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New and Original Electronic Components IC Chip Es2m Video

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

500 Pieces Negotiable

Sepcifications

  • shape DIP
  • Conductive Type Unipolar Integrated Circuit
  • Transport Package Carton Box
  • Specification 22x17
  • Trademark EDT
  • Origin Zhejiang
  • Supply Ability 1000000 Piece/Pieces Per Month
  • Minimum Packing Quantity 2500 PCS
  • Minimum Packing Gross 0.62 Kg
  • Country of Original China
  • Manufacture Year 2021

Product Description

Overview Quick Details Model Number: ES2M Type: integrated circuit Place of Origin: Guangdong, China Brand Name: NSGD Applications: Industrial Application Supply Ability Supply Ability 1000000 ...

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IC Comparison
Transaction Info
Price Negotiable Negotiable US $ 0.018-0.02/ Piece Negotiable Negotiable
Min Order 500 Pieces 5 Pieces 10 Pieces 5 Pieces 5 Pieces
Trade Terms - - - - -
Payment Terms T/T, D/P, Paypal T/T, D/P, Western Union, Paypal, Money Gram L/C, T/T, D/P, Western Union, Paypal, Money Gram T/T, D/P, Western Union, Paypal, Money Gram T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Management System Certification ISO 9001, ISO 14001, IATF16949, HSE - - - -
Trade Capacity
Export Markets South America, Eastern Europe, Southeast Asia, Mid East, Western Europe North America, Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, Europe North America, Europe
Annual Export Revenue - - - - -
Business Model OEM, ODM OEM OEM, ODM OEM OEM
Average Lead Time Off-season: within 15 Day(s)
Peak-season: 1 Month(s)
- Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
- -
Product Attributes
Specification
shape: DIP;
Conductive Type: Unipolar Integrated Circuit;
Supply Ability: 1000000 Piece/Pieces Per Month;
Minimum Packing Quantity: 2500 PCS;
Minimum Packing Gross: 0.62 Kg;
Country of Original: China;
Manufacture Year: 2021;
shape: New;
Conductive Type: Unipolar Integrated Circuit;
Integration: GSI;
Technics: Thick Film IC;
Features1: Glass Passivated Chip;
Features2: Low Forward Voltage Drop;
Features3: Ideal for Printed Circuit Board;
Features4: High Surge Current Capability;
shape: New;
Conductive Type: Unipolar Integrated Circuit;
Integration: GSI;
Technics: Thick Film IC;
shape: New;
Conductive Type: Unipolar Integrated Circuit;
Integration: GSI;
Technics: Thick Film IC;
Supplier Name

Hangzhou Electric Driving Technology Co., Ltd.

China Supplier - Gold Member Audited Supplier

Shenzhen Heartsea Technology Co., Ltd.

China Supplier - Gold Member Audited Supplier

Dongguan Merry Electronic Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Heartsea Technology Co., Ltd.

China Supplier - Gold Member Audited Supplier

Shenzhen Heartsea Technology Co., Ltd.

China Supplier - Gold Member Audited Supplier