Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: PCB Design Development and PCBA Assembly;
MOQ: 1 PCS;
Layer: 1-24 Layer;
Surface Finishing: HASL, Enig, OSP, Immersion Au, AG, Sn;
Board Thickness: 0.2mm-4mm;
Copper Thickness: 0.5oz, 1oz, 2oz;
Min.Hole Size: 0.1mm (4 Mil);
Min.Line Spacing: 0.1mm (4 Mil);
Service: Printed Circuit Board, PCB, PCBA, SMT, Tht, Test;
Other Service: PCBA Layout and Design, Engineering Support;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test);
Specialised: Medical, Industrial, Control Board, Ce;
Delivery: PCB, 3-5 Days;PCBA, 2-3weeks;
Product Name: PCB Design Development and PCBA Assembly;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Board Thick: 2.0mm;
Surface Finish: Immersion Gold;
out Layer Copper: 35 Um (1 Oz);
Soldermask Color: Green;
Silkscreen Color: White;
Final Foil Internal: 1 Oz;
Minimum Trace and Space: 5.7 Mil/ 5 Mil;
Minimum / Maximum Holes: 0.5 mm /3.2 mm;
Via: Minimum Size 0.5mm;
Test: 100% Electrical Test;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Board Thick: 1.6mm;
Surface Finish: Immersion Gold;
out Layer Copper: 35 Um (1 Oz);
Soldermask Color: Green;
Silkscreen Color: White;
Final Foil Internal: 1 Oz;
Minimum Trace and Space: 7.8 Mil/ 5 Mil;
Minimum / Maximum Holes: 0.7 mm /5.0 mm;
Via: Minimum Size 0.7mm;
Test: 100% Electrical Test;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Board Thick: 1.6mm;
Surface Finish: Immersion Gold;
out Layer Copper: 1 Oz;
Soldermask Color: Green;
Silkscreen Color: White;
Final Foil Internal: 0.5 Oz;
Minimum Trace and Space: 7.8 Mil / 7.1 Mil;
Minimum / Maximum Holes: 0.4 mm /3.175 mm;
Via: Minimum Size 0.3mm;
Test: 100% Electrical Test;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Board Thick: 1.6mm;
Surface Finish: Immersion Gold;
out Layer Copper: 1 Oz;
Soldermask Color: Green;
Silkscreen Color: White;
Final Foil Internal: 1 Oz;
Minimum Trace and Space: 4 Mil / 4 Mil;
Minimum / Maximum Holes: 0.3 mm /3.5 mm;
Via: Minimum Size 0.3mm. Blind Via;
Test: 100% Electrical Test;
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