Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Exceeding Electronics;
Layer: 1-36 Layers;
Max. PCB Size: 1900mm*600mm;
Board Thickness: 0.2-8.0mm;
PCB Material: Fr-4, Cem-1, Cem-3, Hight Tg, Fr4 Halogen Free, RO;
PCB Shape: Rectangular, Round, Slots, Cutouts, Complex;
|
Material: Fr-4, Cem-1/Cem-3, Pi,High Tg,Rogers;
Processing Technology: DIP;
Board Layer: 8 Layer;
Surface Finihsing: Immersion Gold;
Lead Time: 6-8 Working Days;
Board Thickness: 0.5mm-7.0mm;
Max Panel Size: 32"×48"(800mm×1200mm);
Min Hole Size: 0.02mm;
Min Line Width: 3mil(0.075mm);
Copper Thickness: 0.2-7.0oz;
Soldermask: Green/Yellow/Black/White/Red/Blue;
Silkscreen: Red/Yellow/Black/White;
Min Pad: 5mil(0.13mm);
Material Suppilers: Shengyi, Kb, Nanya, Iteq,etc.;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Test: Flying Probe and Fixture;
Solder Mask: Green;
Certificates: UL, RoHS, SGS, ISO9001;
Board Thickness: 0.8mm / 1.6mm Custom;
Custom: OEM / ODM;
Copper: 1oz / 35um;
Surface Finish: Enig 1u'';
Layers: 1-20 Layers;
Legend: White;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Test: Flying Probe and Fixture;
Solder Mask: Green;
Certificates: UL, RoHS, SGS, ISO9001;
Board Thickness: 0.8mm / 1.6mm Custom;
Custom: OEM / ODM;
Copper: 1oz / 35um;
Surface Finish: Enig 1u'';
Layers: 1-20 Layers;
Legend: White;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Abis;
Test: Flying Probe and Fixture;
Solder Mask: Black;
Certificates: UL, RoHS, SGS, ISO9001;
Board Thickness: 1.6mm / 2.0mm / Custom;
Custom: OEM / ODM;
Copper: 1oz / 35um, 2oz / 70um;
Surface Finish: HASL / Enig;
Layers: 2 Layers;
Legend: White;
|