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Min. Order Reference FOB Price
1 Piece US$70,000.00-135,000.00 / Piece
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Dongguan ICT Technology Co.,Ltd.
Diamond Member Since 2013
Audited Supplier
Samsung Pick and Place Machine 481 Plus for SMT Line
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Semiconductor Packaging Equipment Package Bonder for Tcb Ncp/Ncf/Tc-Cuf C2 and C4 and Fo-Wlp Chip-to-Substrate Bonding
High-Speed Wafer Bonding Machine Clip Bonder with Automatic Glue Filling Function
IC High-Speed Fully Automatic Wafer Die Bonder Machine with Highly Accurate Die Rotation System
Factory Wholesale Price High-Precision Linear Driven Bond Head Die Bonder Die Bonding Machine
Jiangsu Himalaya Semiconductor Co., Ltd.