Raspberry Pi 3b
US$20.00 - 100.00 / Piece
Single Board Computer Raspberry Pi 3 Model B Development Board pictures & photos
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Single Board Computer Raspberry Pi 3 Model B Development Board pictures & photos
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Single Board Computer Raspberry Pi 3 Model B Development Board pictures & photos
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Single Board Computer Raspberry Pi 3 Model B Development Board pictures & photos
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Single Board Computer Raspberry Pi 3 Model B Development Board pictures & photos
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Single Board Computer Raspberry Pi 3 Model B Development Board pictures & photos
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What is Single Board Computer Raspberry Pi 3 Model B Development Board

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About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$20.00 - 100.00 / Piece

Sepcifications

  • Metal Coating Tin
  • Mode of Production SMT
  • Layers Single-Layer
  • Base Material PCB
  • Certification RoHS, CCC
  • Customized Non-Customized
  • Condition New
  • Transport Package Paper Box
  • Specification 1 piece/box
  • Trademark CENTURY SOLUTIONS
  • Origin GB
  • Processor Broadcom Bcm2837
  • RAM 1GB
  • USB 4 USB 2 Ports
  • Other 40-Pin Extended Gpio
  • Wireless/Bluetooth Yes
  • Application IoT/Ai

Product Description

Raspberry Pi 3 Model B Product Description Single board Computer Raspberry Pi 3 Model B Specification The Raspberry Pi 3 Model B is the earliest model of the third-generation Raspberry Pi. It replaced the Raspberry Pi 2 Model B in February 2016. See also the Raspberry Pi 3 Model B+, the ...

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Single Board Computer Raspberry Pi 3 Model B Development Board

Single Board Computer Raspberry Pi 3 Model B Development Board

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Transaction Info
Price US$20.00 - 100.00 / Piece US$2.20 / Piece US$2.20 / Piece US$2.50 - 6.00 / Piece US$0.87 - 6.00 / Piece
Min Order 1 Piece 10 Pieces 10 Pieces 10 Pieces 10 Pieces
Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment T/T T/T T/T T/T
Quality Control
Product Certification RoHS, CCC RoHS, CCC, ISO RoHS, CCC, ISO RoHS, CCC, ISO RoHS, ISO
Management System Certification - ISO9001:2015 ISO9001:2015 ISO9001:2015 ISO9001:2015
Trade Capacity
Export Markets North America, Europe Domestic Domestic Domestic Domestic
Annual Export Revenue - - - - -
Business Model ODM, OEM ODM, OEM ODM, OEM ODM, OEM ODM, OEM
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: one month
Off Season Lead Time: one month
Product Attributes
Specification
Metal Coating: Tin;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: PCB;
Customized: Non-Customized;
Condition: New;
Processor: Broadcom Bcm2837;
RAM: 1GB;
USB: 4 USB 2 Ports;
Other: 40-Pin Extended Gpio;
Wireless/Bluetooth: Yes;
Application: IoT/Ai;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
Product Name: Best Selling PCBA Factory SMT DIP Electronic;
Shipment Way: by Air by Sea;
Payment Way: Tt;
Min.Pin Space of IC: 0.3mm;
Min. Space of BGA: +/- 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Electronic: 100kmonth;
Test : 100% Aoi Testing;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
Product Name: Professional OEM Custom-Made PCBA for Electronic;
Shipment Way: by Air by Sea;
Payment Way: Tt;
Min.Pin Space of IC: 0.3mm;
Min. Space of BGA: +/- 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Electronic: 100kmonth;
Test : 100% Aoi Testing;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-6;
Customized: Customized;
Condition: New;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-6;
Customized: Non-Customized;
Condition: New;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Supplier Name

CENTURY SOLUTIONS LIMITED

Gold Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

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