Motherboard
US$0.10-10.00 / Piece
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What is Prototyping Printed Circuit-Boards Multilayer Immersion Gold PCB for Antenna

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.10-10.00 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric Rogers
  • Material Fiberglass Epoxy
  • Application Communication
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Brand Exceeding Electronics
  • Transport Package Vacuum
  • Specification HASL
  • Trademark EEG
  • Origin Made in China
  • Certification RoHS, UL CE, GS, ISO
  • Delivery 24hours~5 Days
  • Price Factory Price
  • Keyword Custom PCB
  • Product Name High Frequency Board
  • MOQ 1 PCS
  • Min. Hole Size 0.1mm(4mil) for HDI / 0.15mm(6mil)
  • Min. Line Widt 0.075mm(3mil)
  • Copper Thicknes 0.5-12oz(18-420um)
  • Min. Line Spacing 0.075mm(3mil)
  • Board Thickness 0.2-6.0mm
  • Surface Finishing Immersion Silver, Tin, Gold /HASL Lead Free
  • Service One-Stop Service, PCB Assembly, Component Supply
  • Testing Service 100% E-Testing

Product Description

Founded in 2001,Exceeding Electronics Group Ltd,provides world-class customer support services. We are an industry lead in automotive, telecommunications, computer, industrial control, medical and power and energy PCB. Buyers from international markets choose to source from us because of our ...

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Motherboard Comparison
Transaction Info
Price US $ 0.10-10.00/ Piece US $ 0.36/ Piece US $ 0.34/ Piece US $ 0.38/ Piece US $ 0.35/ Piece
Min Order 1 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Payment Terms T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal
Quality Control
Product Certification RoHS, UL CE, GS, ISO - - - -
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets North America, South America, Western Europe North America, Eastern Europe, Southeast Asia, Africa, Oceania, Western Europe North America, Eastern Europe, Southeast Asia, Africa, Oceania, Western Europe North America, Eastern Europe, Southeast Asia, Africa, Oceania, Western Europe North America, Eastern Europe, Southeast Asia, Africa, Oceania, Western Europe
Annual Export Revenue US$10 Million - US$50 Million US$10 Million - US$50 Million US$10 Million - US$50 Million US$10 Million - US$50 Million US$10 Million - US$50 Million
Business Model OEM OEM, Own Brand(Bicheng) OEM, Own Brand(Bicheng) OEM, Own Brand(Bicheng) OEM, Own Brand(Bicheng)
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: Rogers;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Exceeding Electronics;
Delivery: 24hours~5 Days;
Price: Factory Price;
Keyword: Custom PCB;
Product Name: High Frequency Board;
MOQ: 1 PCS;
Min. Hole Size: 0.1mm(4mil) for HDI / 0.15mm(6mil);
Min. Line Widt: 0.075mm(3mil);
Copper Thicknes: 0.5-12oz(18-420um);
Min. Line Spacing: 0.075mm(3mil);
Board Thickness: 0.2-6.0mm;
Surface Finishing: Immersion Silver, Tin, Gold /HASL Lead Free;
Service: One-Stop Service, PCB Assembly, Component Supply;
Testing Service: 100% E-Testing;
Type: Rigid Circuit Board;
Dielectric: RO4003c, Fr-4 It158, Iteq;
Material: Hydrocarbon/Woven Glass+ Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Glass Reinforced Hydrocarbon and Epoxy Resin;
Final Foil External: 1 Oz;
Final Foil Internal: 1 Oz;
Board Thickness: 1.0 mm ±10%;
Surface Finish: OSP;
Solder Mask Color: N/a;
Colour of Component Legend: White;
Minimum Trace and Spac: 5 Mil / 5 Mil;
Minimum / Maximum Holes: 0.4 mm / 4.7 mm;
Via: Minimum Size 0.4mm.;
Test: 100% Electrical Test Prior Shipment;
Type: Rigid Circuit Board;
Dielectric: RO4350b;
Material: Hydrocarbon/Woven Glass;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Glass Reinforced Hydrocarbon;
Final Foil External: 1.5 Oz;
Final Foil Internal: 1 Oz;
Board Thickness: 1.42 mm ±10%;
Surface Finish: Immersion Gold;
Solder Mask Color: Green;
Colour of Component Legend: White;
Minimum Trace and Spac: 4 Mil / 5 Mil;
Minimum / Maximum Holes: 0.4 mm / 5.6 mm;
Via: Minimum Size 0.4mm.;
Test: 100% Electrical Test Prior Shipment;
Type: Rigid Circuit Board;
Dielectric: RO4350b and Fr-4;
Material: Hydrocarbon/Woven Glass +Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Glass Reinforced Hydrocarbon+Epoxy Resin;
Final Foil External: 2.0 Oz;
Final Foil Internal: 1 Oz;
Board Thickness: 1.6 mm ±10%;
Surface Finish: Immersion Gold;
Solder Mask Color: Green;
Colour of Component Legend: White;
Minimum Trace and Spac: 5.5 Mil / 7.2 Mil;
Minimum / Maximum Holes: 0.4 mm / 5.7 mm;
Via: Minimum Size 0.4mm.;
Test: 100% Electrical Test Prior Shipment;
Type: Rigid Circuit Board;
Dielectric: RO4350b and Fr-4;
Material: Hydrocarbon/Woven Glass +Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Glass Reinforced Hydrocarbon+Epoxy Resin;
Final Foil External: 1.0 Oz;
Final Foil Internal: 1 Oz;
Board Thickness: 1.3 mm ±10%;
Surface Finish: Immersion Gold;
Solder Mask Color: Green;
Colour of Component Legend: White;
Minimum Trace and Spac: 5.5 Mil / 7.5 Mil;
Minimum / Maximum Holes: 0.4 mm / 5.7 mm;
Via: Minimum Size 0.4mm.;
Test: 100% Electrical Test Prior Shipment;
Supplier Name

EXCEEDING ELECTRONICS GROUP LIMITED

Diamond Member Audited Supplier

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier