PCBA Assembly
US$5.00-20.00 / pcs
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What is High Quality Rapid Schematic Electronic PCB Design Development and PCBA Assembly

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-1,999 pcs US$20.00

2,000-9,999 pcs US$12.00

10,000+ pcs US$5.00

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Organic Resin
  • Brand PCB Design Development and PCBA Assembly
  • Transport Package Vacuum Packing/Blister/Plastic /Cartoon
  • Specification CE, RohS, UL, SGS, ISO9001, 94v0
  • Trademark OEM/ODM pcba
  • Origin Shenzhen, Guangdong
  • MOQ 1 PCS
  • Certification Ce, RoHS, UL, SGS, ISO9001: 2015, 94V0
  • Layer 1-24 Layer
  • Surface Finishing HASL, Enig, OSP, Immersion Au, AG, Sn
  • Board Thickness 0.2mm-4mm
  • Copper Thickness 0.5oz, 1oz, 2oz
  • Min.Hole Size 0.1mm (4 Mil)
  • Min.Line Spacing 0.1mm (4 Mil)
  • Service Printed Circuit Board, PCB, PCBA, SMT, Tht, Test
  • Other Service PCBA Layout and Design, Engineering Support
  • PCBA QC X-ray, Aoi Test, Function Test(100% Test)
  • Specialised Medical, Industrial, Control Board, Ce
  • Delivery PCB, 3-5 Days;PCBA, 2-3weeks
  • Product Name PCB Design Development and PCBA Assembly

Product Description

WHY CHOOSE STHL PCBA Specification SMT Workshop : Quality System: 1. ISO-9001:2015 Quality System Standard 2. Quality Standard: IPC-610-D class 2, 3. Soldering Standard: J-STD-001 class 1,2,3 4. ESD Standard: ESD-MIL-STD-1686 5. Workshop management:5S 6. FAI-first article ...

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PCBA Assembly Comparison
Transaction Info
Price US $ 5.00-20.00/ pcs US $ 1.14/ Piece US $ 0.56/ Piece US $ 0.85/ Piece US $ 0.84/ Piece
Min Order 1 pcs 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Payment Terms T/T, Western Union, Paypal, Money Gram T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal
Quality Control
Product Certification Ce, RoHS, UL, SGS, ISO9001: 2015, 94V0 - - - -
Management System Certification ISO 9001, ISO 14001, ISO 14000, IATF16949, QC 080000, ISO 13485 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, Eastern Europe, Southeast Asia, Africa, Oceania, Western Europe North America, Eastern Europe, Southeast Asia, Africa, Oceania, Western Europe North America, Eastern Europe, Southeast Asia, Africa, Oceania, Western Europe North America, Eastern Europe, Southeast Asia, Africa, Oceania, Western Europe
Annual Export Revenue US$10 Million - US$50 Million US$10 Million - US$50 Million US$10 Million - US$50 Million US$10 Million - US$50 Million US$10 Million - US$50 Million
Business Model OEM, ODM OEM, Own Brand(Bicheng) OEM, Own Brand(Bicheng) OEM, Own Brand(Bicheng) OEM, Own Brand(Bicheng)
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: PCB Design Development and PCBA Assembly;
MOQ: 1 PCS;
Layer: 1-24 Layer;
Surface Finishing: HASL, Enig, OSP, Immersion Au, AG, Sn;
Board Thickness: 0.2mm-4mm;
Copper Thickness: 0.5oz, 1oz, 2oz;
Min.Hole Size: 0.1mm (4 Mil);
Min.Line Spacing: 0.1mm (4 Mil);
Service: Printed Circuit Board, PCB, PCBA, SMT, Tht, Test;
Other Service: PCBA Layout and Design, Engineering Support;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test);
Specialised: Medical, Industrial, Control Board, Ce;
Delivery: PCB, 3-5 Days;PCBA, 2-3weeks;
Product Name: PCB Design Development and PCBA Assembly;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Board Thick: 2.0mm;
Surface Finish: Immersion Gold;
out Layer Copper: 35 Um (1 Oz);
Soldermask Color: Green;
Silkscreen Color: White;
Final Foil Internal: 1 Oz;
Minimum Trace and Space: 5.7 Mil/ 5 Mil;
Minimum / Maximum Holes: 0.5 mm /3.2 mm;
Via: Minimum Size 0.5mm;
Test: 100% Electrical Test;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Board Thick: 1.6mm;
Surface Finish: Immersion Gold;
out Layer Copper: 35 Um (1 Oz);
Soldermask Color: Green;
Silkscreen Color: White;
Final Foil Internal: 1 Oz;
Minimum Trace and Space: 7.8 Mil/ 5 Mil;
Minimum / Maximum Holes: 0.7 mm /5.0 mm;
Via: Minimum Size 0.7mm;
Test: 100% Electrical Test;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Board Thick: 1.6mm;
Surface Finish: Immersion Gold;
out Layer Copper: 1 Oz;
Soldermask Color: Green;
Silkscreen Color: White;
Final Foil Internal: 0.5 Oz;
Minimum Trace and Space: 7.8 Mil / 7.1 Mil;
Minimum / Maximum Holes: 0.4 mm /3.175 mm;
Via: Minimum Size 0.3mm;
Test: 100% Electrical Test;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Board Thick: 1.6mm;
Surface Finish: Immersion Gold;
out Layer Copper: 1 Oz;
Soldermask Color: Green;
Silkscreen Color: White;
Final Foil Internal: 1 Oz;
Minimum Trace and Space: 4 Mil / 4 Mil;
Minimum / Maximum Holes: 0.3 mm /3.5 mm;
Via: Minimum Size 0.3mm. Blind Via;
Test: 100% Electrical Test;
Supplier Name

Shenzhen STHL Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier