Rigid-Flex PCB
US$0.10-15.00 / Piece
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What is High Quality Printed Circuit Board No MOQ Rigid-Flex PCB

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.10-15.00 / Piece

Sepcifications

  • Type Flexible Circuit Board
  • Dielectric No
  • Material Polyimide
  • Application Aerospace
  • Flame Retardant Properties V0
  • Mechanical Rigid Fexible
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials No
  • Brand Exceeding Electronics
  • Transport Package Vacuum Package
  • Specification immersion gold
  • Trademark EEG
  • Origin Made in China

Product Description

Founded in 2001,Exceeding Electronics Group Ltd,provides world-class customer support services. We are an industry lead in automotive, telecommunications, computer, industrial control, medical and power and energy PCB. Buyers from international markets choose to source from us because of our ...

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Rigid-Flex PCB Comparison
Transaction Info
Price US $ 0.10-15.00/ Piece US $ 0.98-5.00/ Piece US $ 0.20-20.00/ Piece US $ 0.20-20.00/ Piece US $ 1.03-6.00/ Piece
Min Order 1 Pieces 10 Pieces 10 Pieces 10 Pieces 10 Pieces
Trade Terms - - - - -
Payment Terms T/T, Western Union, Paypal T/T T/T, D/P, Paypal, Money Gram T/T, D/P, Paypal, Money Gram T/T
Quality Control
Product Certification - RoHS, CCC, ISO RoHS, CCC, ISO RoHS, CCC, ISO RoHS, CCC, ISO
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, IATF16949, ISO 13485 ISO 9001, IATF16949, ISO 13485 ISO 9001, IATF16949, ISO 13485 ISO 9001, IATF16949, ISO 13485
Trade Capacity
Export Markets North America, South America, Western Europe Domestic Domestic Domestic Domestic
Annual Export Revenue - - - - -
Business Model OEM OEM, ODM OEM, ODM OEM, ODM OEM, ODM
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: 1 Month(s)
Peak-season: 1-3 Month(s)
Off-season: 1 Month(s)
Peak-season: 1-3 Month(s)
Off-season: 1 Month(s)
Peak-season: 1-3 Month(s)
Off-season: 1 Month(s)
Peak-season: 1-3 Month(s)
Product Attributes
Specification
Type: Flexible Circuit Board;
Dielectric: No;
Material: Polyimide;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: No;
Brand: Exceeding Electronics;
Type: Customized;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Customized;
Processing Technology: Customized;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: OEM/ODM;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Type: Customized;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Customized;
Processing Technology: Customized;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: OEM/ODM;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Type: Customized;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Customized;
Processing Technology: Customized;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: OEM/ODM;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Type: Customized;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Customized;
Processing Technology: Customized;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: OEM/ODM;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Supplier Name

EXCEEDING ELECTRONICS GROUP LIMITED

China Supplier - Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

China Supplier - Diamond Member Audited Supplier