PCB Assembly
Negotiable
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What is Air Condition Rigid Multilayer PCB Prototype Printed Circuit Board

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece Negotiable

Sepcifications

  • Metal Coating Tin
  • Mode of Production SMT
  • Layers Multilayer
  • Base Material FR-4
  • Certification RoHS, ISO, UL
  • Customized Customized
  • Condition New
  • Transport Package Vacuum+Carton Packing
  • Specification RoHS, ISO9001, UL, SGS
  • Trademark FL
  • Origin Shenzhen, China
  • Board Material Fr4
  • Board Layer 2
  • Board Thickness 1.6mm
  • Copper Thickness 1 Oz
  • Min. Line Width/Space 0.1mm
  • Min. Hole Size 0.2mm
  • Solder Mask Green/Blue/Red
  • Silkscreen White/ Black
  • Surface Finishing HASL-Lf
  • Lead Time 8-10 Working Days

Product Description

Air Condition Rigid Multilayer PCB Prototype Printed Circuit Board Fastline could produce 1-26 layers PCB board for electronic products.providing PCB design, PCB fabrication,PCB clone and PCB assembly services. and we have got the UL, ISO, SGS certifications. Pls see our pcb catalog below: 1. ...

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PCB Assembly Comparison
Transaction Info
Price Negotiable US $ 0.50-5.00/ Piece US $ 0.50-1.00/ Piece US $ 0.01/ Piece US $ 0.50-1.00/ Piece
Min Order 1 Pieces 1 Pieces 10 Pieces 1 Pieces 10 Pieces
Payment Terms L/C, T/T, Western Union, Paypal L/C, T/T, D/P, Western Union, Paypal, Money Gram T/T, Western Union, Paypal L/C, T/T, D/P, Western Union, Paypal, Money Gram T/T, Western Union, Paypal
Quality Control
Product Certification RoHS, ISO, UL RoHS, ISO, CE, ISO13485,RoHS RoHS, CCC, ISO RoHS, CCC, ISO RoHS, CCC, ISO
Management System Certification ISO 9001, ISO 14001, IATF16949 ISO 9001, ISO 9000, IATF16949 ISO 9001, ISO 14001, IATF16949, ISO 13485 - ISO 9001, ISO 14001, IATF16949, ISO 13485
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe - - -
Annual Export Revenue - Above US$100 Million Above US$100 Million - Above US$100 Million
Business Model OEM, ODM OEM, ODM, Customized OEM, ODM - OEM, ODM
Average Lead Time Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: one month
- - -
Product Attributes
Specification
Metal Coating: Tin;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Board Material: Fr4;
Board Layer: 2;
Board Thickness: 1.6mm;
Copper Thickness: 1 Oz;
Min. Line Width/Space: 0.1mm;
Min. Hole Size: 0.2mm;
Solder Mask: Green/Blue/Red;
Silkscreen: White/ Black;
Surface Finishing: HASL-Lf;
Lead Time: 8-10 Working Days;
Metal Coating: According to Customer Needs;
Mode of Production: SMT, DIP, Tht;
Layers: Single-Layer, Double-Layer, Multilayer;
Base Material: According to Customer Needs;
Customized: Customized;
Condition: New;
Layer Counts: 2-50 Layers;
Components Size: SMT 01005 to 100mmx80mm;
Minimum Width/Space of Qfp: 0.15mm/0.3mm;
Minimum Diameter /Space of BGA: 0.2mm/0.35mm;
Maximum Part's High: 18mm;
Maximum Part Weight: 30g;
PCB Size: 50mmx 50mm~450mmx 406mm;
PCB Thickness: 0.5mm~4. 5mm;
Placer Speed: 8,0000 Chips/Hour;
Feeders Number: 140 Piece of 8 mm Reel Feeders,28 of IC Tray Feede;
PCB Material: Fr4, High Tg Fr4,Halogen Free Material,Cem-3,etc;
Solder Mask Color: Green, Red, Black, Blue, White, Yellow, Matt, etc.;
Certificate: ISO13485, ISO9001, Ts , CQC, RoHS,CE;
Service: One-Stop Service;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Shape: DIP;
Conductive Type: Bipolar Integrated Circuit;
Integration: Gsi;
Technics: Semiconductor IC;
D/C: Standard;
Warranty: 2 Years;
Mounting Type: Standard, SMT, DIP;
Cross Reference: Standard;
Memory Type: Standard;
Metal Coating: Enig / HASL / OSP / Silver etc.;
Mode of Production: SMT / DIP / PCB Manufacturing;
Layers: From 2 Layers to 50 Layers;
Base Material: Fr4/ High Tg Fr4/ Metal Core / Cem;
Customized: Customized;
Condition: New;
Solder Mask Color: Green,Blue,Yellow,White,Black,Red;
Special Process: Buried Hole, Blind Hole, Partial High Density, Bac;
Copper Thickness: 1/2oz,1oz,2oz,3oz,4oz,5oz-10 Oz;
Layer Count: 1-50 Layers;
Quality Standard: Ipc Class 2 and Ipc Class 3;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Shape: DIP;
Conductive Type: Bipolar Integrated Circuit;
Integration: Gsi;
Technics: Semiconductor IC;
D/C: Standard;
Warranty: 2 Years;
Mounting Type: Standard, SMT, DIP;
Cross Reference: Standard;
Memory Type: Standard;
Supplier Name

Fastline Circuits Co., Limited

Diamond Member Audited Supplier

Shijiazhuang OurPCB Tech. Ltd.

Diamond Member Audited Supplier

Mu Star (shenzhen) Industry Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Core Hecheng Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Mu Star (shenzhen) Industry Co., Ltd.

Diamond Member Audited Supplier