Specification |
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: Aluminum;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Aluminum;
Brand: Fastline;
Board Material: Aluminum;
Board Thickness: 1.5mm;
Copper Thickness: 0.5oz;
Min. Hole Size: 0.25mm;
Min. Line Width: 0.15mm;
Min. Line Spacing: 0.15mm;
Surface Treatment: HASL Lead Free;
Lead Time: 5-7 Working Days;
Small Order: Accepted;
PCB Type: Aluminum LED PCB Board;
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Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Copper;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Paper Phenolic Copper Foil Substrate;
Brand: Kevis;
Layer: 1-64 Layers;
Board Thickness: 0.2mm-7.0mm;
Min. Line Width: 0.075mm/0.075mm(3mil/3mil);
Min. Hole Size: 0.15mm;
Surface Treatment: Flash Gold, Enig, Enepig, Gold Fingers Hard Gold;
Solder Mask Color: Green, Blue, Yellow, White, Black;
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Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Copper;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Paper Phenolic Copper Foil Substrate;
Brand: Kevis;
Layer: 1-64 Layers;
Board Thickness: 0.2mm-7.0mm;
Min. Line Width: 0.075mm/0.075mm(3mil/3mil);
Min. Hole Size: 0.15mm;
Surface Treatment: Flash Gold, Enig, Enepig, Gold Fingers Hard Gold;
Solder Mask Color: Green, Blue, Yellow, White, Black;
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Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Copper;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Paper Phenolic Copper Foil Substrate;
Brand: Kevis;
Layer: 1-64 Layers;
Board Thickness: 0.2mm-7.0mm;
Min. Line Width: 0.075mm/0.075mm(3mil/3mil);
Min. Hole Size: 0.15mm;
Surface Treatment: Flash Gold, Enig, Enepig, Gold Fingers Hard Gold;
Solder Mask Color: Green, Blue, Yellow, White, Black;
|
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Copper;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Paper Phenolic Copper Foil Substrate;
Brand: Kevis;
Layer: 1-64 Layers;
Board Thickness: 0.2mm-7.0mm;
Min. Line Width: 0.075mm/0.075mm(3mil/3mil);
Min. Hole Size: 0.15mm;
Surface Treatment: Flash Gold, Enig, Enepig, Gold Fingers Hard Gold;
Solder Mask Color: Green, Blue, Yellow, White, Black;
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