HDI PCB
US$0.10-15.00 / Piece
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What is High Quality Immersion Gold PCB HDI PCB From Shenzhen Factory for Consumer Electronics

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.10-15.00 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Medical Instruments
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Aluminum
  • Insulation Materials Epoxy Resin
  • Brand EEG
  • Transport Package Vacuum
  • Specification ENIG
  • Trademark EEG
  • Origin Made in China

Product Description

Founded in 2001,Exceeding Electronics Group Ltd,provides world-class customer support services. We are an industry lead in automotive, telecommunications, computer, industrial control, medical and power and energy PCB. Buyers from international markets choose to source from us because of our ...

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HDI PCB Comparison
Transaction Info
Price US $ 0.10-15.00/ Piece US $ 0.10-2.20/ Piece US $ 8.00-20.00/ Piece US $ 0.10-1.10/ Piece US $ 0.10-1.10/ Piece
Min Order 1 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Trade Terms - - - - -
Payment Terms T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal, Money Gram T/T, Western Union, Paypal, Money Gram T/T, Western Union, Paypal, Money Gram
Quality Control
Product Certification - ISO/CQC/IATF/UL/RoHS - ISO/Cqciatf/UL/RoHS/etc ISO/Cqciatf/UL/RoHS/etc
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets North America, South America, Western Europe North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic
Annual Export Revenue - - - - -
Business Model OEM OEM, ODM, Own Brand OEM, ODM, Own Brand OEM, ODM, Own Brand OEM, ODM, Own Brand
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: EEG;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Insulation Materials: Epoxy Resin;
Product Name: Gold Finger PCB;
Layer: 1~20;
Finished Outer Copper Thickness: H/H0z-5/50z;
Finished Inner Copper Thickness: H/H0z-4/40z;
Min Board Size: 8*8mm;
Board Thickness: 0.3mm~3.5mm;
Max Board Size: 650*610mm;
Min Hole Size: 0.2mm;
Surface Finish: HASL/HASL Lf/OSP/Immersion Gold/Tin/ Silver;
Value-Added Service: Layout;
Type: PCBA;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: HB;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Unice;
Layer: 1-20;
Finished Outer Copper Thickness: H/H0z-5/50z;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Layer: 1-20;
OEM/ODM: Support;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Layer: 1-20;
OEM/ODM: Support;
Supplier Name

EXCEEDING ELECTRONICS GROUP LIMITED

China Supplier - Diamond Member Audited Supplier

Jian Unice Pcb Technique Co., Ltd

China Supplier - Gold Member Audited Supplier

Jian Unice Pcb Technique Co., Ltd

China Supplier - Gold Member Audited Supplier

Jian Unice Pcb Technique Co., Ltd

China Supplier - Gold Member Audited Supplier

Jian Unice Pcb Technique Co., Ltd

China Supplier - Gold Member Audited Supplier