L3+
US$140.00-750.00 / Piece
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What is Efficient L3+ 504mh 800W Ltc Mine Computer GPU Rx 5700 Xt Doge Asic Rig L3+ L3++ L3 L7

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$140.00-750.00 / Piece

Sepcifications

  • Graphics Card Dedicated Graphics Card
  • Video Memory Capacity 8GB
  • Interface Type PCI Express 4.0 16X
  • Video Memory Type Gddr6
  • Output Type HDMI
  • Chip AMD
  • Memory Bus 256 Bit
  • Bus Standard PCI Express 4.0
  • Heat Dispatch Method Fan HeatSink
  • 3D API Directx 12, Opengl 4.6
  • Transport Package Factory Original Package
  • Specification 188 x 130 x 352mm
  • Trademark Brand Mix
  • Origin Shenzhen China
  • Model L3+ (600mh)
  • Release October 2017
  • Weight 4400g
  • Chip Boards 4
  • Chip Name Bm1485
  • Chip Count 288
  • Noise Level 75dB
  • Fan(S) 2
  • Power 850W
  • Wires 9 * 6pins
  • Voltage 11.6 ~ 13.0V
  • Interface Ethernet
  • Temperature 0 - 40 °c
  • Humidity 5 - 95 %
  • Additionnal Infos Overclocked L3+

Product Description

Product Description Efficient L3+ 504Mh 800W Ltc Mine Computer Gpu Rx 5700 Xt Doge Asic Rig L3+ l3++ L3 L7 Model L3+ (600Mh) is Scrypt algorithm with a maximum hashrate of 600Mh/s for a power consumption of 850W. Asic Mine L3+ Detailed Description: Model L3+ (600Mh) Release October 2017 ...

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L3+ Comparison
Transaction Info
Price US $ 140.00-750.00/ Piece US $ 1,025.00-1,038.00/ Piece US $ 1,025.00-1,038.00/ Piece US $ 1,025.00-1,038.00/ Piece US $ 1,025.00-1,038.00/ Piece
Min Order 1 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Trade Terms - - - - -
Payment Terms T/T, VISA, MasterCard L/C, T/T, Western Union, Paypal L/C, T/T, Western Union, Paypal L/C, T/T, Western Union, Paypal L/C, T/T, Western Union, Paypal
Quality Control
Management System Certification ISO 9001 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949, HSE, ISO 14064, QC 080000, GMP, BSCI, BRC, SA 8000, QHSE, HACCP, BS 25999-2, ISO 13485, EICC, ANSI/ESD, ISO 22000, AIB, WRAP, GAP, ASME, ISO 29001, BREEAM, HQE, SHE Audits, IFS, QSR, ISO 50001, LEED, PAS 28000, FSC, ISO 10012, ISO 17025 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949, HSE, ISO 14064, QC 080000, GMP, BSCI, BRC, SA 8000, QHSE, HACCP, BS 25999-2, ISO 13485, EICC, ANSI/ESD, ISO 22000, AIB, WRAP, GAP, ASME, ISO 29001, BREEAM, HQE, SHE Audits, IFS, QSR, ISO 50001, LEED, PAS 28000, FSC, ISO 10012, ISO 17025 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949, HSE, ISO 14064, QC 080000, GMP, BSCI, BRC, SA 8000, QHSE, HACCP, BS 25999-2, ISO 13485, EICC, ANSI/ESD, ISO 22000, AIB, WRAP, GAP, ASME, ISO 29001, BREEAM, HQE, SHE Audits, IFS, QSR, ISO 50001, LEED, PAS 28000, FSC, ISO 10012, ISO 17025 ISO 9001, ISO 9000, ISO 14001, ISO 14000, ISO 20000, OHSAS/ OHSMS 18001, IATF16949, HSE, ISO 14064, QC 080000, GMP, BSCI, BRC, SA 8000, QHSE, HACCP, BS 25999-2, ISO 13485, EICC, ANSI/ESD, ISO 22000, AIB, WRAP, GAP, ASME, ISO 29001, BREEAM, HQE, SHE Audits, IFS, QSR, ISO 50001, LEED, PAS 28000, FSC, ISO 10012, ISO 17025
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea) North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea) North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea) North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea)
Annual Export Revenue US $5 Million - US $10 Million - - - -
Business Model OEM, ODM, Own Brand OEM, ODM, Own Brand OEM, ODM, Own Brand OEM, ODM, Own Brand OEM, ODM, Own Brand
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Graphics Card: Dedicated Graphics Card;
Video Memory Capacity: 8GB;
Interface Type: PCI Express 4.0 16X;
Video Memory Type: Gddr6;
Output Type: HDMI;
Chip: AMD;
Memory Bus: 256 Bit;
Bus Standard: PCI Express 4.0;
Heat Dispatch Method: Fan HeatSink;
3D API: Directx 12, Opengl 4.6;
Model: L3+ (600mh);
Release: October 2017;
Weight: 4400g;
Chip Boards: 4;
Chip Name: Bm1485;
Chip Count: 288;
Noise Level: 75dB;
Fan(S): 2;
Power: 850W;
Wires: 9 * 6pins;
Voltage: 11.6 ~ 13.0V;
Interface: Ethernet;
Temperature: 0 - 40 °c;
Humidity: 5 - 95 %;
Additionnal Infos: Overclocked L3+;
Graphics Card: Integrated Graphics Card;
Video Memory Capacity: ≥2GB;
Interface Type: PCI Express 4.0 16X;
Video Memory Type: Gddr6X;
Output Type: VGA;
Chip: nVIDIA;
Memory Bus: 384 Bit;
Bus Standard: PCI-E 16X;
Heat Dispatch Method: Fan HeatSink;
3D API: Directx 12;
Brand: Msi/Gigabyte/Colorful/Asus;
Graphics Processing: Geforce Rtx 3090;
Core Clock: 1725 MHz;
Memory Size: 24GB;
Power Connectors: 8 Pin*2;
Memory Clock: 19500 MHz;
Card Size: Card Sizetl=319 W=140 H=58 mm;
Memory Bandwidth (GB/Sec): 936 GB/S;
Cuda® Cores: 10496;
Memory Type: Gddr6X;
Graphics Card: Integrated Graphics Card;
Video Memory Capacity: ≥2GB;
Interface Type: PCI Express 4.0 16X;
Video Memory Type: Gddr6X;
Output Type: VGA;
Chip: nVIDIA;
Memory Bus: 384 Bit;
Bus Standard: PCI-E 16X;
Heat Dispatch Method: Fan HeatSink;
3D API: Directx 12;
Brand: Msi/Gigabyte/Colorful/Asus;
Graphics Processing: Geforce Rtx 3090;
Core Clock: 1725 MHz;
Memory Size: 24GB;
Power Connectors: 8 Pin*2;
Memory Clock: 19500 MHz;
Card Size: Card Sizetl=319 W=140 H=58 mm;
Memory Bandwidth (GB/Sec): 936 GB/S;
Cuda® Cores: 10496;
Memory Type: Gddr6X;
Graphics Card: Integrated Graphics Card;
Video Memory Capacity: ≥2GB;
Interface Type: PCI Express 4.0 16X;
Video Memory Type: Gddr6X;
Output Type: VGA;
Chip: nVIDIA;
Memory Bus: 384 Bit;
Bus Standard: PCI-E 16X;
Heat Dispatch Method: Fan HeatSink;
3D API: Directx 12;
Brand: Msi/Gigabyte/Colorful/Asus;
Graphics Processing: Geforce Rtx 3090;
Core Clock: 1725 MHz;
Memory Size: 24GB;
Power Connectors: 8 Pin*2;
Memory Clock: 19500 MHz;
Card Size: Card Sizetl=319 W=140 H=58 mm;
Memory Bandwidth (GB/Sec): 936 GB/S;
Cuda® Cores: 10496;
Memory Type: Gddr6X;
Graphics Card: Integrated Graphics Card;
Video Memory Capacity: ≥2GB;
Interface Type: PCI Express 4.0 16X;
Video Memory Type: Gddr6X;
Output Type: VGA;
Chip: nVIDIA;
Memory Bus: 384 Bit;
Bus Standard: PCI-E 16X;
Heat Dispatch Method: Fan HeatSink;
3D API: Directx 12;
Brand: Msi/Gigabyte/Colorful/Asus;
Graphics Processing: Geforce Rtx 3090;
Core Clock: 1725 MHz;
Memory Size: 24GB;
Power Connectors: 8 Pin*2;
Memory Clock: 19500 MHz;
Card Size: Card Sizetl=319 W=140 H=58 mm;
Memory Bandwidth (GB/Sec): 936 GB/S;
Cuda® Cores: 10496;
Memory Type: Gddr6X;
Supplier Name

Shenzhen Dovina Electronic Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Jingang Zhuoyue Technology Limited

China Supplier - Gold Member Audited Supplier

Shenzhen Jingang Zhuoyue Technology Limited

China Supplier - Gold Member Audited Supplier

Shenzhen Jingang Zhuoyue Technology Limited

China Supplier - Gold Member Audited Supplier

Shenzhen Jingang Zhuoyue Technology Limited

China Supplier - Gold Member Audited Supplier