| Specification |
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Polyimide;
Insulation Materials: Epoxy Resin;
Board Material: Polyimide;
Board Layer: 2;
Board Thickness: 0.1 mm;
Copper Thickness: 1 Oz;
Solser Mask: Yellow;
Silkscreen: White;
Surface Finishing: Enig;
Lead Time: 4-5 Working Days;
Shipping Type: DHL.TNT, EMS, FedEx, UPS etc;
PCB Design: Custom Design Product;
Mini Hole: 0.1mm;
Test: 100%;
Supply: Fast;
Service: One-Stop;
MOQ: 1PCS;
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Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Pi;
Insulation Materials: Organic Resin;
Brand: Smart;
Supplier Type: Manufacturer;
Copper Thickness: 0.5oz;
Min.Hole Size: 0.15mm;
Min.Line Width: 0.075mm;
Surface Finish: Enig, Immersion Silver, OSP;
|
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Pi;
Insulation Materials: Organic Resin;
Brand: Smart;
Supplier Type: Manufacturer;
Copper Thickness: 0.3oz-3oz;
Min.Hole Size: 0.15mm;
Min. Line Width: 0.075mm;
Board Thickness: 0.057-0.6mm;
Surface Finish: Enig, Immersion Silver, OSP;
|
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Pi/Pet;
Insulation Materials: Organic Resin;
Brand: Smart;
Type: FPC;
Copper Thickness: 0.3oz-3oz;
Min.Hole Size: 0.15mm;
Min. Hole Size: 0.15mm;
Board Size: Custom;
Min.Line Width: 0.075mm;
Min.Line Spacing: 0.075mm;
Board Thickness: 0.057-0.6mm;
Surface Finishing: Enig, Immersion Silver, OSP;
|
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Pi/Pet;
Insulation Materials: Organic Resin;
Brand: Smart;
Type: FPC;
Copper Thickness: 0.3oz-3oz;
Min.Hole Size: 0.15mm;
Board Size: Custom;
Min.Line Width: 0.075mm;
Min.Line Spacing: 0.075-0.9mm;
Board Thickness: 0.057-0.6mm;
Surface Finishing: Enig, Immersion Silver, OSP;
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