with The Process for Molding a Chip on Substrate pictures & photos

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What is Die Bonding Machine, with The Process for Molding a Chip on Substrate

Name: Die Bonding Machine, with The Process for Molding a Chip on Substrate
Uploaded: 2023-10-18T10:40:36+08:00
Description: Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Det

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Price

Min. Order Reference FOB Price

1 Piece US$250,000.00-450,000.00 / Piece

Sepcifications

After-sales Service 7*24 Hour After-Sales Service
Condition New
Speed Medium Speed
Precision High Precision
Warranty 12 Months
Automatic Grade Automatic
Type High-speed Chip Mounter
Transport Package Wooden Crates and Vacuum Wooden Crates
Specification 1900mm*1100mm*1800mm
Trademark Suzhou Bozhon Semiconductor Co
Origin China
Placement Process Eutectic, Underfill
Equipment Application Coc,COB,Gold Box,Cow,Cos
Nozzle 12 Nozzles Per Single Head, Dynamictool Chan
Workbench 2
Wafer 6 Inch, Supports up to 4 Piece
Waffle Pack Gel-Pak 2 Inch, Supports up to 2 Pieces

Product Description

Product Description The EH9721 has functions such as multi-wafer feeding and dynamic needle changing, making it more suitable for one-machine production of multiple processes and multiple chips. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields ...

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Suzhou Bozhon Semiconductor Co., Ltd

Gold Member Since 2023

Audited Supplier

Business Type Manufacturer/Factory & Trading Company
Main Products Fully Automatic High Precision Die, AOI Inspection Machine, High-speed High-precision Die Bonder, Wafer Cleaning System
Number of Employees 80
Year of Establishment 2022-01-21
Management System Certification ISO 9001
Average Lead Time Peak Season Lead Time: 1-3 months
Off Season Lead Time: 1-3 months

Die Bonding Comparison

	Quick View Die Bonding Machine, with The Process for Molding a Chip on Substrate Contact Now	Quick View Moje Patching Workshop M612 PCBA Dob SMT Mounting Machine Contact Now	Moje Lens Mounting Machine M512t LED Mounter Machine Contact Now	Moje Chip Pick and Place Machine M512t Lens SMT Mounter Contact Now	Quick View Moje Patching Line M612 Chip Dob Mounter Machine Contact Now

Transaction Info
	Quick View Die Bonding Machine, with The Process for Molding a Chip on Substrate Contact Now	Quick View Moje Patching Workshop M612 PCBA Dob SMT Mounting Machine Contact Now	Moje Lens Mounting Machine M512t LED Mounter Machine Contact Now	Moje Chip Pick and Place Machine M512t Lens SMT Mounter Contact Now	Quick View Moje Patching Line M612 Chip Dob Mounter Machine Contact Now
Price	US $ 250,000.00-450,000.00/ Piece	US $ 34300/ Piece	US $ 25700/ Piece	US $ 25700/ Piece	US $ 34300/ Piece
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	T/T	L/C, T/T, Western Union, Paypal	L/C, T/T, Western Union, Paypal	L/C, T/T, Western Union, Paypal	L/C, T/T, Western Union, Paypal
Quality Control
Product Certification	-	CCC, RoHS, ISO, CE	CCC, RoHS, ISO, CE	CCC, RoHS, ISO, CE	CCC, RoHS, ISO, CE
Management System Certification	ISO 9001	ISO 14001	ISO 14001	ISO 14001	ISO 14001
Trade Capacity
Export Markets	Domestic	Domestic	Domestic	Domestic	Domestic
Annual Export Revenue	-	-	-	-	-
Business Model	Own Brand	-	-	-	-
Average Lead Time	-	Off-season: 1 Month(s) Peak-season: 1 Month(s)	Off-season: 1 Month(s) Peak-season: 1 Month(s)	Off-season: 1 Month(s) Peak-season: 1 Month(s)	Off-season: 1 Month(s) Peak-season: 1 Month(s)
Product Attributes
Specification	After-sales Service: 724 Hour After-Sales Service;* Condition: New; Speed: Medium Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Placement Process: Eutectic, Underfill; Equipment Application: Coc,COB,Gold Box,Cow,Cos; Nozzle: 12 Nozzles Per Single Head, Dynamictool Chan; Workbench: 2; Wafer: 6 Inch, Supports up to 4 Piece; Waffle Pack Gel-Pak: 2 Inch, Supports up to 2 Pieces;	After-sales Service: on Site or Online; Condition: New; Speed: Super High Speed; Precision: High Precision; Warranty: 24 Months; Automatic Grade: Automatic; Type: Ultra High-speed Chip Mounter;	After-sales Service: on Site or Online; Condition: New; Speed: Super High Speed; Precision: High Precision; Warranty: 24 Months; Automatic Grade: Automatic; Type: Ultra High-speed Chip Mounter;	After-sales Service: on Site or Online; Condition: New; Speed: Super High Speed; Precision: High Precision; Warranty: 24 Months; Automatic Grade: Automatic; Type: Ultra High-speed Chip Mounter;	After-sales Service: on Site or Online; Condition: New; Speed: Super High Speed; Precision: High Precision; Warranty: 24 Months; Automatic Grade: Automatic; Type: Ultra High-speed Chip Mounter;
Supplier Name	Suzhou Bozhon Semiconductor Co., Ltd	Guangdong Moje Intelligent Equipment Co., Ltd.	Guangdong Moje Intelligent Equipment Co., Ltd.	Guangdong Moje Intelligent Equipment Co., Ltd.	Guangdong Moje Intelligent Equipment Co., Ltd.
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