Prefessional Contract Printed Circuit Board Assemble PCB Assembly PCBA Manufacturing pictures & photos

Prefessional Contract Printed Circuit Board Assemble PCB Assembly PCBA Manufacturing

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Price

Min. Order Reference FOB Price

1 Piece US$0.21 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Communication
Flame Retardant Properties V1
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Fr4
Insulation Materials Epoxy Resin
Brand Fastline
Transport Package Vacuum+Carton Packing
Specification RoHS, ISO9001, UL, SGS
Trademark Fastline
Origin Shenzhen, China
Board Thickness 1.6mm
Copper Thickness 1oz
Material Type Fr4
Surface Treatment HASL Lead Free
Solder Mask Green, Red, Blue, Black
Silk Screen Color White
Board Layer 1-50
Shipping Type DHL, UPS, TNT, EMS, FedEx etc
Packing Type Carton + Vacumm
Lead Time 5-7 Days

Product Description

Product Description Parameter &Data Sheet Size of PCBA 95 X 98mm Number of Layers 4 Board Type PCBA Board Thickness 1.6mm Board Material FR-4 1.6mm Board Material Supplier Shengyi Tg Value of Board Material 60ºC PTH Cu thickness ≥20 µm Inner Iayer Cu ...

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Fastline Circuits Co., Limited

Diamond Member Since 2013

Audited Supplier

Business Type Trading Company
Main Products Print Circuit Board, Aluminum PCB, Flexible PCB, Rigid PCB, PCB Prototype
Number of Employees 15
Year of Establishment 2006-09-21
Management System Certification ISO9001:2015, ISO14001:2015, IATF16949
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

PCB Assembly Comparison

	Prefessional Contract Printed Circuit Board Assemble PCB Assembly PCBA Manufacturing Contact Now	Quick View Multi Layers Electronics PCB Printed Circuits Board Made of Fr4 Tg150 with 2 U" Enig in Blue Ink Contact Now	Quick View Air Conditioning PCB Board Circuit Board with UL, SGS, ISO Certificates Contact Now	Quick View Fr4 Substrate 4oz Copper Custom Design PCB Manufacturing Service Contact Now	Quick View Enig Fr4 High Tg Multilayer PCB Boards, HDI Printed Circuit Board Contact Now

Transaction Info
	Prefessional Contract Printed Circuit Board Assemble PCB Assembly PCBA Manufacturing Contact Now	Quick View Multi Layers Electronics PCB Printed Circuits Board Made of Fr4 Tg150 with 2 U" Enig in Blue Ink Contact Now	Quick View Air Conditioning PCB Board Circuit Board with UL, SGS, ISO Certificates Contact Now	Quick View Fr4 Substrate 4oz Copper Custom Design PCB Manufacturing Service Contact Now	Quick View Enig Fr4 High Tg Multilayer PCB Boards, HDI Printed Circuit Board Contact Now
Price	US $ 0.21/ Piece	US $ 0.01-100.00/ Piece	US $ 0.01-150.00/ Piece	US $ 0.10-80.00/ Piece	US $ 0.10-10.00/ Piece
Min Order	1 Pieces	1 Pieces	1 Pieces	1 Pieces	1 Pieces
Payment Terms	L/C, T/T, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal, Money Gram, 30 days net	T/T, Western Union, Paypal	L/C, T/T, D/P, Western Union, Paypal, Money Gram	L/C, T/T, Western Union, Paypal, 30 days net
Quality Control
Product Certification	-	-	-	UL, ISO9001&ISO14001, SGS, RoHS, Ts16949	-
Management System Certification	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949	ISO 9001, ISO 14001, IATF16949
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	US$50 Million - US$100 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million	US$50 Million - US$100 Million
Business Model	OEM, ODM	OEM	OEM	OEM	OEM
Average Lead Time	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays	Off Season Lead Time: within 15 workdays Peak Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Communication; Flame Retardant Properties: V1; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Fr4; Insulation Materials: Epoxy Resin; Brand: Fastline; Board Thickness: 1.6mm; Copper Thickness: 1oz; Material Type: Fr4; Surface Treatment: HASL Lead Free; Solder Mask: Green, Red, Blue, Black; Silk Screen Color: White; Board Layer: 1-50; Shipping Type: DHL, UPS, TNT, EMS, FedEx etc; Packing Type: Carton + Vacumm; Lead Time: 5-7 Days;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Abis; Layers: 6; Board Thickness: 1.6mm; Raw Material: Fr4 Tg150; Panel up: 1010;* Surface Finish: Immersion Gold; Legend: White; Inner Copper: 35um; Outer Copper: 70um;	Type: Rigid Circuit Board; Dielectric: FR-4; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Kb; Cooper Thickness: 1oz; Surface Finishing: Immersion Gold; Solder Mask Color: Green; Silkscreen: White; Min Line Width/Space: 0.2mm/0.2mm; Min Hole Diameter: 0.2mm; Finished Board Thickness: 1.6 mm; Layer: 6 Layer;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Kb; Insulation Materials: Epoxy Resin; Brand: Abis; Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole; Board Thickness: 0.2-8mm; Copper Thickness: 0.5-10oz; Layers: 1-32layers; Enig Thickness: 1-3u''; Hard Gold Thickness: 5-50u'';	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Abis; Board Thickness: 1.6mm; Copper Thickness: 35um; Surface Finish: HASL & Carbon Ink; Solder Mask: Green; Legend: White;
Supplier Name	Fastline Circuits Co., Limited	Abis Circuits Co., Ltd.	Abis Circuits Co., Ltd.	Abis Circuits Co., Ltd.	Abis Circuits Co., Ltd.
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