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What is Fr4 1.6mm BGA Gold Finger Multilayer PCB Solutions From Shenzhen Factory

Name: Fr4 1.6mm BGA Gold Finger Multilayer PCB Solutions From Shenzhen Factory
Uploaded: 2023-10-19T14:33:39+08:00
Description: Founded in 2001,Exceeding Electronics Group Ltd,provides world-class customer support services. We are an industry lead in automotive, telecommunications, computer, industrial control, medical and p

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About this Item

Price

Min. Order Reference FOB Price

1 Piece US$0.10-15.00 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Computer
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Aluminum
Insulation Materials Epoxy Resin
Brand EEG
Transport Package Vacuum
Specification ENIG
Trademark EEG
Origin Made in China

Product Description

Founded in 2001,Exceeding Electronics Group Ltd,provides world-class customer support services. We are an industry lead in automotive, telecommunications, computer, industrial control, medical and power and energy PCB. Buyers from international markets choose to source from us because of our ...

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EXCEEDING ELECTRONICS GROUP LIMITED

Diamond Member Since 2021

Audited Supplier

Business Type Manufacturer/Factory
Business Range Electrical & Electronics
Main Products PCB FPC PCB Assembly LED PCB Aluminum PCB HDI, High Frequency Board, High Frequency PCB
Type of Ownership Limited Company
Plant Area 501~1000 square meters
Management System Certification ISO 9001, ISO 14001, IATF16949

Multi-Layer PCB Comparison

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Transaction Info
	Quick View Fr4 1.6mm BGA Gold Finger Multilayer PCB Solutions From Shenzhen Factory Contact Now	Quick View Multilayer HDI Board PCB for 5g Communication Systems Contact Now	Quick View Advanced SMT Assembly Service PCB for IoT Devices with Blind Hole Technology Contact Now	Quick View Reliable PCB Design and Assembly PCB for Medical Equipment Manufacturers Contact Now	Quick View Heavy Copper PCB Industrial Grade Assembly PCB for Harsh Environment Applications Contact Now
Price	US $ 0.10-15.00/ Piece	US $ 0.10-1.00/ Piece	US $ 0.10-1.00/ Piece	US $ 0.10-1.00/ Piece	US $ 0.10-1.00/ Piece
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	T/T, Western Union, Paypal	L/C, T/T, Western Union	L/C, T/T, Western Union	L/C, T/T, Western Union	L/C, T/T, Western Union
Quality Control
Management System Certification	ISO 9001, ISO 14001, IATF16949	ISO 9001	ISO 9001	ISO 9001	ISO 9001
Trade Capacity
Export Markets	North America, South America, Western Europe	South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe	South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe	South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe	South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	OEM	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Computer; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: EEG;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Immersion Gold; Base Material: Fr4; Insulation Materials: Epoxy Resin; Copper Thickness: 3oz -105oz; Surface Finish: Gold Finger; Special Teck: Metal Edging; Special 1: Blind Hole; Special 2: Buried Vias; Special 3: Flex-Rigid PCB;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Immersion Gold; Base Material: Fr4; Insulation Materials: Epoxy Resin; Copper Thickness: 3oz -105oz; Surface Finish: Gold Finger; Special Teck: Metal Edging; Special 1: Blind Hole; Special 2: Buried Vias; Special 3: Flex-Rigid PCB;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Immersion Gold; Base Material: Fr4; Insulation Materials: Epoxy Resin; Copper Thickness: 3oz -105oz; Surface Finish: Gold Finger; Special Teck: Metal Edging; Special 1: Blind Hole; Special 2: Buried Vias; Special 3: Flex-Rigid PCB;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Immersion Gold; Base Material: Fr4; Insulation Materials: Epoxy Resin; Copper Thickness: 3oz -105oz; Surface Finish: Gold Finger; Special Teck: Metal Edging; Special 1: Blind Hole; Special 2: Buried Vias; Special 3: Flex-Rigid PCB;
Supplier Name	EXCEEDING ELECTRONICS GROUP LIMITED	Shenzhen Hemeixin Electronic Co., Limited	Shenzhen Hemeixin Electronic Co., Limited	Shenzhen Hemeixin Electronic Co., Limited	Shenzhen Hemeixin Electronic Co., Limited
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