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US$5,000.00-65,000.00 / Piece

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Automatic SMT Pick and Place Machine with 48 Feeders pictures & photos

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What is Automatic SMT Pick and Place Machine with 48 Feeders

Name: Automatic SMT Pick and Place Machine with 48 Feeders
Uploaded: 2023-06-28T20:50:59+08:00
Description: Automatic SMT Pick and Place Machine with 48 Feeders Features: 1. 78,000 CPH(Optimum) 2. 2 Gantry x 10 Spindles/Head 3. Applicable Parts : 0402 ~ 14mm(H12mm) 4. Electrically Driven High Speed and Hig

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About this Item

Price

Min. Order Reference FOB Price

1 Piece US$5,000.00-65,000.00 / Piece

Sepcifications

After-sales Service 7X24 Hrs Online Technical Support
Condition New
Speed High Speed
Precision High Precision
Certification CCC, FDA, RoHS, ISO, CE
Warranty 12 Months
Automatic Grade Automatic
Type High-speed Chip Mounter
Transport Package Standard Export Wooden Case
Specification 1.65 x 1.69 x 1.53
Trademark Chipbest
Origin China

Product Description

Automatic SMT Pick and Place Machine with 48 Feeders Features: 1. 78,000 CPH(Optimum) 2. 2 Gantry x 10 Spindles/Head 3. Applicable Parts : 0402 ~ 14mm(H12mm) 4. Electrically Driven High Speed and High Precision Feeder - Allows mixed use with an SM pneumatically driven feeder SMART Feeder - ...

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Chipbest Technology (Dongguan) Co., Ltd.

Diamond Member Since 2020

Audited Supplier

Business Type Manufacturer/Factory
Main Products Lithium -Ion Battery Production Equipment, Printing Machine Reflow Soldering Wave Solderi, Non -Standard Automation Custom Equipment, SMT Machine, Pick and Place Machine, Face Mask Making Machine, Women′s Sanitary Napkin Making Machine, Baby Diaper Machine, Package Machine, PPE Machines
Registered Capital 739010.91 USD
Plant Area 1350 square meters
Management System Certification ISO 9001, ISO 9000, ISO 14001, ISO 14000, GMP
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: one month

Mounter Comparison

	Automatic SMT Pick and Place Machine with 48 Feeders Contact Now	Da1201FC Automatic Die Bonding Flip Chip and Die Attach Bonder for Soic/So/Qfn/BGA/LGA Contact Now	Quick View Factory Wholesale Fully Automatic High-Speed Flip Chip and Die Bonding in One Machine Contact Now	Quick View Semiconductor Equipment Die Bonding Machine Fully Automatic Die Bonder for SIP/BGA/LGA/Qfn Contact Now	Quick View High Precision Pick and Place Machine Flip Chip Die Bonder Semiconductor Bonding Equipment Contact Now

Transaction Info
	Automatic SMT Pick and Place Machine with 48 Feeders Contact Now	Da1201FC Automatic Die Bonding Flip Chip and Die Attach Bonder for Soic/So/Qfn/BGA/LGA Contact Now	Quick View Factory Wholesale Fully Automatic High-Speed Flip Chip and Die Bonding in One Machine Contact Now	Quick View Semiconductor Equipment Die Bonding Machine Fully Automatic Die Bonder for SIP/BGA/LGA/Qfn Contact Now	Quick View High Precision Pick and Place Machine Flip Chip Die Bonder Semiconductor Bonding Equipment Contact Now
Price	US $ 5,000.00-65,000.00/ Piece	Negotiable	US $ 100,000.00-1,000,000.00/ Piece	US $ 100,000.00-1,000,000.00/ Piece	US $ 100,000.00-1,000,000.00/ Piece
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Payment Terms	T/T	T/T	T/T	T/T	T/T
Quality Control
Product Certification	CCC, FDA, RoHS, ISO, CE	RoHS, ISO, CE	ISO	ISO	ISO
Management System Certification	ISO 9001, ISO 9000, ISO 14001, ISO 14000, GMP	ISO 9001	ISO 9001	ISO 9001	ISO 9001
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	US$5 Million - US$10 Million	Above US$100 Million	Above US$100 Million	Above US$100 Million	Above US$100 Million
Business Model	OEM, ODM, Own Brand(CHIPBEST)	-	-	-	-
Average Lead Time	Off Season Lead Time: within 15 workdays Peak Season Lead Time: one month	Off Season Lead Time: 1-3 months Peak Season Lead Time: 1-3 months	Off Season Lead Time: 1-3 months Peak Season Lead Time: 1-3 months	Off Season Lead Time: 1-3 months Peak Season Lead Time: 1-3 months	Off Season Lead Time: 1-3 months Peak Season Lead Time: 1-3 months
Product Attributes
Specification	After-sales Service: 7X24 Hrs Online Technical Support; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter;	After-sales Service: Provided; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Product Name: Semiconductor Equipment; Feature 1: High Precision; Feature 2: High Efficiency; After-Sale Service: Provided;	After-sales Service: Provided; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Product Name: Semiconductor Equipment; Feature 1: Guaranteed Quality; Feature 2: Customized According to Needs; After-Sale Service: Provided;	After-sales Service: Provided; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Product Name: Semiconductor Equipment; Feature 1: Guaranteed Quality; Feature 2: Customized According to Needs; After-Sale Service: Provided;	After-sales Service: Provided; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Product Name: Semiconductor Equipment; Feature 1: Guaranteed Quality; Feature 2: Customized According to Needs; After-Sale Service: Provided;
Supplier Name	Chipbest Technology (Dongguan) Co., Ltd.	Jiangsu Himalaya Semiconductor Co., Ltd.	Jiangsu Himalaya Semiconductor Co., Ltd.	Jiangsu Himalaya Semiconductor Co., Ltd.	Jiangsu Himalaya Semiconductor Co., Ltd.
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