Specification |
Application: Food, Promotion, Household, Chemical, Medicine Packaging;
Feature: Moisture Proof, Recyclable, Resealable;
Material: Laminated Material;
Shape: Stand up Pouch;
Making Process: Composite Packaging Bag;
Raw Materials: High Pressure Polyethylene Plastic Bag;
Bag Variety: Plastic Packaging Bag;
Materials: PE/PE;
Size: Customized Size;
Logo: Accept Customized Logo;
Place of Origin: China;
Printing: Gravure Printing;
Thickness: Customized;
Usage: Food Snacks Packaging;
Packing: Carton Packing;
MOQ: 10000PCS;
Design: Customized Design;
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Application: Food, Promotion, Household, Chemical, Apparel;
Feature: Moisture Proof, Recyclable, Bio-Degradable, Disposable, Shock Resistance, Antistatic, Water Proof;
Material: Laminated Material;
Shape: Flat Bottom Bag;
Making Process: Composite Packaging Bag;
Raw Materials: Pet/ Al/ PE;
Bag Variety: Upright Bag;
Size: 90mm X 260mm +60mm X 2;
MOQ: 10000 Pieces;
Delivery: 18-25 Days( According to The Quantity);
Payment: T/T, L/C;
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Application: Food, Promotion, Household;
Feature: Moisture Proof, Disposable, Shock Resistance, Antistatic, Water Proof;
Material: Laminated Material;
Shape: Square Bottom Bag;
Making Process: Composite Packaging Bag;
Raw Materials: Pet/ Al / PE;
Bag Variety: Upright Bag;
OEM: Available;
Logo: Accept Customized Logo Printing;
Product Name: Coffee Bag;
Printing: up to 10 Colors;
Design: Depend on Your Demand;
Size: Customized Size;
Samples: Available;
Price Term: CIF or Fob Jiangmen;
Usage: Coffee Package;
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Application: Electronic;
Feature: Moisture Proof, Antistatic;
Material: Laminated Material;
Shape: Seal Bag;
Making Process: Composite Packaging Bag;
Raw Materials: High Pressure Polyethylene Plastic Bag;
Bag Variety: Upright Bag;
Material Structure: Antistatic Plastic Film with Black Conductive Ink;
Thickness: 0.08-0.16mm;
Purpose: Electronics, Conductor, PCB, Chip, etc;
OEM: Available;
Performance: Anti-Static, Moisture Barrier;
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Application: Electronic;
Feature: Moisture Proof, Antistatic;
Material: Laminated Material;
Shape: Seal Bag;
Making Process: Composite Packaging Bag;
Raw Materials: High Pressure Polyethylene Plastic Bag;
Bag Variety: Upright Bag;
Material Structure: Antistatic Plastic Film with Black Conductive Ink;
Thickness: 0.08-0.16mm;
Purpose: Electronics, Conductor, PCB, Chip, etc;
OEM: Available;
Performance: Anti-Static, Moisture Barrier;
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