| Specification |
Metal Coating: Tin;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: PCB;
Customized: Non-Customized;
Condition: New;
Processor: Broadcom Bcm2711, Quad-Core Cortex-A72 (Arm V8) 64;
Memory: 8g;
Connectivity: 2.4 GHz and 5.0 GHz IEEE 802.11b/G/N/AC Wireless;
Environment: Operating Temperature 0–50ºC;
Package List: 1 X Raspberry Pi 4 Model B (2/4/8GB);
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
Functional Testing: Spi, X-ray, Aoi, Ict, Fct, RoHS and Aging;
Type: Rigid Circuit Board;
PCBA Min. IC Pitch: 0.30mm(12mil);
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
BGA Minimum Dia: 01015;
PCBA Foot Pin: So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA;
Small Order: Acceptable;
IP Protection: Strong Believe in IP Protection with Proven Record;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
Functional Testing: Spi, X-ray, Aoi, Ict, Fct, RoHS and Aging;
Type: Rigid Circuit Board;
PCBA Min. IC Pitch: 0.30mm(12mil);
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
BGA Minimum Dia: 01015;
PCBA Foot Pin: So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA;
Small Order: Acceptable;
IP Protection: Strong Believe in IP Protection with Proven Record;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Shape: Retangular, Round, Slots, Cutouts, Complex, Irreg;
Surface Finishing: OSP, Immersion Gold, Immersion Tin, Immersion AG;
Layer: 1-22 Layers;
Service: Turnkey Assembly PCB Service;
Other Capabilities: Repair/Rework Services Mechanical Assembly Box Bui;
Copper Thickness: 1-10oz;
Min. SMD Size: 01005;
QA Inspection: Aoi, X-ray, Ict;
Certificate: ISO9001, ISO14000, Ts16949.UL.RoHS;
Order Qty: No Limited;
Controlling Range: -40c~125c;
Solder Resist Color: Green;Red;Yellow;Black;White;
Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable Mask;
Trade Mark: OEM, ODM;
Surface Finish: Lead Free HASL;
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Metal Coating: Copper;
Mode of Production: DIP;
Layers: Single-Layer;
Base Material: Special PCB Board for Mosquito Racket;
Customized: Customized;
Condition: New;
Product Name: Ee16 Transformer;
Materials: Copper Wires;
Inductance: 450mh±7%;
Coil Winding: Uew 130ºC;
Core out Wrap: Polyesterfilm, 130ºCpz;
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