Specification |
Application: Aviation, Electronics, Industrial, Medical, Chemical;
Standard: JIS, GB, DIN, BS, ASTM, AISI, ISO 9001;
Purity: 44%;
Alloy: Alloy;
Type: CuNi Wire;
Powder: Not Powder;
Technique: Cold Drawing;
Treatment: Hydrogen Annealing;
Surface: Bright;
Condition: Soft Annealed;
Max Working Tem: 250c;
Resistivity: 0.15ohm/M;
Density: 8.9g/cm3;
TCR X10-6 / 0c (20~600 0c): <50;
Emf Vs Cu (μV/ 0c) (0~100 0c): -25;
Melting Point: 1100c;
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Application: Aviation, Electronics, Industrial;
Standard: GB/T 14992-2005;
Purity: Bal;
Alloy: Alloy;
Type: Powder;
Powder: Powder;
Cr: 20.0-23.0;
Mo: 8.0-10.0;
Nb: 3.15-4.15;
Fe: ≤5.0;
Si: ≤0.50;
Ni: Bal;
Ti: ≤0.40;
Al: ≤0.40;
C: ≤0.10;
Co: ≤1.00;
S: ≤0.015;
P: ≤0.015;
O: ≤0.01;
National Standard: GB/T 14992-2005;
Particle Size Distribution: 15-45μm 15-53μm 53-120μm 53-150μm;
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Application: Aviation, Electronics, Industrial;
Standard: GB/T 14992-2005;
Purity: Bal;
Alloy: Alloy;
Type: Powder;
Powder: Powder;
Cr: 22.0-22.8;
Co: 18.5-19.5;
W: 1.8-2.2;
Nb: 0.9-1.1;
Ta: 1.3-1.5;
Ti: 3.6-3.8;
Al: 1.8-2.0;
Zr: 0.05-1.4;
Ni: Bal;
C: 0.13-0.17;
B: 0.004-0.012;
N: ≤0.001;
S: ≤0.001;
Pb: ≤0.001;
Bi: ≤0.001;
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Application: Aviation, Electronics, Industrial;
Standard: GB/T 14992-2005;
Purity: Bal;
Alloy: Alloy;
Type: Powder;
Powder: Powder;
Cr: 32.0-35.0;
W: 4.3-5.5;
Mo: 2.3-3.5;
Al: 0.7-1.3;
Nb: 0.7-1.3;
Fe: ≤0.5;
C: 0.03-0.1;
B: ≤ 0.008;
CE: ≤0.30;
Si: ≤0.30;
S: ≤0.01;
Y: ≤0.04;
Ca: ≤0.02;
O: ≤0.02;
National Standard: GB/T 14992-2005;
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Application: Aviation, Electronics, Aviation, Electronics, Industrial, Medical, Chemical;
Standard: JIS, DIN, JIS, GB, DIN, BS, ASTM, AISI;
Purity: >99.5%, >98%;
Alloy: Non-alloy, Non-Alloy;
Type: Nickel Plate, Nickel Plate;
Powder: Not Powder, Not Powder;
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