Specification |
Application: Cutting, Grooving, Dicing of Wafers;
Feature: Fast Cutting, Long Diamond Life, No Chipping;
Bond: Special Bond Design;
Cutting Condition: Wet;
Thickness: 0.002"-0.008";
Diameter: 10mm-80mm;
Core/Body: No Core;
Advantage: Highly Durable;
Manufacturer: E-Grind;
Packing: Box;
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Blade Type: Continuous Boundary;
Manufacturing Process: ODM / OEM;
Application: Ceramic, Concrete, Metal;
Product Name: Saw Blade Series for Aluminum Alloy;
Precision: High Precision;
Cutting Material: Particle Board, Chipboard, MDF, HPL;
Coating: Uncoated,Customize;
Blade Width: 3.2mm/4.4mm/4.8mm;
Process Type: PCD/Diamond,Customize;
Customized Support: OEM, ODM, Obm;
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Blade Type: Continuous Boundary;
Manufacturing Process: ODM / OEM;
Application: Ceramic, Concrete, Metal;
Product Name: Saw Blade Series for Aluminum Alloy;
Precision: High Precision;
Cutting Material: Particle Board, Chipboard, MDF, HPL;
Coating: Uncoated,Customize;
Blade Width: 3.2mm/4.4mm/4.8mm;
Process Type: PCD/Diamond,Customize;
Customized Support: OEM, ODM, Obm;
|
Blade Type: Continuous Boundary;
Manufacturing Process: ODM / OEM;
Application: Ceramic, Concrete, Metal;
Product Name: Saw Blade Series for Aluminum Alloy;
Precision: High Precision;
Cutting Material: Particle Board, Chipboard, MDF, HPL;
Coating: Uncoated,Customize;
Blade Width: 3.2mm/4.4mm/4.8mm;
Process Type: PCD/Diamond,Customize;
Customized Support: OEM, ODM, Obm;
|
Blade Type: Continuous Boundary;
Manufacturing Process: ODM / OEM;
Application: Ceramic, Concrete, Metal;
Product Name: Saw Blade Series for Aluminum Alloy;
Precision: High Precision;
Cutting Material: Particle Board, Chipboard, MDF, HPL;
Coating: Uncoated,Customize;
Blade Width: 3.2mm/4.4mm/4.8mm;
Process Type: PCD/Diamond,Customize;
Customized Support: OEM, ODM, Obm;
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