| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: PCBA Manufacturer;
Layer: 1-18 Layer;
Surface Finishing: HASL, Enig, OSP, Immersion Au, AG, Sn;
Board Thickness: 0.2mm-4mm;
Copper Thickness: 0.5, 1oz, 2oz;
Min.Hole Size: 0.1mm (4 Mil);
Min.Line Spacing: 0.1mm (4 Mil);
PCBA QC: X-ray, Aoi Test, Function Test(100% Test);
Specialised: CE, LED, Medical, Industrial, Control Board;
Delivery: PCB, 7-10 Days; PCBA, 2-3weeks;
Servicve: PCB, PCBA, SMT, Tht, Test;
Other Service: PCBA Layout and Design, Engineering Support;
Product Name: PCB Board Coupler Transister;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate, Fiberglass Epoxy;
Application: Communication, Consumer Electronics;
Flame Retardant Properties: V0, V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil, Delay Pressure Foil;
Base Material: Fr4, Copper;
Insulation Materials: Epoxy Resin;
Brand: Ca;
Structure: Multilayer Rigid PCB;
Production Process: Subtractive Process;
Board Thickness: 1.6mm;
Board Layer: 2 Layers;
Copper Thickness: 1 Oz;
Solder Mask: Blue;
Silksreen: White;
Min Pad: +/- 0.1mm (4mil);
Surface Finihsing: HASL-Lf;
Lead Time: 6-8 Working Days;
Shipping Type: DHL, UPS, TNT, EMS, FedEx etc;
Packing Type: Carton + Vacuum;
Test: Fly Probe Testing;
Min Board Thickness: 0.1mm Only for Single and Double Sided;
Min. Line Width/Space: 0.05mm (2mil);
Outline Machining Accuracy: +/- 0.1mm (4mil);
MOQ: 1 PCS;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate, Fiberglass Epoxy;
Application: Communication, Consumer Electronics;
Flame Retardant Properties: V0, V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil, Delay Pressure Foil;
Base Material: Fr4, Copper;
Insulation Materials: Epoxy Resin;
Brand: Ca;
Structure: Multilayer Rigid PCB;
Production Process: Subtractive Process;
Board Thickness: 1.6mm;
Board Layer: 2 Layers;
Copper Thickness: 1 Oz;
Solder Mask: Blue;
Silksreen: White;
Min Pad: +/- 0.1mm (4mil);
Surface Finihsing: HASL-Lf;
Lead Time: 6-8 Working Days;
Shipping Type: DHL, UPS, TNT, EMS, FedEx etc;
Packing Type: Carton + Vacuum;
Test: Fly Probe Testing;
Min Board Thickness: 0.1mm Only for Single and Double Sided;
Min. Line Width/Space: 0.05mm (2mil);
Outline Machining Accuracy: +/- 0.1mm (4mil);
MOQ: 1 PCS;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate, Fiberglass Epoxy;
Application: Communication, Consumer Electronics;
Flame Retardant Properties: V0, V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil, Delay Pressure Foil;
Base Material: Fr4, Copper;
Insulation Materials: Epoxy Resin;
Brand: Ca;
Structure: Multilayer Rigid PCB;
Production Process: Subtractive Process;
Board Thickness: 1.6mm;
Board Layer: 2 Layers;
Copper Thickness: 1 Oz;
Solder Mask: Blue;
Silksreen: White;
Min Pad: +/- 0.1mm (4mil);
Surface Finihsing: HASL-Lf;
Lead Time: 6-8 Working Days;
Shipping Type: DHL, UPS, TNT, EMS, FedEx etc;
Packing Type: Carton + Vacuum;
Test: Fly Probe Testing;
Min Board Thickness: 0.1mm Only for Single and Double Sided;
Min. Line Width/Space: 0.05mm (2mil);
Outline Machining Accuracy: +/- 0.1mm (4mil);
MOQ: 1 PCS;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate, Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0, V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil, Delay Pressure Foil;
Base Material: Fr4, Copper;
Insulation Materials: Epoxy Resin;
Brand: Ca;
Structure: Double-Sided Rigid PCB;
Production Process: Subtractive Process;
Board Thickness: 1.6mm;
Board Layer: 2 Layers;
Copper Thickness: 1 Oz;
Solder Mask: Blue;
Silksreen: White;
Min Pad: +/- 0.1mm (4mil);
Surface Finihsing: HASL-Lf;
Lead Time: 6-8 Working Days;
Shipping Type: DHL, UPS, TNT, EMS, FedEx etc;
Packing Type: Carton + Vacuum;
Test: Fly Probe Testing;
Min Board Thickness: 0.1mm Only for Single and Double Sided;
Min. Line Width/Space: 0.05mm (2mil);
Outline Machining Accuracy: +/- 0.1mm (4mil);
MOQ: 1 PCS;
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