Specification |
Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Pi+Pi/Fr4 for Stiffener;
Insulation Materials: No;
Brand: Exceeding;
Technology: Lead The Industry;
Keyword: FPC;
Surface Finish: Immersion Ni/Au;
Lead Time: 6-8 Working Days;
Service: 7*24 Hours Online;
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Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Pi PE;
Insulation Materials: Epoxy Resin;
Brand: Kxpcba;
Smallest Chips Size: 0201;
Min BGA: 0.008 in. (0.2mm);
Max PCB Size: 14.5 in. X 19.5 in;
PCB Shape: Any;
Surface Treatment: OSP, Enig, Immersion Silver/Tin, Gold Plating;
Min Thickness: 0.02mm;
Cover Film Color: Black, Yellow, Brown and White;
Solder Mask: Green. Red. Blue. White. Black;
Layer: 1-8;
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Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Pi PE;
Insulation Materials: Epoxy Resin;
Brand: Kxpcba;
Smallest Chips Size: 0201;
Min BGA: 0.008 in. (0.2mm);
Max PCB Size: 14.5 in. X 19.5 in;
PCB Shape: Any;
Surface Treatment: OSP, Enig, Immersion Silver/Tin, Gold Plating;
Min Thickness: 0.02mm;
Cover Film Color: Black, Yellow, Brown and White;
Solder Mask: Green. Red. Blue. White. Black;
Layer: 1-8;
|
Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Pi PE;
Insulation Materials: Epoxy Resin;
Brand: Kxpcba;
Smallest Chips Size: 0201;
Min BGA: 0.008 in. (0.2mm);
Max PCB Size: 14.5 in. X 19.5 in;
PCB Shape: Any;
Surface Treatment: OSP, Enig, Immersion Silver/Tin, Gold Plating;
Min Thickness: 0.02mm;
Cover Film Color: Black, Yellow, Brown and White;
Solder Mask: Green. Red. Blue. White. Black;
Layer: 1-8;
|
Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Pi PE;
Insulation Materials: Epoxy Resin;
Brand: Kxpcba;
Smallest Chips Size: 0201;
Min BGA: 0.008 in. (0.2mm);
Max PCB Size: 14.5 in. X 19.5 in;
PCB Shape: Any;
Surface Treatment: OSP, Enig, Immersion Silver/Tin, Gold Plating;
Min Thickness: 0.02mm;
Cover Film Color: Black, Yellow, Brown and White;
Solder Mask: Green. Red. Blue. White. Black;
Layer: 1-8;
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