L7
US$271.00-6,775.00 / Piece
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What is Best Doge Machine L7 9.5gh 3425W GPU Card Rtx 3050 Ltc Asic Mine L7 L3+ S19 E9

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$271.00-6,775.00 / Piece

Sepcifications

  • Graphics Card Integrated Graphics Card
  • Video Memory Capacity 8GB
  • Interface Type PCI Express 4.0 X8
  • Video Memory Type Gddr6
  • Output Type HDMI
  • Chip AMD
  • Memory Bus 128 Bit
  • Bus Standard PCI Express 4.0
  • Heat Dispatch Method Fan HeatSink
  • 3D API Directx 12, Opengl 4.6
  • Transport Package with Original Package
  • Specification 195 x 290 x 370mm
  • Trademark Brand Mix
  • Origin Shenzhen China
  • Model L7
  • Release November 2021
  • Size 195 X 290 X 370mm
  • Weight 15000g
  • Noise Level 75dB
  • Fan(S) 4
  • Power 3425W
  • Interface Ethernet
  • Temperature 5 - 45°
  • Humidity 5 - 95 %

Product Description

Product Description Best Doge Machine L7 9.5Gh 3425W Gpu Card Rtx 3050 Ltc Asic Mine L7 L3+ S19 E9 Model L7 (9.5Gh) is Scrypt algorithm with a maximum hashrate of 9.5Gh/s for a power consumption of 3425W. Server Host L7 Detailed Description: Model L7 (9.5Gh) Also known as L7 9500Mh Release ...

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L7 Comparison
Transaction Info
Price US $ 271.00-6,775.00/ Piece US $ 400.00-500.00/ Piece US $ 400.00-500.00/ Piece US $ 1,100.00-1,200.00/ Piece US $ 1,100.00-1,200.00/ Piece
Min Order 1 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Trade Terms - - - - -
Payment Terms T/T, Western Union, btc, usdt, eth T/T T/T T/T T/T
Quality Control
Management System Certification ISO 9001 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949, HSE, ISO 14064, QC 080000, GMP, BSCI, BRC, SA 8000, QHSE, HACCP, BS 25999-2, ISO 13485, EICC, ANSI/ESD, ISO 22000, AIB, WRAP, GAP, ASME, ISO 29001, BREEAM, HQE, SHE Audits, IFS, QSR, ISO 50001, LEED, PAS 28000, FSC, ISO 10012, ISO 17025 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949, HSE, ISO 14064, QC 080000, GMP, BSCI, BRC, SA 8000, QHSE, HACCP, BS 25999-2, ISO 13485, EICC, ANSI/ESD, ISO 22000, AIB, WRAP, GAP, ASME, ISO 29001, BREEAM, HQE, SHE Audits, IFS, QSR, ISO 50001, LEED, PAS 28000, FSC, ISO 10012, ISO 17025 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949, HSE, ISO 14064, QC 080000, GMP, BSCI, BRC, SA 8000, QHSE, HACCP, BS 25999-2, ISO 13485, EICC, ANSI/ESD, ISO 22000, AIB, WRAP, GAP, ASME, ISO 29001, BREEAM, HQE, SHE Audits, IFS, QSR, ISO 50001, LEED, PAS 28000, FSC, ISO 10012, ISO 17025 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949, HSE, ISO 14064, QC 080000, GMP, BSCI, BRC, SA 8000, QHSE, HACCP, BS 25999-2, ISO 13485, EICC, ANSI/ESD, ISO 22000, AIB, WRAP, GAP, ASME, ISO 29001, BREEAM, HQE, SHE Audits, IFS, QSR, ISO 50001, LEED, PAS 28000, FSC, ISO 10012, ISO 17025
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea) North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea) North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea) North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea)
Annual Export Revenue US $5 Million - US $10 Million - - - -
Business Model OEM, ODM, Own Brand OEM, ODM, Own Brand OEM, ODM, Own Brand OEM, ODM, Own Brand OEM, ODM, Own Brand
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Graphics Card: Integrated Graphics Card;
Video Memory Capacity: 8GB;
Interface Type: PCI Express 4.0 X8;
Video Memory Type: Gddr6;
Output Type: HDMI;
Chip: AMD;
Memory Bus: 128 Bit;
Bus Standard: PCI Express 4.0;
Heat Dispatch Method: Fan HeatSink;
3D API: Directx 12, Opengl 4.6;
Model: L7;
Release: November 2021;
Size: 195 X 290 X 370mm;
Weight: 15000g;
Noise Level: 75dB;
Fan(S): 4;
Power: 3425W;
Interface: Ethernet;
Temperature: 5 - 45°;
Humidity: 5 - 95 %;
Graphics Card: Integrated Graphics Card;
Video Memory Capacity: 512 MB;
Interface Type: PCI Express 3.0 16X;
Video Memory Type: DDR5;
Output Type: VGA;
Chip: AMD;
Memory Bus: 512 Bit;
Bus Standard: PCI Express 2.0;
Heat Dispatch Method: Fan HeatSink;
3D API: DirectX 11;
Brand: OEM;
Graphics Processing: A4000;
Core Clock: 3584;
Memory Size: 12GB;
Power Connectors: 2*8pin;
Base Frequency: Base:1320MHz; Boost:1777MHz;
Card Size: Card Sizetl=319 W=140 H=70 mm;
Memory Bandwidth (GB/Sec): 192 Bit;
Cuda® Cores: 10496;
Memory Type: Gddr6X;
Graphics Card: Integrated Graphics Card;
Video Memory Capacity: 512 MB;
Interface Type: PCI Express 3.0 16X;
Video Memory Type: DDR5;
Output Type: VGA;
Chip: AMD;
Memory Bus: 512 Bit;
Bus Standard: PCI Express 2.0;
Heat Dispatch Method: Fan HeatSink;
3D API: DirectX 11;
Brand: OEM;
Graphics Processing: A4000;
Core Clock: 3584;
Memory Size: 12GB;
Power Connectors: 2*8pin;
Base Frequency: Base:1320MHz; Boost:1777MHz;
Card Size: Card Sizetl=319 W=140 H=70 mm;
Memory Bandwidth (GB/Sec): 192 Bit;
Cuda® Cores: 10496;
Memory Type: Gddr6X;
Graphics Card: Integrated Graphics Card;
Video Memory Capacity: 512 MB;
Interface Type: PCI Express 3.0 16X;
Video Memory Type: DDR5;
Output Type: VGA;
Chip: AMD;
Memory Bus: 512 Bit;
Bus Standard: PCI Express 2.0;
Heat Dispatch Method: Fan HeatSink;
3D API: DirectX 11;
Brand: Msi/Gigabyte/Colorful;
Graphics Processing: Geforce Rtx™ 3090;
Core Clock: 1785 MHz;
Memory Size: 24GB;
Power Connectors: 8 Pin*2;
Memory Clock: 19500 MHz;
Card Size: Card Sizetl=319 W=140 H=70 mm;
Memory Bandwidth (GB/Sec): 936 GB/S;
Cuda® Cores: 10496;
Memory Type: Gddr6X;
Graphics Card: Integrated Graphics Card;
Video Memory Capacity: 512 MB;
Interface Type: PCI Express 3.0 16X;
Video Memory Type: DDR5;
Output Type: VGA;
Chip: AMD;
Memory Bus: 512 Bit;
Bus Standard: PCI Express 2.0;
Heat Dispatch Method: Fan HeatSink;
3D API: DirectX 11;
Brand: Msi/Gigabyte/Colorful;
Graphics Processing: Geforce Rtx™ 3090;
Core Clock: 1785 MHz;
Memory Size: 24GB;
Power Connectors: 8 Pin*2;
Memory Clock: 19500 MHz;
Card Size: Card Sizetl=319 W=140 H=70 mm;
Memory Bandwidth (GB/Sec): 936 GB/S;
Cuda® Cores: 10496;
Memory Type: Gddr6X;
Supplier Name

Shenzhen Dovina Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Jingang Zhuoyue Technology Limited

China Supplier - Gold Member Audited Supplier

Shenzhen Jingang Zhuoyue Technology Limited

China Supplier - Gold Member Audited Supplier

Shenzhen Jingang Zhuoyue Technology Limited

China Supplier - Gold Member Audited Supplier

Shenzhen Jingang Zhuoyue Technology Limited

China Supplier - Gold Member Audited Supplier