Prototype PCB 8.5 X 20cm Universal Matrix Printed Circuit Board

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

5 Pieces Negotiable

Sepcifications

  • Structure Standard
  • Dielectric Standard
  • Material Standard
  • Application Consumer Electronics
  • Flame Retardant Properties Standard
  • Processing Technology Standard
  • Production Process Standard
  • Base Material Aluminum
  • Insulation Materials Epoxy Resin
  • Brand Ckmcu
  • Transport Package ESD Bag
  • Specification PCB Module
  • Trademark CKMCU
  • Origin China
  • Sku 29029
  • MOQ 5
  • Delivery Time 7days
  • Support Customization Yes

Product Description

Return policy details Return policy details Buyers can return item(s) for a refund within 7 days from the day the item(s) were received, and the buyer is to afford the return shipping cost. The item(s) must be returned in the same exact condition as once it was delivered. Buyers may return the ...

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8.5*20cm Comparison
Transaction Info
Price Negotiable US $ 0.01-150.00/ Piece US $ 0.01-150.00/ Piece US $ 0.01-150.00/ Piece US $ 0.01-150.00/ Piece
Min Order 5 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Payment Terms L/C, T/T, D/P, Western Union, Paypal, Money Gram T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal
Quality Control
Management System Certification - ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets - North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - US$50 Million - US$100 Million US$50 Million - US$100 Million US$50 Million - US$100 Million US$50 Million - US$100 Million
Business Model - OEM OEM OEM OEM
Average Lead Time - Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Structure: Standard;
Dielectric: Standard;
Material: Standard;
Application: Consumer Electronics;
Flame Retardant Properties: Standard;
Processing Technology: Standard;
Production Process: Standard;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: Ckmcu;
Sku: 29029;
MOQ: 5;
Delivery Time: 7days;
Support Customization: Yes;
Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Min Component Size: 0201;
Min.Pin Space of IC: 0.3mm;
Min. Space of BGA: 0.3mm;
Max.Precision of IC Assembly: +/-0.03mm;
Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Brand: N/a;
Board Thickness: 2.0mm;
Mak: Green Solder Mask;
Surface: Hal-Lf;
Silk: White;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Brand: N/a;
Board Thickness: 1.6 mm;
Surface: Immersion Gold 2u'';
Solder Mask: Black;
Outer Copper: 2oz;
Inner Copper: 1oz;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: N/a;
Board Thickness: 3.2 mm;
Surface: Gold Plating 30u'';
Solder Mask: Green;
PCB Material: Fr4;
Supplier Name

Shenzhen Chipskey Technology Co., Ltd.

Gold Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier