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What is High Density Interconnected HDI Circuit Board Multilayer PCB Solutions

Name: High Density Interconnected HDI Circuit Board Multilayer PCB Solutions
Uploaded: 2023-10-17T15:17:50+08:00
Description: Founded in 2001,Exceeding Electronics Group Ltd,provides world-class customer support services. We are an industry lead in automotive, telecommunications, computer, industrial control, medical and p

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Price

Min. Order Reference FOB Price

1 Piece US$0.10-15.00 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Communication
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Aluminum
Insulation Materials Epoxy Resin
Brand EEG
Transport Package Vacuum
Specification ENIG
Trademark EEG
Origin Made in China

Product Description

Founded in 2001,Exceeding Electronics Group Ltd,provides world-class customer support services. We are an industry lead in automotive, telecommunications, computer, industrial control, medical and power and energy PCB. Buyers from international markets choose to source from us because of our ...

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EXCEEDING ELECTRONICS GROUP LIMITED

Diamond Member Since 2021

Audited Supplier

Business Type Manufacturer/Factory
Business Range Electrical & Electronics
Main Products PCB FPC PCB Assembly LED PCB Aluminum PCB HDI, High Frequency Board, High Frequency PCB
Type of Ownership Limited Company
Plant Area 501~1000 square meters
Management System Certification ISO 9001, ISO 14001, IATF16949

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Transaction Info
	Quick View High Density Interconnected HDI Circuit Board Multilayer PCB Solutions Contact Now	Quick View Power Bank PCB and Assembly PCB Board Contact Now	Chinese Xvideo Audio and Video Player PCBA for OEM PCBA Contact Now	Quick View Multilayer High Tg PCB Manufacturer Quantum Board LED Grow Light PCB Contact Now	Underground Long Range Metal Gold Detector Circuit PCB Contact Now
Price	US $ 0.10-15.00/ Piece	US $ 0.1/ Piece	US $ 0.1/ Piece	US $ 0.1/ Piece	US $ 0.1/ Piece
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Trade Terms	-	-	-	-	-
Payment Terms	T/T, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Management System Certification	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001	ISO 9001, ISO 14001	ISO 9001, ISO 14001	ISO 9001, ISO 14001
Trade Capacity
Export Markets	North America, South America, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	OEM	OEM, ODM	OEM, ODM	OEM, ODM	OEM, ODM
Average Lead Time	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)	Off-season: within 15 Day(s) Peak-season: within 15 Day(s)
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: EEG;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Fr4; Insulation Materials: Organic Resin; Copper Thickness: 1oz; Surface Finishing: Enig; Solder Mask Type: Green; Silkscreen: White; Board Thickness: 1.6mm; Layer: 1 to 18; Min. Hole Size: 0.07mm; Min.Line Width: 0.1mm; Min.Line Spacing: 0.1mm; Finishing: Hal, OSP, Immersion;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Fr4; Insulation Materials: Organic Resin; Copper Thickness: 1oz; Surface Finishing: Enig; Solder Mask Type: Green; Silkscreen: White; Board Thickness: 1.6mm; Layer: 1 to 18; Min. Hole Size: 0.07mm; Min.Line Width: 0.1mm; Min.Line Spacing: 0.1mm; Finishing: Hal, OSP, Immersion;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Fr4; Insulation Materials: Organic Resin; Copper Thickness: 1oz; Surface Finishing: Enig; Solder Mask Type: Green; Silkscreen: White; Board Thickness: 1.6mm; Layer: 1 to 18; Min. Hole Size: 0.07mm; Min.Line Width: 0.1mm; Min.Line Spacing: 0.1mm; Finishing: Hal, OSP, Immersion;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Fr4; Insulation Materials: Organic Resin; Copper Thickness: 1oz; Surface Finishing: Enig; Solder Mask Type: Green; Silkscreen: White; Board Thickness: 1.6mm; Layer: 1 to 18; Min. Hole Size: 0.07mm; Min.Line Width: 0.1mm; Min.Line Spacing: 0.1mm; Finishing: Hal, OSP, Immersion;
Supplier Name	EXCEEDING ELECTRONICS GROUP LIMITED	Shenzhen Xinjiaye Electronics Technology Co., Ltd.	Shenzhen Xinjiaye Electronics Technology Co., Ltd.	Shenzhen Xinjiaye Electronics Technology Co., Ltd.	Shenzhen Xinjiaye Electronics Technology Co., Ltd.
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