Specification |
Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Polyimide;
Insulation Materials: Epoxy Resin;
Board Material: Polyimide;
Board Layer: 4;
Board Thickness: 0.2 mm;
Copper Thickness: 1 Oz;
Solser Mask: Yellow;
Silkscreen: White;
Surface Finishing: Enig;
Lead Time: 4-5 Working Days;
Shipping Type: DHL.TNT, EMS, FedEx, UPS etc;
PCB Design: Custom Design Product;
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Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V1;
Processing Technology: Electrolytic Foil;
Base Material: Pi;
Insulation Materials: Organic Resin;
Brand: Newtrue;
Copper Thickness: 35um,1oz,2oz;
Min. Hole Size: 0.15mm;
Min. Line Width: 0.075mm(3mil);
Min. Line Spacing: 0.075mm(3mil);
Layer: 1~8 Layers;
Color: Yellow;
PCB Assembly: Through-Hole;
Solder Heat Resistance: 10 Sec;
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Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V1;
Processing Technology: Electrolytic Foil;
Base Material: Pi;
Insulation Materials: Organic Resin;
Brand: Newtrue;
Copper Thickness: 35um,1oz,2oz;
Min. Hole Size: 0.15mm;
Min. Line Width: 0.075mm(3mil);
Min. Line Spacing: 0.075mm(3mil);
Layer: 1~8 Layers;
Color: Yellow;
PCB Assembly: Through-Hole;
Solder Heat Resistance: 10 Sec;
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Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V1;
Processing Technology: Electrolytic Foil;
Base Material: Pi;
Insulation Materials: Organic Resin;
Brand: Newtrue;
Copper Thickness: 35um,1oz,2oz;
Min. Hole Size: 0.15mm;
Min. Line Width: 0.075mm(3mil);
Min. Line Spacing: 0.075mm(3mil);
Layer: 1~8 Layers;
Color: Yellow;
PCB Assembly: Through-Hole;
Solder Heat Resistance: 10 Sec;
|
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V1;
Processing Technology: Electrolytic Foil;
Base Material: Pi;
Insulation Materials: Organic Resin;
Brand: Newtrue;
Copper Thickness: 35um,1oz,2oz;
Min. Hole Size: 0.15mm;
Min. Line Width: 0.075mm(3mil);
Min. Line Spacing: 0.075mm(3mil);
Layer: 1~8 Layers;
Color: Yellow;
PCB Assembly: Through-Hole;
Solder Heat Resistance: 10 Sec;
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