Flex PCB Assembly
US$0.10-10.00 / Piece
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What is Flex PCB Board Electronics Assembly Touch Switch FPC Assembly Circuit Board Service with Copper Clad Laminates Material

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.10-10.00 / Piece

Sepcifications

  • Structure Double-Sided FPC
  • Material Polyimide
  • Combination Mode Adhesive Flexible Plate
  • Application Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace
  • Conductive Adhesive Anisotropic Conductive Adhesive
  • Flame Retardant Properties V0
  • Processing Technology Electrolytic Foil
  • Base Material Pi PE
  • Insulation Materials Epoxy Resin
  • Brand Kxpcba
  • Transport Package Inner Vacuum; Outer Carton Box; Fianlly Pallet
  • Specification 5-500mm
  • Trademark KX
  • Origin Shenzhen of China
  • Smallest Chips Size 0201
  • Min BGA 0.008 in. (0.2mm)
  • Max PCB Size 14.5 in. X 19.5 in
  • PCB Shape Any
  • Surface Treatment OSP, Enig, Immersion Silver/Tin, Gold Plating
  • Min Thickness 0.02mm
  • Cover Film Color Black, Yellow, Brown and White
  • Solder Mask Green. Red. Blue. White. Black
  • Layer 1-8

Product Description

Flex pcb Capability. Item Capability 1 Single and double sided SMT/PTH Yes 2 Large parts on both sides, BGA on both sides Yes 3 Smallest Chips size 0201 4 Min BGA and Micro BGA pitch and ball counts 0.008 in. (0.2mm) pitch, ball count greater than 1000 5 Min Leaded parts ...

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Flex PCB Assembly Comparison
Transaction Info
Price US $ 0.10-10.00/ Piece US $ 0.01-20.00/ Piece US $ 0.10-20.00/ Piece US $ 0.10-1.00/ pcs US $ 0.50-10.00/ piece
Min Order 1 Pieces 1 Pieces 1 Pieces 1 pcs 1 piece
Trade Terms - - - - -
Payment Terms L/C, T/T, D/P, Western Union, Paypal, Money Gram, XT L/C, T/T, D/P, Western Union, Paypal L/C, T/T, Western Union, Paypal T/T, Western Union, Paypal, 30 days net T/T, Western Union, Paypal, 30 days net
Quality Control
Management System Certification - ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model OEM, ODM, Own Brand OEM OEM OEM OEM
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Pi PE;
Insulation Materials: Epoxy Resin;
Brand: Kxpcba;
Smallest Chips Size: 0201;
Min BGA: 0.008 in. (0.2mm);
Max PCB Size: 14.5 in. X 19.5 in;
PCB Shape: Any;
Surface Treatment: OSP, Enig, Immersion Silver/Tin, Gold Plating;
Min Thickness: 0.02mm;
Cover Film Color: Black, Yellow, Brown and White;
Solder Mask: Green. Red. Blue. White. Black;
Layer: 1-8;
Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Without Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace, LED;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: HB;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace, LED;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Board Thickness: 0.2mm;
Copper Thickness: 35um/1oz;
Surface Finish: Enig;
Supplier Name

Shenzhen Jinxiong Electronic Co., Ltd

China Supplier - Gold Member Audited Supplier

Abis Circuits Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

China Supplier - Diamond Member Audited Supplier