Specification |
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Exceeding Electronics;
Board Thickness: 0.2-8.0mm;
PCB Material: Fr-4, Cem-1, Cem-3, Fr4 Halogen Free, Roger;
PCB Shape: Rectangular, Round, Slots, Cutouts, Complex;
Surface Finish: Immersion Ni/Au;
Lead Time: 6-8 Working Days;
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Structure: Double-Sided FPC;
Material: Polyester Film;
Combination Mode: Without Adhesive Flexible Plate;
Application: Digital Products, Mobile Phone;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V2;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Polycore;
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Structure: Double-Sided FPC;
Material: Polyester Film;
Combination Mode: Without Adhesive Flexible Plate;
Application: Digital Products, Mobile Phone;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V2;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Polycore;
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Structure: Single-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: LED;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Uc;
Board Layer: 1;
Board Thickness: 0.15-0.2mm;
Surface Treatment: Enig;
Size: 500*8mm;
Solder Mask Color: White;
Finished Copper Thickness: 35um;
PCB Testing: Flying Probe Testing/E-Testing;
Lead Time: 7 Working Days;
Fast Turn: 3 Working Days;
Ipc Standards: Ipc-Class 2;
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Structure: Single-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: LED;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Pi;
Insulation Materials: Epoxy Resin;
Brand: Uc;
Base Material Type: Polyimide;
Thickness: 0.15-0.2mm;
Size: 500*8mm;
Solder Mask Color: White/Black;
Surface Treatment: Immersion Gold;
Ipc Standards: Ipc Class II;
Lead Time: 6 Working Days;
PCB Testing: E-Testing, Flying Probe Testing;
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