| Specification |
Metal Coating: Tin;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Board Material: Fr4;
Board Layer: 2;
Board Thickness: 1.6mm;
Copper Thickness: 1 Oz;
Min. Line Width/Space: 0.1mm;
Min. Hole Size: 0.2mm;
Solder Mask: Green/Blue/Red;
Silkscreen: White/ Black;
Surface Finishing: HASL-Lf;
Lead Time: 8-10 Working Days;
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Metal Coating: Gold;
Mode of Production: SMT+DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Certificate: ISO9001, ISO14001, IATF 16949, Ipc-a-610g, RoHS;
PCB Material: Fr-4, Cem-1, Cem-3, Hight Tg, Fr4 Halogen Free;
PCB Shape: Rectangular, Round, Slots, Cutouts, Complex;
Solder Mask: Green/Black/White/Red/Blue/Yellow/Purple..etc;
Board Thickness: 0.2-8.0mm;
Copper Thickness: 18um-3500um(0.5- 100oz);
Service: PCB/Componentssourcing/Assembly/Test/Package;
PCBA QA: Full Test Include Aoi, in-Circuit Test (Ict);
Layer: 1-36 Layers;
Max. PCB Size: 1900mm*600mm;
Profiling Punching: Routing, V-Cut, Beveling;
Surface Finishing: HASL/HASL Lead Free, Chemical Tin, Chemical Gold;
PCB Type: Rigid PCB, HDI PCB, Flexible PCB, Rigid-Flexible;
Test: X-ray, Aoi, in-Circuit Test (Ict), Functional Test;
PCBA Packaging: ESD Packaging, Shockproof Packaging, Anti-Drop;
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Metal Coating: Gold;
Mode of Production: SMT+DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Certificate: ISO9001, ISO14001, IATF 16949, Ipc-a-610g, RoHS;
PCB Material: Fr-4, Cem-1, Cem-3, Hight Tg, Fr4 Halogen Free;
PCB Shape: Rectangular, Round, Slots, Cutouts, Complex;
Solder Mask: Green/Black/White/Red/Blue/Yellow/Purple..etc;
Board Thickness: 0.2-8.0mm;
Copper Thickness: 18um-3500um(0.5- 100oz);
Service: PCB/Componentssourcing/Assembly/Test/Package;
PCBA QA: Full Test Include Aoi, in-Circuit Test (Ict);
Layer: 1-36 Layers;
Max. PCB Size: 1900mm*600mm;
Profiling Punching: Routing, V-Cut, Beveling;
Surface Finishing: HASL/HASL Lead Free, Chemical Tin, Chemical Gold;
PCB Type: Rigid PCB, HDI PCB, Flexible PCB, Rigid-Flexible;
Test: X-ray, Aoi, in-Circuit Test (Ict), Functional Test;
PCBA Packaging: ESD Packaging, Shockproof Packaging, Anti-Drop;
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Metal Coating: Gold;
Mode of Production: SMT+DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Certificate: ISO9001, ISO14001, IATF 16949, Ipc-a-610g, RoHS;
PCB Material: Fr-4, Cem-1, Cem-3, Hight Tg, Fr4 Halogen Free;
PCB Shape: Rectangular, Round, Slots, Cutouts, Complex;
Solder Mask: Green/Black/White/Red/Blue/Yellow/Purple..etc;
Board Thickness: 0.2-8.0mm;
Copper Thickness: 18um-3500um(0.5- 100oz);
Service: PCB/Componentssourcing/Assembly/Test/Package;
PCBA QA: Full Test Include Aoi, in-Circuit Test (Ict);
Layer: 1-36 Layers;
Max. PCB Size: 1900mm*600mm;
Profiling Punching: Routing, V-Cut, Beveling;
Surface Finishing: HASL/HASL Lead Free, Chemical Tin, Chemical Gold;
PCB Type: Rigid PCB, HDI PCB, Flexible PCB, Rigid-Flexible;
Test: X-ray, Aoi, in-Circuit Test (Ict), Functional Test;
PCBA Packaging: ESD Packaging, Shockproof Packaging, Anti-Drop;
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Metal Coating: Copper/ Tin/ Gold/Silver;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Basic Material: Aluminum;
PCBA Testing: X-ray, Aoi Test, Function Test;
PCBA Min. BGA Pitch: 0.2mm;
Certificate: RoHS, UL / ISO9001, ISO13485, IATF16949;
Processing Technology: Electrolytic Foil;
Other Service: ODM, OEM, Final Product Assembling;
Insulation Materials: Organic Resin;
Application: Consumer Electronics, Communications, Aerospace;
PCB Surface Treatment: HASL Lead Free, OPS, Immersion Tin/Gold, etc;
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