Specification |
Insulation Materials: Epoxy Resin;
Flame Retardant Properties: V0;
Application: Consumer Electronics;
Layer: 24L;
Service: OEM/ODM, EMS;
Support: Fast Proofing;
MOQ: a Slice;
30 Years: Focus on PCB Industry;
Ten Years: Export Trade Experience;
Sales Model: Factory Direct;
Quality Standard: Ipc-a-610 Class II & III, Ipc-a-620 Class II & III;
Surface Finish: HASL, Enig, OSP, Gold Finger;
Support One-Stop Service: PCB Manufacturing, Component Sourcing, SMT Placeme;
Surface Finishing: HASL, Immersion Gold, OSP;
Application Field: LED, Medical, Industrial, Control Board;
Export Trade: More Than 10 Years;
Lndustry Experience: Over 30 Years;
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Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Processing Technology: Gold Plated;
Base Material: Fr4+Pi+Nfpp;
Structure: Multilayer PCB+FPC;
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Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Processing Technology: Enig;
Base Material: Fr4+Pi+Nfpp;
Structure: Multilayer PCB+FPC;
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Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Aerospace, Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Blind Vias: 0.1mm;
Buried Vias: 0.1mm;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Processing Technology: Enig;
Base Material: Fr4+Pi+Nfpp;
Structure: Multilayer PCB+FPC;
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Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace, Steamer Steamship;
Blind Vias: 0.1mm;
Buried Vias: 0.1mm;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Processing Technology: Enig;
Base Material: Fr4+Pi+Nfpp;
Structure: Multilayer PCB+FPC;
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