Specification |
Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Cl;
Layer: 24L;
Service: OEM/ODM, EMS;
Support: Fast Proofing;
MOQ: a Slice;
Ten Years: Export Trade Experience;
Sales Model: Factory Direct;
Quality Standard: Ipc-a-610 Class II & III, Ipc-a-620 Class II & III;
Surface Finish: HASL, Enig, OSP, Gold Finger;
Support One-Stop Service: PCB Manufacturing, Component Sourcing, SMT Placeme;
Surface Finishing: HASL, Immersion Gold, OSP;
Application Field: LED, Medical, Industrial, Control Board;
Export Trade: More Than 10 Years;
Lndustry Experience: Over 30 Years;
Business Team Services: 7*24 Hours Online;
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Dielectric: FR-4;
Material: Fr-4/Cem-1/Cem-3/Fr1/Aluminum;
Application: Home Appliances;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Brand: HS-PCBA;
Product Name: Electric Fireplace PCBA Control Board;
Advantage: R & D Team,Automation Equipment;
Service: OEM/ODM;
Testing: Aoi Testing, Fuctional Testing,Aging Test;
Brand Name: Huishine;
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Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
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Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
|
Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
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