Die Bonder

US$100,000.00-300,000.00 / Set

View

Fully Automatic Submicron Die Attach Machine Equipped with Pulse Heating Module pictures & photos

Recommend for you
What is Domestic Bozhong Semiconductor Fully Automatic, High-Precision, and Multifunctional Eutectic Machine Equipment
What is Automatic Multi Die Chip Epoxy Bonding Machine
What is Fully Automatic Submicron Level Eutectic Laser Heating Can Adapt to Small Devices

What is Fully Automatic Submicron Die Attach Machine Equipped with Pulse Heating Module

Name: Fully Automatic Submicron Die Attach Machine Equipped with Pulse Heating Module
Uploaded: 2023-12-21T09:28:27+08:00
Description: Product Description The EG9921 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding

Contact Now

Get Latest Price

About this Item

Price

Min. Order Reference FOB Price

1 Set US$100,000.00-300,000.00 / Set

Sepcifications

After-sales Service 7*24 Hour After-Sales Service
Condition New
Speed High Speed
Precision High Precision
Certification ISO, CE
Warranty 12 Months
Automatic Grade Automatic
Type High-speed Chip Mounter
Transport Package Wooden Crates and Vacuum Wooden Crates
Specification 1160mm*1225mm*1800mm
Trademark Suzhou Bozhon Semiconductor Co
Origin China
Binding Force 10~7,500 G (Programmable)
Uph 7000(Max)
X/Y Placement Accuracy ± 7µm @ 3σ
Theta Placement Accuracy ±0.15°@ 3σ
Bonding Head Heatingtemperatur up to 350 °c (Optional)

Product Description

Product Description The EG9921 Series of die bonders is a high-speed machine designed for multi-chip packaging. With self-developed motion control technology, it achieves high-precision die bonding with an accuracy of ±7@3σ microns and can achieve an ultimate bonding efficiency of up ...

Learn More

Suzhou Bozhon Semiconductor Co., Ltd

Gold Member Since 2023

Audited Supplier

Business Type Manufacturer/Factory & Trading Company
Main Products Fully Automatic High Precision Die, AOI Inspection Machine, High-speed High-precision Die Bonder, Wafer Cleaning System
Number of Employees 80
Year of Establishment 2022-01-21
Management System Certification ISO 9001
Average Lead Time Peak Season Lead Time: 1-3 months
Off Season Lead Time: 1-3 months

Die Bonder Comparison

	Quick View Fully Automatic Submicron Die Attach Machine Equipped with Pulse Heating Module Contact Now	Quick View Automatic SMT Pick and Place Machine Ball Screw Type 6 Heads 53 Feeders for Prototyping Contact Now	Quick View 2023 Torch SMT Automatic High Precision Mounter Tp50V Contact Now	Small Submicron Die Bonding System dB100 Made in China Termway Contact Now	Quick View Discover-F2 Kayo-D2V-25s SMD Pick and Place Chip Mounting Machine PCB Assembly Machine Contact Now

Transaction Info
	Quick View Fully Automatic Submicron Die Attach Machine Equipped with Pulse Heating Module Contact Now	Quick View Automatic SMT Pick and Place Machine Ball Screw Type 6 Heads 53 Feeders for Prototyping Contact Now	Quick View 2023 Torch SMT Automatic High Precision Mounter Tp50V Contact Now	Small Submicron Die Bonding System dB100 Made in China Termway Contact Now	Quick View Discover-F2 Kayo-D2V-25s SMD Pick and Place Chip Mounting Machine PCB Assembly Machine Contact Now
Price	US $ 100,000.00-300,000.00/ Set	US $ 13999/ Set	US $ 999.00-1,000.00/ Set	US $ 73,600.00-120,000.00/ Piece	US $ 19,999.00-21,999.00/ Piece
Min Order	1 Sets	1 Sets	1 Sets	1 Pieces	1 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	T/T	T/T, Western Union, Paypal	L/C, T/T	T/T, Western Union, Paypal	L/C, T/T
Quality Control
Product Certification	ISO, CE	CE	ISO, CE	CE	ISO, CE
Management System Certification	ISO 9001	ISO 9001, ISO 9000, ISO 20000, ISO 14064, QC 080000	ISO 9001, ISO 14001	ISO 9001, ISO 14001	ISO 9001, ISO 14001
Trade Capacity
Export Markets	Domestic	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, Europe, East Asia(Japan/ South Korea)	North America, Europe, East Asia(Japan/ South Korea)	North America, Europe, East Asia(Japan/ South Korea)
Annual Export Revenue	-	-	-	-	-
Business Model	Own Brand	ODM, Own Brand	Own Brand	Own Brand	Own Brand
Average Lead Time	-	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	-	-	-
Product Attributes
Specification	After-sales Service: 724 Hour After-Sales Service;* Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Binding Force: 10~7,500 G (Programmable); Uph: 7000(Max); X/Y Placement Accuracy: ± 7µm @ 3σ; Theta Placement Accuracy: ±0.15°@ 3σ; Bonding Head Heatingtemperatur: up to 350 °c (Optional);	After-sales Service: 2 Years Warranty; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 24 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Head Qty: 6; Feeder Qty: 53; Component Range: 0201, 0402, BGA, Qfn, Tqfp; Max PCB Size: 300mm800mm;* Accuracy: 0.01mm; Power: 500W; Air Supply: >0.6MPa;	After-sales Service: 1 Year; Condition: New; Speed: Medium Speed; Precision: High Precision; Warranty: 24 Months; Automatic Grade: Automatic; Type: Medium-speed Chip Mounter; Max Size of The PCB: 600300mm;* Speed of Mounting: 2000-3200cph; Component: Above 0402 and Less Than30mm Pitch, More Than 0.5m; Short with Feeder: 8mm, 12mm, 16mm, 24mm Feeder; Quantity of IC Dick: No More Than 2 PCS; Weight: 620kg; Size: 1405 1400 1450mm;	After-sales Service: Online and Video Service; Condition: New; Speed: Medium Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Semiautomatic; Type: Medium-speed Chip Mounter; Max. Chip Size: Smaller 20mm X20mm(5050mm Optional);* Min. Chip Size: 0.20.2mm;* Mounting Precision: ±3um 3δ; Feeding Mode: 2 Inch Waffle Box2;* Substrate Size: 150150mm;* X Y Z Axis Motion System: Roller Screw + Servo Motor; X Y Axis Resolution: 0.1um; Power Supply: 220V, 50Hz; Net Weight: 150kg;	After-sales Service: All Life; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 18 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Accuracy: 0.05mm; Max PCB Size: 400350mm;* Placing Speed: 3500cph; Max Printing Size: 400350mm;* Max Moving Range: 400630mm;* Z Axis Max Moving Range: 70mm; Typical Mounting Speed: 2000-2800cph; Power Supply: 220V, 50Hz, 3kw; Mounting Accuracy: +/-0.05mm; Weight: 310kg;
Supplier Name	Suzhou Bozhon Semiconductor Co., Ltd	Zhejiang NeoDen Technology Co., Ltd.	Termway (Beijing) Precision Technology Co., Ltd.	Termway (Beijing) Precision Technology Co., Ltd.	Termway (Beijing) Precision Technology Co., Ltd.
Select All

Contact Now

Hot Search