Original Orange Pi 4 Lts 3G Development Board Single Board Computer pictures & photos

Original Orange Pi 4 Lts 3G Development Board Single Board Computer

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Price

Min. Order Reference FOB Price

1 Piece US$20.00-55.00 / Piece

Sepcifications

Metal Coating Tin
Mode of Production SMT
Layers Single-Layer
Base Material PCB
Certification RoHS, CCC
Customized Non-Customized
Condition New
Transport Package Paper Box
Specification 1 piece/box
Trademark CENTURY SOLUTIONS
Origin Cn
RAM 3G
Processor Rockchip
Intergrated Feature 10/100/1000Mbps, WiFi 802.11b/G/N, Bluetooth
Application IoT/Ai
Brand Name Orange Pi
C/O Mainland China

Product Description

Orange Pi 4 LTS 3G CENTURY SOLUTIONS LIMITED was incorporated in 2016 in Wuhan, a city in Central China's Hubei province. With this advantage, we are attracting a substantial number of talented young people fresh from universities every year. Thus, we are a team full of enthusiasm and ...

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CENTURY SOLUTIONS LIMITED

Gold Member Since 2024

Audited Supplier

Rating & Reviews: 5.0/5.0

(4 Reviews)

Business Type Trading Company
Main Products Raspberry Pi Zero W, Raspberry Pi Zero 2 W, Raspberry Pi 3 Model B, Raspberry Pi 3 Model B+, Raspberry Pi 4b, Compute Module 3+, Compute Module 4, Raspberry Pi Accessories, Arduino, Nvidia
Number of Employees 8
Year of Establishment 2023-02-21
Management System Certification ISO 9001
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

Orange Pi Comparison

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Transaction Info
	Original Orange Pi 4 Lts 3G Development Board Single Board Computer Contact Now	Tailored PCBA Solutions for Audiovisual Entertainment Systems with SMT Assembly Technology Rogers PCB Contact Now	Quick View Customized PCB Design for Electric Vehicle Battery Management Systems with Multilayer PCB Technology Contact Now	Specialized PCB Production for Automotive Engine Control Units with Impedance Control Technology Contact Now	Advanced PCBA Assembly PCB for Automotive LED Lighting Systems with Integrated Circuits Contact Now
Price	US $ 20.00-55.00/ Piece	US $ 0.30-2.00/ Piece	US $ 0.30-1.00/ Piece	US $ 0.30-1.00/ Piece	US $ 0.30-1.00/ Piece
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Payment Terms	T/T, Western Union, Paypal, Money Gram	L/C, T/T, Western Union	L/C, T/T, Western Union	L/C, T/T, Western Union	L/C, T/T, Western Union
Quality Control
Product Certification	RoHS, CCC	RoHS, ISO	RoHS, ISO	RoHS, ISO	RoHS, ISO
Management System Certification	ISO 9001	ISO 9001, ISO 9000, ISO 14001	ISO 9001, ISO 9000, ISO 14001	ISO 9001, ISO 9000, ISO 14001	ISO 9001, ISO 9000, ISO 14001
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe	South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe	South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe	South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	US$50 Million - US$100 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million
Business Model	-	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays
Product Attributes
Specification	Metal Coating: Tin; Mode of Production: SMT; Layers: Single-Layer; Base Material: PCB; Customized: Non-Customized; Condition: New; RAM: 3G; Processor: Rockchip; Intergrated Feature: 10/100/1000Mbps, WiFi 802.11b/G/N, Bluetooth; Application: IoT/Ai; Brand Name: Orange Pi; C/O: Mainland China;	Metal Coating: Copper; Mode of Production: DIP; Layers: Multilayer; Base Material: FR-4; Customized: Customized; Condition: New; Type: Rigid Circuit Board; Dielectric: Fr-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Insulation Materials: Epoxy Resin; Processing Technology: Immersion Gold; Copper Thickness: 3oz -105oz; Surface Finish: Gold Finger; Special Technology: Metal Edging; Special 1: Blind Hole; Special 2: Buried Vias; Special 3: Flex-Rigid PCB; Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;	Metal Coating: Copper; Mode of Production: DIP; Layers: Multilayer; Base Material: FR-4; Customized: Customized; Condition: New; Type: Rigid Circuit Board; Dielectric: Fr-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Insulation Materials: Epoxy Resin; Processing Technology: Immersion Gold; Copper Thickness: 3oz -105oz; Surface Finish: Gold Finger; Special Technology: Metal Edging; Special 1: Blind Hole; Special 2: Buried Vias; Special 3: Flex-Rigid PCB; Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;	Metal Coating: Copper; Mode of Production: DIP; Layers: Multilayer; Base Material: FR-4; Customized: Customized; Condition: New; Type: Rigid Circuit Board; Dielectric: Fr-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Insulation Materials: Epoxy Resin; Processing Technology: Immersion Gold; Copper Thickness: 3oz -105oz; Surface Finish: Gold Finger; Special Technology: Metal Edging; Special 1: Blind Hole; Special 2: Buried Vias; Special 3: Flex-Rigid PCB; Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;	Metal Coating: Copper; Mode of Production: DIP; Layers: Multilayer; Base Material: FR-4; Customized: Customized; Condition: New; Type: Rigid Circuit Board; Dielectric: Fr-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Insulation Materials: Epoxy Resin; Processing Technology: Immersion Gold; Copper Thickness: 3oz -105oz; Surface Finish: Gold Finger; Special Technology: Metal Edging; Special 1: Blind Hole; Special 2: Buried Vias; Special 3: Flex-Rigid PCB; Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;
Supplier Name	CENTURY SOLUTIONS LIMITED	Shenzhen Hemeixin Electronic Co., Limited	Shenzhen Hemeixin Electronic Co., Limited	Shenzhen Hemeixin Electronic Co., Limited	Shenzhen Hemeixin Electronic Co., Limited
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