| Specification |
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Product Type: PCB Assembly;
Min.Hole Size: 0.12mm;
Solder Mask Colour: Green, Blue, White, Black, Yellow, Red etc;
Surface Finish: HASL, Enig, OSP, Gold Finger;
Min Trace Width/Space: 0.075/0.075mm;
Copper Thickness: 1 - 12 Oz;
Assembly Modes: SMT, DIP, Through Hole;
Application Field: LED, Medical, Industrial, Control Board;
Samples Run: Available;
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Metal Coating: Copper/Tin/Gold/Silver/HASL/OSP/Enig;
Mode of Production: SMT and DIP;
Layers: Multilayer;
Base Material: Fr-4/ High Tg Fr-4/ Aluminum/ Ceramic/ Copper/ Hal;
Customized: Customized;
Condition: New;
Service: PCB+Assembly+Components;
Solder Mask Color: White.Black.Yellow.Green.Red.Blue;
Testing Service: Electrical Testing, Functional Testing;
Min. Hole Size: 0.15mm;
Min. Line Spacing: 0.075---0.09mm;
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Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer, Multilayer;
Base Material: FR-4, Copper;
Customized: Customized;
Condition: Used;
Type: Rigid Circuit Board;
Dielectric: Fr-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Insulation Materials: Epoxy Resin;
Brand: Szx;
Solder Marsk: Green, Black, Blue, Red, Yellow, White;
Hole: Mechanical Hole, Laser Hole;
Assembly: Components;
Processing: SMT and DIP;
Surface Treatment: HASL, Immersion Gold, OSP;
Service Providing: PCB Production, PCB Assembly, Components Sourcing;
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Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer, Multilayer;
Base Material: FR-4, Copper;
Customized: Customized;
Condition: Used;
Type: Rigid Circuit Board;
Dielectric: Fr-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Insulation Materials: Epoxy Resin;
Brand: Szx;
Solder Marsk: Green, Black, Blue, Red, Yellow, White;
Hole: Mechanical Hole, Laser Hole;
Assembly: Components;
Processing: SMT and DIP;
Surface Treatment: HASL, Immersion Gold, OSP;
Service Providing: PCB Production, PCB Assembly, Components Sourcing;
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Metal Coating: Tin;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: PCB;
Customized: Non-Customized;
Condition: New;
Type: Demo Board;
CPU: Broadcom Bcm2710A1 Quad-Core 64-Bit Soc;
Sdram: 512MB Lpddr2 Sdram;
Bluetooth: Bluetooth 4.2;
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