Specification |
Insulation Materials: Epoxy Resin;
Flame Retardant Properties: V0;
Application: Medical Instruments;
Base Material: Pi+Fr4;
Service: 7*24 Hours Online;
Technology: Lead The Industry;
Processing Technology: Electrolytic Foil;
Delivery: 5days;
Keyword: FPC, Rigid-Flex, PCB Flexible PCB, Motherboard;
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Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Processing Technology: Enig;
Base Material: Fr4+Pi+Nfpp;
Structure: Multilayer PCB+FPC;
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Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Processing Technology: Enig;
Base Material: Fr4+Pi+Nfpp;
Structure: Multilayer PCB+FPC;
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Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Processing Technology: Enig;
Base Material: Fr4+Pi+Nfpp;
Structure: Multilayer PCB+FPC;
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Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Medical Instruments;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Processing Technology: Enig;
Base Material: Fr4+Pi+Nfpp;
Structure: Multilayer PCB+FPC;
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