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US$0.37-0.57 / Piece

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Bluetooth Speaker Circuit Board Prototype PCB Assembly pictures & photos

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What is Bluetooth Speaker Circuit Board Prototype PCB Assembly

Name: Bluetooth Speaker Circuit Board Prototype PCB Assembly
Uploaded: 2024-08-06T13:52:12+08:00
Description: Bluetooth Speaker Circuit Board Prototype PCB Assembly Fastline could produce 1-26 layers PCB board for electronic products. providing PCB design, PCB fabrication,PCB clone and PCB assembly services.

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About this Item

Price

Purchase Qty. Reference FOB Price

1-999 Pieces US$0.57

1,000-1,999 Pieces US$0.46

2,000-9,999 Pieces US$0.43

10,000+ Pieces US$0.37

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Consumer Electronics
Flame Retardant Properties V2
Mechanical Rigid Rigid
Processing Technology Delay Pressure Foil
Base Material Copper
Insulation Materials Epoxy Resin
Transport Package Vacuum+Carton Packing
Specification RoHS, ISO9001, UL, SGS
Trademark FL
Origin Shenzhen, China
Conductive Type Unipolar Integrated Circuit
Integration Ulsi
Technics Thick Film IC
Regular Board Thickness 1.6mm
Board Material Fr4, Bt HDI Material
Board Layer 4 Layers
Surface Finihsing HASL-Lf, Enig, Immersion Gold, Immersion Tin, OSP
Copper Thickness 1 Oz
Thickness of Copper Foil Wire 8-240 Um(4oz)
Min. Hole Size 0.075mm(3mil)
Min Pad +/- 0.1mm (4mil)
Min Board Thickness 0.1mm Only for Single and Double Sided
Min. Line Width/Space 0.05mm (2mil)
Outline Machining Accuracy +/- 0.1mm (4mil)
Lead Time 6-8 Working Days
Silksreen Any You Like
Solder Mask Any You Like
MOQ 1PCS
Shape Flat

Product Description

Bluetooth Speaker Circuit Board Prototype PCB Assembly Fastline could produce 1-26 layers PCB board for electronic products. providing PCB design, PCB fabrication,PCB clone and PCB assembly services. and we have got the UL, ISO, SGS certifications. Pls see our pcb catalog below: 1. single ...

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Fastline Circuits Co., Limited

Diamond Member Since 2013

Audited Supplier

Business Type Trading Company
Main Products Print Circuit Board, Aluminum PCB, Flexible PCB, Rigid PCB, PCB Prototype
Number of Employees 15
Year of Establishment 2006-09-21
Management System Certification ISO9001:2015, ISO14001:2015, IATF16949
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

PCB Comparison

	Bluetooth Speaker Circuit Board Prototype PCB Assembly Contact Now	Professional High Quality PCB Assembly, Components Sourcing, Contract Manufacturing Contact Now	Quick View Gerber OEM Manufacturer Electronic Circuit Board PCB Assembly PCBA Contact Now	Quick View Shenzhen Rigid HDI High Volume VIP Printed Circuit Board Aerospare High Density Interconnect PCB Contact Now	PCB Assembly PCBA Contract Manufacturing One Stop Service Contact Now

Transaction Info
	Bluetooth Speaker Circuit Board Prototype PCB Assembly Contact Now	Professional High Quality PCB Assembly, Components Sourcing, Contract Manufacturing Contact Now	Quick View Gerber OEM Manufacturer Electronic Circuit Board PCB Assembly PCBA Contact Now	Quick View Shenzhen Rigid HDI High Volume VIP Printed Circuit Board Aerospare High Density Interconnect PCB Contact Now	PCB Assembly PCBA Contract Manufacturing One Stop Service Contact Now
Price	US $ 0.37-0.57/ Piece	US $ 8/ Piece	US $ 0.03-10.00/ Piece	US $ 0.0001-99.00/ Piece	US $ 8/ Piece
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Payment Terms	L/C, T/T, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal, Money Gram	T/T, D/P, Western Union, Paypal	T/T, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal, Money Gram
Quality Control
Management System Certification	ISO 9001, ISO 14001, IATF16949	ISO 9001, IATF16949	ISO 9001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, IATF16949
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	US$2.5 Million - US$5 Million	US$1 Million - US$2.5 Million	US$50 Million - US$100 Million	US$2.5 Million - US$5 Million
Business Model	OEM, ODM	OEM, ODM	OEM, ODM	OEM	OEM, ODM
Average Lead Time	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	-	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Delay Pressure Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Conductive Type: Unipolar Integrated Circuit; Integration: Ulsi; Technics: Thick Film IC; Regular Board Thickness: 1.6mm; Board Material: Fr4, Bt HDI Material; Board Layer: 4 Layers; Surface Finihsing: HASL-Lf, Enig, Immersion Gold, Immersion Tin, OSP; Copper Thickness: 1 Oz; Thickness of Copper Foil Wire: 8-240 Um(4oz); Min. Hole Size: 0.075mm(3mil); Min Pad: +/- 0.1mm (4mil); Min Board Thickness: 0.1mm Only for Single and Double Sided; Min. Line Width/Space: 0.05mm (2mil); Outline Machining Accuracy: +/- 0.1mm (4mil); Lead Time: 6-8 Working Days; Silksreen: Any You Like; Solder Mask: Any You Like; MOQ: 1PCS; Shape: Flat;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Organic Resin;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Consumer Electronics; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: New Chip; Capacity: 1000000; OEM/ODM: Available; Sample: Available; Surface Treatment: OSP, Enig, HASL, AG Immersion; Certificate Gurantee: Yes; Test: 100%E-Testing; Min Bonding Pad Diameter: 10mil; Min Thickness of Soldermask: 10um; Color of Silk-Screen: White, Yellow, Black; Data File Format: Gerber File and Drilling File; Material for PCB: Fr-4, High Tg Fr$, Halogen Free; Layer Count: 1-20 Layers; Shipping: DHL/UPS/FedEx/Air/Sea;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Abis; Layers: 6 Layers; Solder Mask: Green; Legend: Write; Surface Finish: Enig (2u''); Thickness: 1.6mm;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Organic Resin;
Supplier Name	Fastline Circuits Co., Limited	Shenzhen Jia Cheng Electric Co., Ltd.	Shenzhen New Chip international Ltd	Abis Circuits Co., Ltd.	Shenzhen Jia Cheng Electric Co., Ltd.
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