L3+
US$375.00-466.00 / Piece
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What is in Stock L3+ Server Host Goge 600mh 850W VGA Card Rtx 3070 Ltc Mine L3 L3+ L3++

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$375.00-466.00 / Piece

Sepcifications

  • Graphics Card Dedicated Graphics Card
  • Video Memory Capacity 8GB
  • Interface Type PCI Express 4.0 16X
  • Video Memory Type Gddr6
  • Output Type HDMI
  • Chip AMD
  • Memory Bus 256 Bit
  • Bus Standard PCI Express 4.0
  • Heat Dispatch Method Dual Fan Cooling
  • 3D API Directx 12 Ultimate, Opengl 4.6
  • Transport Package with Original Package
  • Specification 242× 223mm
  • Trademark Brand Mix
  • Origin Shenzhen China
  • Model L3+ (600mh)
  • Release October 2017
  • Size 188 X 130 X 352mm
  • Weight 4400g
  • Chip Boards 4
  • Chip Name Bm1485
  • Chip Count 288
  • Noise Level 75dB
  • Fan(S) 2
  • Power 850W
  • Wires 9 * 6pins
  • Voltage 11.6 ~ 13.0V
  • Interface Ethernet
  • Temperature 0 - 40 °c
  • Humidity 5 - 95 %

Product Description

Product Description In Stock L3+ Server Host Goge 600Mh 850W Vga Card Rtx 3070 Ltc Mine L3 L3+ L3++ Model L3+ (600Mh) is Scrypt algorithm with a maximum hashrate of 600Mh/s for a power consumption of 850W. Asic Mine L3+ Detailed Description: Model L3+ (600Mh) Release October 2017 Size 188 ...

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L3+ Comparison
Transaction Info
Price US $ 375.00-466.00/ Piece US $ 450.00-500.00/ Piece US $ 450.00-500.00/ Piece US $ 450.00-500.00/ Piece US $ 1,100.00-1,200.00/ Piece
Min Order 1 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Trade Terms - - - - -
Payment Terms T/T, VISA, MasterCard T/T T/T T/T T/T
Quality Control
Management System Certification ISO 9001 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949, HSE, ISO 14064, QC 080000, GMP, BSCI, BRC, SA 8000, QHSE, HACCP, BS 25999-2, ISO 13485, EICC, ANSI/ESD, ISO 22000, AIB, WRAP, GAP, ASME, ISO 29001, BREEAM, HQE, SHE Audits, IFS, QSR, ISO 50001, LEED, PAS 28000, FSC, ISO 10012, ISO 17025 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949, HSE, ISO 14064, QC 080000, GMP, BSCI, BRC, SA 8000, QHSE, HACCP, BS 25999-2, ISO 13485, EICC, ANSI/ESD, ISO 22000, AIB, WRAP, GAP, ASME, ISO 29001, BREEAM, HQE, SHE Audits, IFS, QSR, ISO 50001, LEED, PAS 28000, FSC, ISO 10012, ISO 17025 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949, HSE, ISO 14064, QC 080000, GMP, BSCI, BRC, SA 8000, QHSE, HACCP, BS 25999-2, ISO 13485, EICC, ANSI/ESD, ISO 22000, AIB, WRAP, GAP, ASME, ISO 29001, BREEAM, HQE, SHE Audits, IFS, QSR, ISO 50001, LEED, PAS 28000, FSC, ISO 10012, ISO 17025 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949, HSE, ISO 14064, QC 080000, GMP, BSCI, BRC, SA 8000, QHSE, HACCP, BS 25999-2, ISO 13485, EICC, ANSI/ESD, ISO 22000, AIB, WRAP, GAP, ASME, ISO 29001, BREEAM, HQE, SHE Audits, IFS, QSR, ISO 50001, LEED, PAS 28000, FSC, ISO 10012, ISO 17025
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea) North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea) North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea) North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea)
Annual Export Revenue US $5 Million - US $10 Million - - - -
Business Model OEM, ODM, Own Brand OEM, ODM, Own Brand OEM, ODM, Own Brand OEM, ODM, Own Brand OEM, ODM, Own Brand
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Graphics Card: Dedicated Graphics Card;
Video Memory Capacity: 8GB;
Interface Type: PCI Express 4.0 16X;
Video Memory Type: Gddr6;
Output Type: HDMI;
Chip: AMD;
Memory Bus: 256 Bit;
Bus Standard: PCI Express 4.0;
Heat Dispatch Method: Dual Fan Cooling;
3D API: Directx 12 Ultimate, Opengl 4.6;
Model: L3+ (600mh);
Release: October 2017;
Size: 188 X 130 X 352mm;
Weight: 4400g;
Chip Boards: 4;
Chip Name: Bm1485;
Chip Count: 288;
Noise Level: 75dB;
Fan(S): 2;
Power: 850W;
Wires: 9 * 6pins;
Voltage: 11.6 ~ 13.0V;
Interface: Ethernet;
Temperature: 0 - 40 °c;
Humidity: 5 - 95 %;
Graphics Card: Integrated Graphics Card;
Video Memory Capacity: 512 MB;
Interface Type: PCI Express 3.0 16X;
Video Memory Type: DDR5;
Output Type: VGA;
Chip: AMD;
Memory Bus: 512 Bit;
Bus Standard: PCI Express 2.0;
Heat Dispatch Method: Fan HeatSink;
3D API: DirectX 11;
Brand: Msi/Gigabyte/Colorful;
Graphics Processing: Rtx 3070;
Graphics Chip: Ga104;
Memory Size: 8GB;
Power Connectors: 8 Pin*2;
Cuda Core: 5888;
Card Size: Card Sizetl=319 W=140 H=70 mm;
Video Memory Bit Width: 256 Bit;
Video Memory Frequency: 14gbps;
Memory Type: Gddr6;
Graphics Card: Integrated Graphics Card;
Video Memory Capacity: 512 MB;
Interface Type: PCI Express 3.0 16X;
Video Memory Type: DDR5;
Output Type: VGA;
Chip: AMD;
Memory Bus: 512 Bit;
Bus Standard: PCI Express 2.0;
Heat Dispatch Method: Fan HeatSink;
3D API: DirectX 11;
Brand: Msi/Gigabyte/Colorful;
Graphics Processing: Rtx 3070;
Graphics Chip: Ga104;
Memory Size: 8GB;
Power Connectors: 8 Pin*2;
Cuda Core: 5888;
Card Size: Card Sizetl=319 W=140 H=70 mm;
Video Memory Bit Width: 256 Bit;
Video Memory Frequency: 14gbps;
Memory Type: Gddr6;
Graphics Card: Integrated Graphics Card;
Video Memory Capacity: 512 MB;
Interface Type: PCI Express 3.0 16X;
Video Memory Type: DDR5;
Output Type: VGA;
Chip: AMD;
Memory Bus: 512 Bit;
Bus Standard: PCI Express 2.0;
Heat Dispatch Method: Fan HeatSink;
3D API: DirectX 11;
Brand: Msi/Gigabyte/Colorful;
Graphics Processing: Rtx 3070;
Graphics Chip: Ga104;
Memory Size: 8GB;
Power Connectors: 8 Pin*2;
Cuda Core: 5888;
Card Size: Card Sizetl=319 W=140 H=70 mm;
Video Memory Bit Width: 256 Bit;
Video Memory Frequency: 14gbps;
Memory Type: Gddr6;
Graphics Card: Integrated Graphics Card;
Video Memory Capacity: 512 MB;
Interface Type: PCI Express 3.0 16X;
Video Memory Type: DDR5;
Output Type: VGA;
Chip: AMD;
Memory Bus: 512 Bit;
Bus Standard: PCI Express 2.0;
Heat Dispatch Method: Fan HeatSink;
3D API: DirectX 11;
Brand: Msi/Gigabyte/Colorful;
Graphics Processing: Geforce Rtx™ 3090;
Core Clock: 1785 MHz;
Memory Size: 24GB;
Power Connectors: 8 Pin*2;
Memory Clock: 19500 MHz;
Card Size: Card Sizetl=319 W=140 H=70 mm;
Memory Bandwidth (GB/Sec): 936 GB/S;
Cuda® Cores: 10496;
Memory Type: Gddr6X;
Supplier Name

Shenzhen Dovina Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Jingang Zhuoyue Technology Limited

China Supplier - Gold Member Audited Supplier

Shenzhen Jingang Zhuoyue Technology Limited

China Supplier - Gold Member Audited Supplier

Shenzhen Jingang Zhuoyue Technology Limited

China Supplier - Gold Member Audited Supplier

Shenzhen Jingang Zhuoyue Technology Limited

China Supplier - Gold Member Audited Supplier