PCB Assembly
US$0.21 / Piece
  • Recommend for you
  • What is Customized PS Ssb Receiver From Communication Industry PCBA with Good Quality PCB Board Fabrication PCB Circuit Board Manufacturing PCB
  • What is BGA Multilayer PCB Circuit Board with High Precision, Long-Term Support Service
  • What is Fr4 PCB Electronic Board Assembly Fr4 94V-0 PCB Motherboard

What is Shenzhen Electrical Electronics Parts PCBA Circuit Board PCBA Assembly

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.21 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Communication
  • Flame Retardant Properties V1
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Fr4
  • Insulation Materials Epoxy Resin
  • Brand Fastline
  • Transport Package Vacuum+Carton Packing
  • Specification RoHS, ISO9001, UL, SGS
  • Trademark Fastline
  • Origin Shenzhen, China
  • Board Thickness 1.6mm
  • Copper Thickness 1oz
  • Material Type Fr4
  • Surface Treatment HASL Lead Free
  • Solder Mask Green, Red, Blue, Black
  • Silk Screen Color White
  • Board Layer 1-50
  • Shipping Type DHL, UPS, TNT, EMS, FedEx etc
  • Packing Type Carton + Vacuum
  • Lead Time 5-7 Days

Product Description

Product Description Parameter &Data Sheet Size of PCBA 95 X 98mm Number of Layers 4 Board Type PCBA Board Thickness 1.6mm Board Material FR-4 1.6mm Board Material Supplier Shengyi Tg Value of Board Material 60ºC PTH Cu thickness ≥20 µm Inner Iayer Cu ...

Learn More

PCB Assembly Comparison
Transaction Info
Price US $ 0.21/ Piece US $ 0.48/ Piece US $ 0.42/ Piece US $ 0.43/ Piece US $ 0.41/ Piece
Min Order 1 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Payment Terms L/C, T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal T/T, Western Union, Paypal
Quality Control
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, Eastern Europe, Southeast Asia, Africa, Oceania, Western Europe North America, Eastern Europe, Southeast Asia, Africa, Oceania, Western Europe North America, Eastern Europe, Southeast Asia, Africa, Oceania, Western Europe North America, Eastern Europe, Southeast Asia, Africa, Oceania, Western Europe
Annual Export Revenue - US$10 Million - US$50 Million US$10 Million - US$50 Million US$10 Million - US$50 Million US$10 Million - US$50 Million
Business Model OEM, ODM OEM, Own Brand(Bicheng) OEM, Own Brand(Bicheng) OEM, Own Brand(Bicheng) OEM, Own Brand(Bicheng)
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V1;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Fastline;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Material Type: Fr4;
Surface Treatment: HASL Lead Free;
Solder Mask: Green, Red, Blue, Black;
Silk Screen Color: White;
Board Layer: 1-50;
Shipping Type: DHL, UPS, TNT, EMS, FedEx etc;
Packing Type: Carton + Vacuum;
Lead Time: 5-7 Days;
Type: Rigid Circuit Board;
Dielectric: RO4350b and Fr-4;
Material: Hydrocarbon/Woven Glass and Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Glass Reinforced Hydrocarbon and Epoxy Resin;
Final Foil External: 1.5 Oz;
Final Foil Internal: 0.5 Oz;
Board Thickness: 1.7mm ±0.17;
Surface Finish: Immersion Gold;
Solder Mask Color: Red;
Colour of Component Legend: White;
Minimum Trace and Spac: 5.9 Mil/5.9 Mil;
Minimum / Maximum Holes: 0.3mm/3.8mm;
Test: 100% Electrical Test Prior Shipment;
Type: Rigid Circuit Board;
Dielectric: Fr-4&RO4003c;
Material: Hydrocarbon/Woven Glass and Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Glass Reinforced Hydrocarbon and Epoxy Resin;
Final Foil External: 1.5 Oz;
Final Foil Internal: 0.5 Oz;
Board Thickness: 1.6mm ±0.16;
Surface Finish: Immersion Gold;
Solder Mask Color: Green;
Colour of Component Legend: White;
Minimum Trace and Spac: 4 Mil/4 Mil;
Minimum / Maximum Holes: 0.3/0.5mm;
Via: Plated Through Hole(Pth);
Test: 100% Electrical Test Prior Shipment;
Type: Rigid Circuit Board;
Dielectric: RO4350b&RO4450b;
Material: Hydrocarbon/Woven Glass;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Glass Reinforced Hydrocarbon;
Final Foil External: 1 Oz;
Final Foil Internal: 0.5 Oz;
Board Thickness: 2.0mm ±10%;
Surface Finish: Electroless Nickel Over Immersion Gold (Enig);
Solder Mask Color: Green;
Colour of Component Legend: White;
Minimum Trace and Spac: 5.5 Mil/5 Mil;
Minimum / Maximum Holes: 0.3/2.0mm;
Test: 100% Electrical Test Prior Shipment;
Type: Rigid Circuit Board;
Dielectric: RO4003c Mixed with Fr-4;
Material: Hydrocarbon/Woven Glass and Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Glass Reinforced Hydrocarbon and Epoxy Resin;
Final Foil External: 1 Oz;
Final Foil Internal: 0.5 Oz;
Board Thickness: 1.2 mm ±10%;
Surface Finish: Electroless Nickel Over Immersion Gold (Enig);
Solder Mask Color: Green;
Colour of Component Legend: White;
Minimum Trace and Spac: 5.5 Mil/4.9 Mil;
Minimum / Maximum Holes: 0.3/6.4mm;
Via: Plated Through Hole(Pth);
Test: 100% Electrical Test Prior Shipment;
Supplier Name

Fastline Circuits Co., Limited

Diamond Member Audited Supplier

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier