Specification |
Metal Coating: Tin;
Mode of Production: SMT+DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Certificate: ISO9001, ISO14001, IATF 16949, Ipc-a-610g, RoHS;
PCB Material: Fr-4, Cem-1, Cem-3, Hight Tg, Fr4 Halogen Free;
PCB Shape: Rectangular, Round, Slots, Cutouts, Complex;
Solder Mask: Green/Black/White/Red/Blue/Yellow/Purple..etc;
Board Thickness: 0.2mm-8mm;
Copper Thickness: 18um-3500um(0.5- 100oz);
Service: PCB/Componentssourcing/Assembly/Test/Package;
PCBA QA: Full Test Include Aoi, in-Circuit Test (Ict);
Layer: 1-36 Layers;
Max. PCB Size: 1900mm*600mm;
Profiling Punching: Routing, V-Cut, Beveling;
Surface Finishing: HASL/HASL Lead Free, Chemical Tin, Chemical Gold;
PCB Type: Rigid PCB, HDI PCB, Flexible PCB, Rigid-Flexible;
Test: X-ray, Aoi, in-Circuit Test (Ict), Functional Test;
PCBA Packaging: ESD Packaging, Shockproof Packaging, Anti-Drop;
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Customized: Customized;
Condition: New;
Inductance: 6.5μh;
Certificate Standard: Compatible with Qi Standards;
Work Frequency: 100-205kHz;
Dimension: 30*40mm;
Application: Vehicle Smartphone Holder Power Bank;
Charging Power: 15W Max;
Charging Efficiency: 84% Max;
Charging Distanc: 5-8mm;
Charging Protocol: Has Passed The EPP Qi2.0 Certif;
Protection Functio: Overcurrent, Overvoltage, Shortcircuit, Temperatu;
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Customized: Customized;
Condition: New;
Inductance: 6.5μh;
Certificate Standard: Compatible with Qi Standards;
Work Frequency: 100-205kHz;
Dimension: 30*40mm;
Application: Vehicle Smartphone Holder Power Bank;
Charging Power: 15W Max;
Charging Efficiency: 84% Max;
Charging Distanc: 5-8mm;
Charging Protocol: Has Passed The EPP Qi2.0 Certif;
Protection Functio: Overcurrent, Overvoltage, Shortcircuit, Temperatu;
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Customized: Customized;
Condition: New;
Inductance: 6.5μh;
Certificate Standard: Compatible with Qi Standards;
Work Frequency: 100-205kHz;
Dimension: 76*35mm;
Application: Vehicle Smartphone Holder Power Bank;
Charging Power: 15W Max;
Charging Efficiency: 84% Max;
Charging Distanc: 5-8mm;
Charging Protocol: Has Passed The EPP Qi2.0 Certif;
Protection Functio: Overcurrent, Overvoltage, Shortcircuit, Temperatu;
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Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
Material Type: Fr-4/Htg150-180 Fr-4/Cem-1/Cem-3/Aluminum;
Board Thickness: 0.2mm--4.0mm;
Minimum Trace Width: 3mil;
Min Space Width: 4mil;
Min Drilling Dia: 0.2mm;
Pth Copper Thickness: 0.4-2mil(10-50um);
Tolerance of Eteching: ± 1mil(± 25um);
Surface Finish/Plating: HASL/Lead Free HASL/OSP/Gold Plating/Immersion Gol;
Tg Value: 130, 135, 140, 150, 170, 180;
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