Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Insulation Materials: Epoxy Resin;
Solder Mask Color: Green/Black/White/Red/Blue/Yellow/Purple..etc;
Surface Finish: HASL/HASL Lead Free, Chemical Tin, Chemical Gold;
PCB Material: Fr-4, Cem-1, Cem-3, Hight Tg, Fr4 Halogen Free, Rogers;
PCB Shape: Rectangular, Round, Slots, Cutouts, Complex;
PCB Type: Rigid PCB, HDI PCB, Flexible PCB..etc;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Copper;
Insulation Materials: Organic Resin;
Min. Hole Size: 0.2mm;
Min. Line Width&Spacing: 0.1mm/0.1mm;
Surface Finish: Immersion Gold / HASL+Lead Free;
Certificates: UL, RoHS, SGS, ISO9001 ISO14000;
Shipping: DHL, UPS, TNT, FedEx, etc;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Abis;
Test: Flying Probe and Fixture;
Solder Mask: Green/ Custom;
Certificates: UL, RoHS, SGS, ISO9001;
Board Thickness: 1.8mm / 1.6mm / 2.0mm Custom;
Custom: OEM / ODM;
Copper: 0.5oz / 18um, 2oz / 70um Custom;
Layers: 4 Layers, Custom;
Legend: White;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
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Type: Rigid Circuit Board;
Material: Complex;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
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