Die Bonder
US$250,000.00-450,000.00 / Piece
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What is Opto-Electronics Packaging Chip Bonding Machine

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$250,000.00-450,000.00 / Piece

Sepcifications

  • After-sales Service 7*24 Hour After-Sales Service
  • Condition New
  • Speed High Speed
  • Precision High Precision
  • Certification ISO, CE
  • Warranty 12 Months
  • Automatic Grade Automatic
  • Type High-speed Chip Mounter
  • Transport Package Wooden Crates and Vacuum Wooden
  • Specification 1900mm*1100mm*1800mm
  • Trademark Suzhou Bozhon Semiconductor Co
  • Origin China
  • Equipment Applications Coc, COB, Gold Box, Cow, Cos
  • Weights 2200kg
  • Nozzle 12 Nozzles Per Head, with Dynamic Tool Change
  • Working Table 2
  • Transfer Table up to 8 Working Tables (Per Machine)
  • Temperature Range up to 500°c (Maximum)
  • Temperature Rising Rate 50°c/S (Maximum)

Product Description

Product Description The EF8621 provides flexible and diverse packaging capabilities for advanced packaging. Detailed Photos High Precision: ±3µm@3σ, giving customers leading product yields High Efficiency: Dynamic tool changing, dual intermediate shaft, high-efficiency ...

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Die Bonder Comparison
Transaction Info
Price US $ 250,000.00-450,000.00/ Piece Negotiable US $ 2,300.00-80,000.00/ Set US $ 13999/ Set US $ 13999/ Set
Min Order 1 Pieces 1 Pieces 1 Set 1 Sets 1 Sets
Trade Terms - - - - -
Payment Terms T/T T/T, Western Union, Paypal L/C, T/T, D/P, Western Union, Money Gram T/T, Western Union, Paypal T/T, Western Union, Paypal
Quality Control
Product Certification ISO, CE - ISO, CE CE CE
Management System Certification ISO 9001 ISO 9001, ISO 9000, ISO 14001 ISO 9001, ISO 14000, LEED, ISO 17025 ISO 9001, ISO 9000, ISO 20000, ISO 14064, QC 080000 ISO 9001, ISO 9000, ISO 20000, ISO 14064, QC 080000
Trade Capacity
Export Markets Domestic North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model Own Brand OEM Own Brand ODM, Own Brand ODM, Own Brand
Average Lead Time - Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: 1 Month(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
After-sales Service: 7*24 Hour After-Sales Service;
Condition: New;
Speed: High Speed;
Precision: High Precision;
Warranty: 12 Months;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Equipment Applications: Coc, COB, Gold Box, Cow, Cos;
Weights: 2200kg;
Nozzle: 12 Nozzles Per Head, with Dynamic Tool Change;
Working Table: 2;
Transfer Table: up to 8 Working Tables (Per Machine);
Temperature Range: up to 500°c (Maximum);
Temperature Rising Rate: 50°c/S (Maximum);
Condition: New;
Speed: High Speed;
Precision: High Precision;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
After-sales Service: Overseas After-Sales;
Condition: New;
Speed: Super High Speed;
Precision: High Precision;
Warranty: 12 Months;
Automatic Grade: Automatic;
Type: Ultra High-speed Chip Mounter;
Name: SMT Pick and Place Machine;
Conveyor Specification: 150mm Conveyor Extensions, Upstream and Downstream;
Component Height: 25mm;
Placement Speed: 42000cph;
Placement Accuracy: +-0.035mm;
Feeder Inputs: Max.112(Using RF Feeders);
Max. PCB Size: 1, 200*370mm (Double Clamping);
Component Size: 0201-74mm/50*150mm;
Min. PCB Size: 50*50mm;
Usage: SMT LED SMD;
After-sales Service: 2 Years Warranty;
Condition: New;
Speed: High Speed;
Precision: High Precision;
Warranty: 24 Months;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Head Qty: 6;
Feeder Qty: 53;
Component Range: 0201, 0402, BGA, Qfn, Tqfp;
Max PCB Size: 300mm*800mm;
Accuracy: 0.01mm;
Power: 500W;
Air Supply: >0.6MPa;
After-sales Service: 2 Years Warranty;
Condition: New;
Speed: High Speed;
Precision: High Precision;
Warranty: 24 Months;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Head Qty: 6;
Feeder Qty: 53;
Component Range: 0201, 0402, BGA, Qfn, Tqfp;
Max PCB Size: 300mm*800mm;
Accuracy: 0.01mm;
Power: 500W;
Air Supply: >0.6MPa;
Supplier Name

Suzhou Bozhon Semiconductor Co., Ltd

China Supplier - Gold Member Audited Supplier

SMT PARTS SUPPLY LTD

China Supplier - Gold Member Audited Supplier

Dongguan ICT Technology Co.,Ltd.

China Supplier - Diamond Member Audited Supplier

Zhejiang NeoDen Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Zhejiang NeoDen Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier