Rigid-Flex PCB
US$1.00-20.00 / Piece
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What is High Quality Customized Multilayer FPC Manufacturer Flex Rigid PCB Board Solutions

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$1.00-20.00 / Piece

Sepcifications

  • Insulation Materials Organic Resin
  • Flame Retardant Properties V0
  • Application Aerospace
  • Transport Package Vacuum Package and Foam Protected
  • Specification PCB customized size
  • Trademark EEG
  • Origin Shenzhen
  • Base Material Pi+Fr4
  • Service 7*24 Hours Online
  • Technology Lead The Industry
  • Processing Technology Electrolytic Foil
  • Delivery 5days
  • Keyword FPC, Rigid-Flex, PCB Flexible PCB, Motherboard
  • Certification RoHS, UL CE, GS, ISO

Product Description

Founded in 2001,Exceeding Electronics Group Ltd,provides world-class customer support services. We are an industry lead in automotive, telecommunications, computer, industrial control, medical and power and energy PCB. Buyers from international markets choose to source from us because of our ...

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Rigid-Flex PCB Comparison
Transaction Info
Price US $ 1.00-20.00/ Piece US $ 0.98-2.39/ Piece US $ 0.68-3.57/ Piece US $ 0.75-4.69/ Piece US $ 0.50-10.00/ Piece
Min Order 1 Pieces 100 Pieces 100 Pieces 100 Pieces 1 Pieces
Payment Terms T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Product Certification RoHS, UL CE, GS, ISO - - - RoHS, CCC, ISO, EPA
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP ISO 9001, ISO 9000, ISO 14001, ISO 14000, IATF16949, HSE, GMP ISO 9001, ISO 14001, IATF16949, ISO 13485, PAS 28000
Trade Capacity
Export Markets North America, South America, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Mid East, Western Europe
Annual Export Revenue US$10 Million - US$50 Million US$50 Million - US$100 Million US$50 Million - US$100 Million US$50 Million - US$100 Million Above US$100 Million
Business Model OEM OEM, ODM OEM, ODM OEM, ODM OEM, ODM, Own Brand()
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Aerospace;
Base Material: Pi+Fr4;
Service: 7*24 Hours Online;
Technology: Lead The Industry;
Processing Technology: Electrolytic Foil;
Delivery: 5days;
Keyword: FPC, Rigid-Flex, PCB Flexible PCB, Motherboard;
Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Test Equipment;
Blind Vias: 0.1mm;
Buried Vias: 0.1mm;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Processing Technology: Enig;
Base Material: Fr4+Pi+Nfpp;
Structure: Multilayer PCB+FPC;
Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: CCD Camera;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Processing Technology: Enig;
Base Material: Fr4+Pi+Nfpp;
Structure: Multilayer PCB+FPC;
Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Industry Equipment;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Processing Technology: Enig;
Base Material: Fr4+Pi+Nfpp;
Structure: Multilayer PCB+FPC;
Insulation Materials: Epoxy Resin;
Flame Retardant Properties: 94V-0;
Application: Communication;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Test: Flying Probe & Fixture;
Solder Mask Type: Green Blue Black;
Min.Line Width/Space: 0.1mm;
Min. Hole Size: 0.2mm;
Customized: Customized;
Supplier Name

EXCEEDING ELECTRONICS GROUP LIMITED

Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shanghai Gawin Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Usun Electronics Limited.,

Gold Member Audited Supplier