PCB Substrate Fr4
US$0.60-0.90 / Piece
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What is PCB Substrate Fr4 PCB Fr4 Inverter PCB Board Fr4 Tg130 PCB

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-999 Pieces US$0.90

1,000-1,999 Pieces US$0.82

2,000-9,999,999 Pieces US$0.71

10,000,000+ Pieces US$0.60

Sepcifications

  • Structure Multilayer Rigid PCB
  • Dielectric FR-4
  • Material Polyester Glass Fiber Mat Laminate
  • Application Communication
  • Flame Retardant Properties V0
  • Processing Technology Electrolytic Foil
  • Production Process Subtractive Process
  • Base Material Fr4
  • Insulation Materials Epoxy Resin
  • Brand Ca
  • Transport Package Vacuum+Carton Packing
  • Specification RoHS, ISO9001, UL, SGS
  • Trademark FL
  • Origin Shenzhen, China
  • Board Thickness 1.6mm
  • Board Layer 2 Layers
  • Copper Thickness 1 Oz
  • Solder Mask Blue
  • Silksreen White
  • Min Pad +/- 0.1mm (4mil)
  • Surface Finihsing HASL-Lf
  • Lead Time 6-8 Working Days
  • Shipping Type DHL, UPS, TNT, EMS, FedEx etc
  • Packing Type Carton + Vacuum
  • Test Fly Probe Testing
  • Min Board Thickness 0.1mm Only for Single and Double Sided
  • Min. Line Width/Space 0.05mm (2mil)
  • Outline Machining Accuracy +/- 0.1mm (4mil)
  • MOQ 1 PCS

Product Description

PCB Substrate Fr4 PCB Fr4 Inverter PCB Board Fr4/ Tg130 PCB Fastline could produce 1-26 layers PCB board for electronic products, providing PCB design, PCB fabrication, PCB clone, and PCB assembly services. and we have got the UL, ISO, SGS certifications. Pls see our pcb catalog below: 1. ...

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PCB Substrate Fr4 Comparison
Transaction Info
Price US $ 0.60-0.90/ Piece US $ 0.10-10.00/ Piece US $ 0.10-10.00/ Piece US $ 0.10-10.00/ Piece US $ 0.10-10.00/ Piece
Min Order 1 Pieces 1 Pieces 1 Pieces 1 Pieces 1 Pieces
Trade Terms - - - - -
Payment Terms L/C, T/T, Western Union, Paypal T/T, Western Union, Paypal, XT T/T, Western Union, Paypal, XT T/T, Western Union, Paypal, XT T/T, Western Union, Paypal, XT
Quality Control
Product Certification - ISO9001, UL ISO9001, UL ISO9001, UL ISO9001, UL
Management System Certification ISO 9001, ISO 14001, IATF16949 - - - -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model OEM, ODM OEM, ODM, Own Brand OEM, ODM, Own Brand OEM, ODM, Own Brand OEM, ODM, Own Brand
Average Lead Time Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Off-season: within 15 Day(s)
Peak-season: within 15 Day(s)
Product Attributes
Specification
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Brand: Ca;
Board Thickness: 1.6mm;
Board Layer: 2 Layers;
Copper Thickness: 1 Oz;
Solder Mask: Blue;
Silksreen: White;
Min Pad: +/- 0.1mm (4mil);
Surface Finihsing: HASL-Lf;
Lead Time: 6-8 Working Days;
Shipping Type: DHL, UPS, TNT, EMS, FedEx etc;
Packing Type: Carton + Vacuum;
Test: Fly Probe Testing;
Min Board Thickness: 0.1mm Only for Single and Double Sided;
Min. Line Width/Space: 0.05mm (2mil);
Outline Machining Accuracy: +/- 0.1mm (4mil);
MOQ: 1 PCS;
Structure: Metal Base Rigid PCB;
Dielectric: Aluminum;
Material: Metal;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Brand: Kxpcba;
Layer Quantity: 1-4;
PCB Size: 300*1200mm;
Thermal Conductivity (ω/M-K): 1-12W/Mk;
Board Thickness: 0.8-6mm;
Min Tracing/Spacing: 4mil / 4mil;
Pth Size: Min 0.2mm;
Npth Size: Min 0.8mm;
Copper Thickness: 1-5oz;
Solder Mask: Any;
Surface Finish: HASL, OSP, Enig, Hard Gold, Enepig;
Countersinks, Castellated Holes: Yes;
Structure: Metal Base Rigid PCB;
Dielectric: Aluminum;
Material: Metal;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Brand: Kxpcba;
Layer Quantity: 1-4;
PCB Size: 300*1200mm;
Thermal Conductivity (ω/M-K): 1-12W/Mk;
Board Thickness: 0.8-6mm;
Min Tracing/Spacing: 4mil / 4mil;
Pth Size: Min 0.2mm;
Npth Size: Min 0.8mm;
Copper Thickness: 1-5oz;
Solder Mask: Any;
Surface Finish: HASL, OSP, Enig, Hard Gold, Enepig;
Countersinks, Castellated Holes: Yes;
Structure: Metal Base Rigid PCB;
Dielectric: Aluminum;
Material: Metal;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Brand: Kxpcba;
Layer Quantity: 1-4;
PCB Size: 300*1200mm;
Thermal Conductivity (ω/M-K): 1-12W/Mk;
Board Thickness: 0.8-6mm;
Min Tracing/Spacing: 4mil / 4mil;
Pth Size: Min 0.2mm;
Npth Size: Min 0.8mm;
Copper Thickness: 1-5oz;
Solder Mask: Any;
Surface Finish: HASL, OSP, Enig, Hard Gold, Enepig;
Countersinks, Castellated Holes: Yes;
Structure: Metal Base Rigid PCB;
Dielectric: Aluminum;
Material: Metal;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Brand: Kxpcba;
Layer Quantity: 1-4;
PCB Size: 300*1200mm;
Thermal Conductivity (ω/M-K): 1-12W/Mk;
Board Thickness: 0.8-6mm;
Min Tracing/Spacing: 4mil / 4mil;
Pth Size: Min 0.2mm;
Npth Size: Min 0.8mm;
Copper Thickness: 1-5oz;
Solder Mask: Any;
Surface Finish: HASL, OSP, Enig, Hard Gold, Enepig;
Countersinks, Castellated Holes: Yes;
Supplier Name

Fastline Circuits Co., Limited

China Supplier - Gold Member Audited Supplier

Shenzhen Jinxiong Electronic Co., Ltd

China Supplier - Gold Member Audited Supplier

Shenzhen Jinxiong Electronic Co., Ltd

China Supplier - Gold Member Audited Supplier

Shenzhen Jinxiong Electronic Co., Ltd

China Supplier - Gold Member Audited Supplier

Shenzhen Jinxiong Electronic Co., Ltd

China Supplier - Gold Member Audited Supplier